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Analog Devices Inc./Maxim Integrated MAX13103EEBX
- Part No.:
- MAX13103EEBX
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13103EEBX.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 36UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:812
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Product details
Overview
MAX13103EEBX from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator enabling voltage translation between VL (1.2V–VCC) and VCC (1.65V–5.5V) domains without direction control. It supports up to 20Mbps data rate, features ±15kV HBM ESD protection on I/O VCC pins, and includes an enable input (EN) that reduces supply currents to <1µA (VCC) and <2µA (VL) in shutdown. It is used in portable electronics for interfacing low-voltage ASICs/PLDs with higher-voltage system buses.
For engineers reviewing the MAX13103EEBX datasheet, MAX13103EEBX pinout, MAX13103EEBX application, or MAX13103EEBX equivalent, key selection considerations include its bidirectional operation without direction pin, tri-state behavior during shutdown (I/O VCC and I/O VL both high-impedance), UCSP-36 package footprint, 20Mbps throughput capability, and compatibility with mixed-voltage I²C, SPI, and GPIO interconnects in space-constrained designs.
Technical Context
The MAX13103EEBX implements a one-shot accelerator output stage that dynamically activates during signal transitions to reduce rise/fall times-achieving ≤15ns tR/tF at 50pF load on VCC side and ≤15ns on VL side. Its architecture inherently supports bidirectional level shifting by sensing voltage thresholds (VIHL = 2/3×VL, VIHC = 2/3×VCC) and driving complementary outputs without external direction logic.
During shutdown (EN = GND), all 16 I/O VCC and I/O VL terminals enter high-impedance state-unlike MAX13101E (VCC pulled down) or MAX13102E (VL pulled down). This full tri-state behavior isolates both sides of the interface, preventing bus contention in power-gated subsystems common in battery-powered portable equipment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | +1.65V to +5.5V - supports interface between 1.8V/2.5V/3.3V/5V system rails and low-VL logic. |
| VL Range | +1.2V to VCC - enables translation from sub-1.8V ASICs (e.g., 1.2V FPGA I/O) to any higher VCC rail. |
| Max Data Rate | 20Mbps - sufficient for high-speed SPI, fast-mode-plus I²C, and parallel GPIO burst transfers. |
| ESD Protection | ±15kV HBM on I/O VCC pins - eliminates need for external TVS diodes in handheld device USB/SDIO interfaces. |
| Shutdown Current | <1µA VCC / <2µA VL - enables ultra-low-power sleep modes in always-on sensor hubs and wearable controllers. |
| Propagation Delay | 20ns max (VCC↔VL) - ensures timing closure in synchronous 20MHz clock domains with ≤5ns channel skew. |
| Supply Current (Active) | 0.03µA typical - near-zero static power enables integration into battery-backed real-time clock subsystems. |
Pinout & Package
The MAX13103EEBX is packaged in a 36-bump UCSP (3.06mm × 3.06mm, 0.5mm pitch) with exposed paddle connected to GND. All I/O pins are arranged in two banks: 16 I/O VL_ (VL-referenced) and 16 I/O VCC_ (VCC-referenced), plus dedicated EN, VL, VCC, and GND connections.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 21, 30) | Ground reference | Common return path for both VL and VCC supplies; exposed paddle must be soldered to PCB ground plane for thermal and ESD performance. |
| VL (Pins 15, 36) | Low-voltage logic supply | Defines input/output threshold (VIHL/VILL) and drives VL-side I/O; requires 0.1µF bypass capacitor to GND. |
| VCC (Pins 16, 35) | High-voltage logic supply | Sets VCC-side thresholds (VIHC/VILC); 1.0µF ceramic cap required for full ±15kV ESD robustness. |
| EN (Pin 10) | Global enable control | Active-high (driven to VL or VCC); pulls low to place all 32 I/Os in high-impedance state and minimize quiescent current. |
| I/O VL1–I/O VL16 | VL-referenced bidirectional I/O | Accept 1.2V–VCC logic; drive VL-compatible signals; internally terminated only during shutdown in other variants (not MAX13103E). |
| I/O VCC1–I/O VCC16 | VCC-referenced bidirectional I/O | Output 1.65V–5.5V logic levels; tolerate up to VCC+0.3V; protected by ±15kV HBM ESD structures. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates PCB routing for DIR signal and firmware overhead in microcontroller GPIO expansion. |
| Full tri-state shutdown (both sides) | Prevents back-driving and bus contention when VL or VCC domains are powered down independently. |
| One-shot accelerator output stage | Reduces capacitive loading impact-enables 20Mbps operation even with 50pF trace + connector capacitance. |
| ±15kV HBM ESD on I/O VCC | Meets IEC 61000-4-2 Level 4 for handheld device front-panel interfaces without external protection. |
| UCSP-36 package (3.06mm × 3.06mm) | Reduces board area by >60% vs. TQFN-40; compatible with standard 0.5mm-pitch reflow processes. |
Applications
| Smartphone Baseband–Application Processor Interface | Digital Still Camera Sensor Hub |
|---|---|
Use Scenario: Interfacing 1.2V MIPI D-PHY transmitter in baseband SoC with 1.8V application processor GPIOs. IC Role / Device Role / Timing Role: Bidirectional level shifter for control/status lines (RESET, INT, I²C) with no direction arbitration logic. Use Value: Enables direct connection without voltage dividers or discrete MOSFET translators-reducing BOM count and layout complexity in tight RF zones. | Use Scenario: Connecting 1.5V image sensor I/O to 3.3V camera ISP's parallel data bus during burst capture. IC Role / Device Role / Timing Role: 16-channel translator ensuring setup/hold timing compliance at 20Mbps pixel clock rates. Use Value: Guarantees ≤20ns propagation delay and ≤5ns channel skew-preserving pixel data integrity across all 16 data lanes. |
| Wearable Fitness Tracker Sensor Subsystem | Industrial Handheld Terminal Display Interface |
