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Analog Devices Inc./Maxim Integrated MAX13108EEBX
- Part No.:
- MAX13108EEBX
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX13108EEBX.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 36UCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,995
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Product details
Overview
The MAX13108EEBX from Maxim Integrated is a 16-channel bidirectional CMOS logic-level translator with integrated multiplexing control, designed for voltage translation between 1.2V–5.5V domains in multivoltage systems. It supports up to 20Mbps data rate, features ±15kV HBM ESD protection on VCC-side I/Os, and uses a MULT pin to select between two 8-channel banks. It is used in portable digital cameras and smartphone baseband-to-application-processor interfaces.
For engineers reviewing the MAX13108EEBX datasheet, MAX13108EEBX pinout, MAX13108EEBX application, or MAX13108EEBX equivalent, key selection criteria include its dual-bank multiplexing capability, shutdown leakage <1µA, tri-state control per bank, and compatibility with low-voltage ASICs/PLDs interfacing to 3.3V or 5V subsystems.
Technical Context
The MAX13108EEBX implements a bidirectional, one-shot accelerator architecture that dynamically activates output stages only during signal transitions-reducing static power while enabling fast edge rates. Its MULT input selects either I/O VL1–VL8 / VCC1–VCC8 (MULT = high) or I/O VL9–VL16 / VCC9–VCC16 (MULT = low), placing the unselected bank in high-impedance state.
Voltage thresholds are rail-proportional: VIHL/VILL = 2/3·VL & 1/3·VL; VIHC/VILC = 2/3·VCC & 1/3·VCC. Propagation delay is 20ns max (VCC→VL or VL→VCC), with channel-to-channel skew ≤5ns and part-to-part skew ≤10ns under 50pF load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | +1.65V to +5.5V - supports interface to 1.8V, 2.5V, 3.3V, and 5V logic domains |
| VL Range | +1.2V to VCC - enables translation from ultra-low-voltage cores (e.g., 1.2V FPGA I/O) upward |
| Max Data Rate | 20Mbps - guaranteed with 50pF load and ≤3ns input rise/fall time |
| ESD Protection | ±15kV HBM on I/O VCC pins - eliminates need for external TVS diodes in handheld ESD-prone environments |
| Shutdown Current | <1µA (VCC), <2µA (VL) - enables battery-sensitive always-on subsystems |
| Propagation Delay | 20ns max - ensures timing closure in high-speed serial control buses (e.g., I²C clock stretching, SPI command lines) |
| Channel Skew | ≤5ns (channel-to-channel), ≤10ns (part-to-part) - preserves parallel bus integrity across temperature |
Pinout & Package
MAX13108EEBX is housed in a 36-bump UCSP package (3.06mm × 3.06mm, 0.5mm pitch), with exposed paddle connected to GND for thermal and ESD performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (Pins 1, 21, 30) | Ground reference | Common return path for both VL and VCC supplies; must be low-inductance connection to system ground plane |
| VL (Pins 15, 36) | Low-voltage supply | Reference for I/O VLx pins; bypassed with 0.1µF ceramic capacitor near pin |
| VCC (Pins 16, 35) | High-voltage supply | Reference for I/O VCCx pins; requires 0.1µF + 1.0µF ceramic decoupling for full ±15kV ESD compliance |
| MULT (Pin 10) | Multiplexing control | Selects active 8-channel bank: MULT = VL/VCC → channels 1–8 enabled; MULT = GND → channels 9–16 enabled |
| I/O VL1–VL16 | Bidirectional VL-side I/O | 16 buffered logic lines referenced to VL; automatically translate level when driven from VCC side |
| I/O VCC1–VCC16 | Bidirectional VCC-side I/O | 16 buffered logic lines referenced to VCC; tolerate overvoltage up to VCC + 0.3V |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional auto-sensing translation | No direction pin required - internal circuitry detects edge direction and enables appropriate output stage |
| Per-bank tri-state multiplexing | MULT pin isolates one 8-bit channel group without external logic or bus switches |
| Rail-proportional input thresholds | VIH/VIL scale with VL and VCC - maintains noise margin across full supply range |
| Accelerator-based edge enhancement | Short-duration current pulses reduce rise/fall times by up to 70% vs. passive translators under 50pF load |
| Configurable shutdown states | Each bank can be independently placed in high-Z or pulldown (6kΩ) mode via MULT and supply sequencing |
Applications
| Mobile Baseband Interface | Digital Camera Sensor Hub |
|---|---|
Use Scenario: Connecting a 1.2V MIPI D-PHY transmitter in an application processor to a 2.8V image sensor interface. IC Role / Device Role / Timing Role: Bidirectional level shifter with multiplexing support for shared control lines (I²C, GPIO) between voltage domains. Use Value: Eliminates need for discrete MOSFET translators and external multiplexers, reducing BOM count and PCB area by 40%. | Use Scenario: Isolating two 8-bit parallel camera data paths (LVCMOS18 and LVCMOS33) sharing a single host controller bus. IC Role / Device Role / Timing Role: Dual-bank translator enabling time-multiplexed access to two sensors without bus contention. Use Value: Enables dual-camera operation using one host interface, with <5ns inter-channel skew preserving pixel timing alignment. |
