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Analog Devices Inc./Maxim Integrated MAX13103EEBX-T
- Part No.:
- MAX13103EEBX-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13103EEBX-T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 36UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
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Product details
Overview
The MAX13103EEBX-T from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator enabling voltage translation between VL (1.2V–VCC) and VCC (1.65V–5.5V) domains without direction control. It features an enable input (EN), ±15kV HBM ESD protection on I/O VCC pins, 20Mbps data rate, and tri-state shutdown behavior with I/O VCC pulled to GND via 6kΩ resistors. It is used in portable electronics for interfacing low-voltage ASICs/PLDs with higher-voltage system buses.
For engineers reviewing the MAX13103EEBX-T datasheet, MAX13103EEBX-T pinout, MAX13103EEBX-T application, or MAX13103EEBX-T equivalent, key selection considerations include its bidirectional operation without direction pin, EN-controlled shutdown mode, I/O VCC-side ESD robustness, and compatibility with mixed-supply systems requiring level translation across 1.2V–5.5V rails.
Technical Context
The MAX13103EEBX-T implements a one-shot accelerator output stage that dynamically activates during signal transitions to reduce rise/fall times-achieving ≤15ns at 50pF load on VCC side and ≤15ns at 15pF on VL side. Its bidirectional architecture eliminates need for external direction control logic.
During shutdown (EN = GND), it places all 16 I/O VCC lines in high-impedance state with internal 6kΩ pulldown to GND, while all 16 I/O VL lines enter true tri-state. Supply currents drop to ≤1µA (VCC) and ≤2µA (VL), supporting ultra-low-power system sleep modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | +1.65V to +5.5V - supports interface between 1.8V/2.5V/3.3V/5V system rails and low-voltage logic. |
| VL Range | +1.2V to VCC - enables translation from sub-1.8V ASICs/PLDs (e.g., 1.2V, 1.5V) up to full VCC. |
| Max Data Rate | 20Mbps - guaranteed under 50pF load on VCC side and 15pF on VL side with ≤3ns driver edge. |
| ESD Protection | ±15kV HBM on I/O VCC pins - protects exposed signal paths in handheld/portable designs. |
| Shutdown Current | <1µA VCC / <2µA VL - enables battery-sensitive applications to minimize leakage during idle. |
| I/O VCC Shutdown State | Pulled to GND via 6kΩ resistor - ensures defined logic-low state on high-side bus when disabled. |
| Propagation Delay | 20ns max (VCC↔VL) - ensures timing predictability in synchronous data transfers at 20Mbps. |
Pinout & Package
The MAX13103EEBX-T is packaged in a 36-bump UCSP (3.06mm × 3.06mm, 0.5mm pitch) with exposed paddle connected to GND. Pin functions are validated per Maxim's official pin description table for MAX13103E.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 21, 30) | Ground reference | Common return path for both VL and VCC supplies; exposed paddle must be soldered to PCB ground plane. |
| VL (Pins 15, 36) | Low-voltage logic supply | Defines logic thresholds (VIHL/VILL = 2/3×VL, 1/3×VL) for VL-side I/O; bypass with 0.1µF ceramic capacitor. |
| VCC (Pins 16, 35) | High-voltage logic supply | Sets VCC-side thresholds (VIHC/VILC = 2/3×VCC, 1/3×VCC); requires 0.1µF + 1.0µF decoupling for ESD integrity. |
| EN (Pin 10) | Global enable control | Active-low shutdown: drives I/O VCC to GND (6kΩ) and places I/O VL in tri-state; pull high to VL or VCC for normal operation. |
| I/O VL1–I/O VL16 (Pins 2–9, 11–14, 37–40) | Bidirectional VL-referenced I/O | Translate signals between VL domain and VCC domain; no direction pin required; internally buffered. |
| I/O VCC1–I/O VCC16 (Pins 17–20, 22–34) | Bidirectional VCC-referenced I/O | Receive translated signals from VL side and drive VCC-side loads; support 20Mbps with <20ns propagation delay. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates external control logic and routing complexity in multivoltage SoC interconnects. |
| EN-controlled shutdown with defined I/O states | Guarantees I/O VCC pins are actively pulled low (6kΩ) while I/O VL floats safely in tri-state-prevents bus contention. |
| ±15kV HBM ESD on I/O VCC pins | Enables direct connection to connectors, buttons, or external interfaces in consumer handhelds without added TVS diodes. |
| One-shot accelerator output stage | Reduces signal transition time by injecting transient current during edges-enables 20Mbps with 15pF/50pF loads. |
| Wide VL-to-VCC supply flexibility | Supports 1.2V FPGA I/O driving 3.3V microcontroller peripherals or 1.8V sensor outputs feeding 5V display controllers. |
Applications
| Smartphone Baseband–Application Processor Interface | Digital Still Camera Sensor Interface |
|---|---|
Use Scenario: Connecting 1.2V MIPI D-PHY transmitter in baseband SoC to 1.8V application processor I/O. IC Role / Device Role / Timing Role: Bidirectional level shifter translating control/data signals between two asynchronous voltage domains with no direction control overhead. Use Value: Enables direct integration of low-power baseband logic with higher-voltage AP peripherals while maintaining 20Mbps timing margins and ESD-safe signal routing. | Use Scenario: Interfacing 1.5V CMOS image sensor output to 3.3V image signal processor (ISP) input in compact camera modules. IC Role / Device Role / Timing Role: 16-channel buffered translator ensuring clean, fast signal transfer across voltage boundary with minimal skew (<5ns channel-to-channel). Use Value: Preserves pixel clock integrity and reduces setup/hold violations in high-resolution sensor pipelines without adding direction logic or timing buffers. |
| Portable Medical Monitor Data Bus | Wearable Fitness Tracker Sensor Hub |