Use Scenario: Isolating 1.8V accelerometer/magnetometer I²C bus from 3.3V MCU during deep-sleep mode. IC Role / Device Role / Timing Role: Enable-controlled translator entering full tri-state on both sides to eliminate leakage paths. Use Value: Cuts subsystem standby current to <1µA-extending battery life beyond 7 days on coin-cell power. | Use Scenario: Driving 5V display controller inputs from 1.8V ARM Cortex-M4 GPIO bank. IC Role / Device Role / Timing Role: Robust level shifter with ±15kV HBM protection for ESD-prone touchscreen ribbon cable connections. Use Value: Replaces discrete transistor arrays and TVS diodes-reducing component count by 12 and improving field reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional logic-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108PWR | 8-channel, auto-direction sensing, 3.6V max VCC, no EN pin, 1.2V–3.6V VL range | Limited to lower voltage systems; lacks dedicated enable for coordinated power-down sequencing | Select when only 8 channels needed and system uses automatic direction detection instead of explicit EN control. |
| SN74AVC16T245DGGR | 16-channel, direction-controlled (DIR pin required), 3.6V max VCC, 1.2V–3.6V VL, no integrated ESD | Requires external ±15kV ESD protection; adds PCB routing and firmware logic for DIR management | Select when strict pin-to-pin compatibility with legacy TI-based designs is required and ESD protection is added externally. |
Compared with TXB0108PWR and SN74AVC16T245DGGR, the MAX13103EEBX provides full 16-channel bidirectional translation with integrated EN control and factory-tested ±15kV HBM-reducing design validation effort for portable equipment requiring guaranteed ESD immunity and coordinated low-power states.
Availability
MAX13103EEBX is available at Aetrix Electronics and suitable for smartphone baseband interfaces, wearable sensor hubs, digital camera sensor links, and industrial handheld display controllers requiring stable component supply and long-term production support.
Supply support for MAX13103EEBX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, medical, and portable applications.
The MAX1310x family was engineered specifically for multivoltage system interoperability in space-constrained portable electronics-delivering robust bidirectional level translation with minimal external components and guaranteed ESD resilience.
FAQ
What is the maximum capacitive load the MAX13103EEBX can drive at 20Mbps?
The MAX13103EEBX maintains 20Mbps operation with ≤50pF load on the VCC side and ≤15pF on the VL side, as verified in timing characterization (Figures 1a/2a). Rise/fall times remain ≤15ns under these conditions due to its one-shot accelerator stage. Exceeding these loads degrades timing margin and may require reducing data rate or adding series termination.
Does the MAX13103EEBX require external pull-up resistors on I/O lines?
No, the MAX13103EEBX does not require external pull-ups for normal bidirectional operation. Its internal accelerator stage actively drives both high and low transitions. Pull-ups are only needed if specific bus protocols (e.g., open-drain I²C) mandate them-and those must be placed on the VL or VCC side per protocol voltage requirements, not on the translator itself.
How does the shutdown behavior of MAX13103EEBX differ from MAX13101EEBX and MAX13102EEBX?
In shutdown (EN = GND), the MAX13103EEBX places all 32 I/Os (16 VL + 16 VCC) in high-impedance state. In contrast, MAX13101EEBX pulls I/O VCC_ to GND via 6kΩ resistors while tri-stating I/O VL_, and MAX13102EEBX does the inverse. This full tri-state makes MAX13103EEBX ideal for systems where neither side should source/sink current during sleep.
Can the MAX13103EEBX translate between 1.2V and 5.5V logic levels reliably?
Yes-the MAX13103EEBX supports VL as low as +1.2V and VCC as high as +5.5V simultaneously. Electrical characteristics (VOHC = VCC – 0.4V, VOLC = 0.4V) and input thresholds (VIHC = 2/3×VCC, VIHL = 2/3×VL) are guaranteed across this full range, enabling direct interface between sub-1.8V process nodes and legacy 5V peripherals without intermediate buffers.
Is the UCSP-36 package of MAX13103EEBX compatible with standard reflow profiles?
Yes-the MAX13103EEBX UCSP-36 package (3.06mm × 3.06mm, 0.5mm pitch) is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports standard lead-free reflow profiles (peak 260°C, 60s above 217°C). The exposed paddle must be soldered to a thermally robust GND pad per Maxim's layout guidelines to ensure reliability and ESD performance.
MAX13103EEBX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 16
- Voltage - VCCA:
- 1.1 V ~ 1.65 V
- Voltage - VCCB:
- 1.2 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 20Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-WFBGA, CSPBGA
MAX13103EEBX FAQ
1.How can I place an order for MAX13103EEBX through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13103EEBX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13103EEBX reliable?
The price and inventory of MAX13103EEBX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13103EEBX is usually 5 days.
3.What payment methods are accepted for MAX13103EEBX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13103EEBX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13103EEBX?
MAX13103EEBX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13103EEBX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13103EEBX?
For technical support, including MAX13103EEBX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13103EEBX requirements.
6.How does Aetrix verify that MAX13103EEBX is sourced from the original manufacturer or authorized distributors?
All MAX13103EEBX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13103EEBX meets industry standards.
7.What is the process for return or replacement of MAX13103EEBX?
All MAX13103EEBX units undergo pre-shipment inspection (PSI). If there is an issue with MAX13103EEBX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13103EEBX part is unused and in its original packaging.
Return procedure for MAX13103EEBX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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