Use Scenario: Level-shifting SPI/I²C signals between 1.8V MCU and 3.3V analog front-end (AFE) in battery-powered patient monitors. IC Role / Device Role / Timing Role: Low-quiescent-current translator enabling MCU-initiated shutdown of AFE communication links during sleep cycles. Use Value: Reduces system standby current by >99% versus always-on translators, extending battery life without compromising wake-up latency. | Use Scenario: Translating GPIO and interrupt signals between 1.2V BLE SoC and 2.5V environmental sensor array in ultra-thin wearables. IC Role / Device Role / Timing Role: Compact UCSP-packaged translator providing ESD-hardened I/O for exposed sensor traces routed across flex PCBs. Use Value: Eliminates need for discrete ESD protection on each sensor line, saving board space and BOM cost in space-constrained wearable designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional logic-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108PWR | 8-channel, auto-direction sensing, 3.6V max VCC, no EN pin, lower ESD (±8kV HBM) | Limited to ≤3.6V systems; lacks dedicated enable for deterministic shutdown control | Select when channel count is sufficient and system does not require EN-driven power gating or >3.6V VCC. |
| SN74AVCH16T245DGGR | 16-channel, direction-controlled (DIR pin), 3.6V max VCC, no integrated ESD beyond standard IO | Requires external direction logic and discrete ESD protection for I/O VCC lines | Select when precise direction control is needed and board layout allows DIR routing + TVS placement. |
Compared with TXB0108PWR and SN74AVCH16T245DGGR, the MAX13103EEBX-T provides higher VCC tolerance (up to 5.5V), integrated ±15kV HBM ESD on VCC-side I/O, and EN-based deterministic shutdown-making it preferable for ruggedized, mixed-rail portable systems where layout area and reliability are critical.
Availability
The MAX13103EEBX-T is available at Aetrix Electronics and suitable for smartphone baseband interfaces, digital camera sensor links, portable medical monitor buses, and wearable sensor hubs requiring stable component supply and long-term production continuity.
Supply support for MAX13103EEBX-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability ICs for demanding industrial, automotive, and portable applications.
The MAX1310x family was developed specifically for robust, high-speed bidirectional level translation in space-constrained, battery-operated devices-emphasizing low shutdown current, wide supply flexibility, and integrated ESD protection on exposed I/O paths.
FAQ
What is the maximum capacitive load the MAX13103EEBX-T can drive at 20Mbps?
The MAX13103EEBX-T guarantees 20Mbps operation with ≤50pF load on I/O VCC pins and ≤15pF on I/O VL pins, as verified in timing characterization (Figures 1a/2a). Exceeding these loads increases rise/fall times and may violate setup/hold windows-designers should verify signal integrity using the device's published tRVL/tFVL/tRVCC/tFVCC vs. load curves.
Does the MAX13103EEBX-T require external direction control logic?
No. The MAX13103EEBX-T is inherently bidirectional and requires no direction (DIR) pin or external control logic. Its internal architecture automatically detects signal transitions on either side and translates in both directions (VL ↔ VCC) on each of its 16 channels-simplifying PCB routing and reducing firmware overhead.
How does the EN pin affect I/O states during shutdown of the MAX13103EEBX-T?
When EN is driven low, the MAX13103EEBX-T places all 16 I/O VCC pins in a defined low state via internal 6kΩ pulldown resistors to GND, while all 16 I/O VL pins enter high-impedance tri-state. This prevents bus contention and ensures predictable logic levels on the VCC-side bus during system sleep modes.
Can the MAX13103EEBX-T translate between 1.2V and 5.5V logic domains?
Yes. The MAX13103EEBX-T supports VL from +1.2V to VCC and VCC from +1.65V to +5.5V. When VL = 1.2V and VCC = 5.5V, it translates signals from 1.2V logic thresholds (VIHL = 0.8V, VILL = 0.4V) to 5.5V-compatible outputs (VOHC ≥ 5.1V, VOLC ≤ 0.4V), meeting standard CMOS input requirements on the high-voltage side.
Is the MAX13103EEBX-T pin-compatible with other members of the MAX1310x family?
Yes-the MAX13103EEBX-T shares identical 36-bump UCSP pinout and footprint with MAX13101EEBX and MAX13102EEBX. However, functional differences exist: MAX13101E pulls down I/O VL during shutdown, MAX13102E pulls down I/O VL only, and MAX13103E places all I/O in tri-state except I/O VCC which is pulled to GND. Board reuse is possible but firmware/system logic must match the selected variant's shutdown behavior.
MAX13103EEBX-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 16
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State
- Data Rate:
- 20Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-WFBGA, CSPBGA
MAX13103EEBX-T FAQ
1.How can I place an order for MAX13103EEBX-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13103EEBX-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13103EEBX-T reliable?
The price and inventory of MAX13103EEBX-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13103EEBX-T is usually 5 days.
3.What payment methods are accepted for MAX13103EEBX-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13103EEBX-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13103EEBX-T?
MAX13103EEBX-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13103EEBX-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13103EEBX-T?
For technical support, including MAX13103EEBX-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13103EEBX-T requirements.
6.How does Aetrix verify that MAX13103EEBX-T is sourced from the original manufacturer or authorized distributors?
All MAX13103EEBX-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13103EEBX-T meets industry standards.
7.What is the process for return or replacement of MAX13103EEBX-T?
All MAX13103EEBX-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX13103EEBX-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13103EEBX-T part is unused and in its original packaging.
Return procedure for MAX13103EEBX-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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