| Industrial PLC I/O Module | Wearable Health Monitor |
Use Scenario: Level-shifting 1.8V microcontroller GPIOs to drive 3.3V industrial I/O expander ICs in noisy factory environments. IC Role / Device Role / Timing Role: ESD-hardened translator providing ±15kV HBM protection on field-facing VCC-side I/Os. Use Value: Survives repeated ESD events during panel servicing without latch-up or calibration drift, extending field service life. | Use Scenario: Interfacing a 1.2V ultra-low-power biosensor ASIC to a 2.5V Bluetooth LE radio SoC in a compact wearable form factor. IC Role / Device Role / Timing Role: Low-quiescent-current translator (<0.03µA typical) minimizing standby power draw. Use Value: Extends battery runtime by >12 hours per charge cycle compared to discrete FET solutions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar logic-level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108RKL | 8-channel, auto-directional, no MULT pin; 3.6V max VCC; no ±15kV HBM on I/O | Lacks per-bank multiplexing and fails ESD requirements for handheld consumer ports | Choose only for cost-sensitive, non-ESD-critical 8-bit-only systems with VCC ≤3.6V |
| SN74AVC16T245DGGR | 16-channel, direction-controlled (DIR pin), 3.6V max VCC, no integrated ESD protection | Requires external ESD diodes and direction logic; unsuitable for space-constrained portable designs | Prefer where board space allows discrete protection and DIR signal routing is feasible |
Compared with TXB0108RKL and SN74AVC16T245DGGR, the MAX13108EEBX uniquely delivers 16-channel bidirectional translation with per-bank multiplexing, ±15kV HBM robustness, and sub-1µA shutdown-making it the only option qualified for high-reliability, miniaturized multivoltage interfaces in portable electronics.
Availability
MAX13108EEBX is available at Aetrix Electronics and suitable for mobile baseband interfaces, digital camera sensor hubs, industrial PLC I/O modules, and wearable health monitors requiring stable component supply across extended temperature (-40°C to +85°C) and long product lifecycles.
Supply support for MAX13108EEBX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability ICs for automotive, industrial, and communications markets.
The MAX13108EEBX belongs to Maxim's logic-level translation product line, engineered specifically for seamless interoperability between heterogeneous voltage domains in battery-powered and ESD-exposed portable systems.
FAQ
What is the function of the MULT pin on the MAX13108EEBX?
The MULT pin on the MAX13108EEBX selects which 8-channel bank is active: driving MULT to VL or VCC enables I/O VL1–VL8 and I/O VCC1–VCC8, while driving MULT to GND enables I/O VL9–VL16 and I/O VCC9–VCC16. The inactive bank enters high-impedance state. This eliminates external multiplexers in dual-sensor or dual-peripheral designs. The MAX13108EEBX uses this pin to provide hardware-selectable channel grouping without firmware overhead.
Does the MAX13108EEBX require external pull-up or pull-down resistors on its I/O lines?
No, the MAX13108EEBX does not require external pull-up or pull-down resistors on its I/O lines during normal operation. Its internal accelerator architecture drives outputs actively in both directions. However, during shutdown, MAX13108EEBX does not internally terminate unused I/Os unless configured via MULT and supply conditions - so external 100kΩ pull-ups/downs are recommended if I/Os float during power-down sequences. The MAX13108EEBX datasheet specifies this for leakage control.
Can the MAX13108EEBX translate between 1.2V and 5.5V logic levels?
Yes, the MAX13108EEBX supports VL from +1.2V to VCC and VCC from +1.65V to +5.5V, enabling direct 1.2V ↔ 5.5V bidirectional translation. Input thresholds scale proportionally (VIHL = 2/3·VL, VIHC = 2/3·VCC), ensuring noise margins are preserved across the full range. The MAX13108EEBX has been characterized at these extremes and guarantees 20Mbps operation with proper decoupling and ≤50pF load.
How does the MAX13108EEBX achieve ±15kV ESD protection?
The MAX13108EEBX achieves ±15kV Human Body Model ESD protection on all I/O VCC pins through on-die silicon structures optimized for high-energy discharge clamping without latch-up. These structures remain functional in all operating modes - active, tri-state, and shutdown - and are validated per JEDEC JS-001. Unlike competing devices, the MAX13108EEBX recovers fully after ESD events without requiring power-cycle reset. This protection is intrinsic to the MAX13108EEBX die design and requires no external components.
Is the MAX13108EEBX pin-compatible with other devices in the MAX1310xE family?
No, the MAX13108EEBX is not pin-compatible with MAX13101E/MAX13102E/MAX13103E because it substitutes the EN pin (used for global shutdown) with the MULT pin (for bank selection). Pin 10 is MULT on MAX13108EEBX but EN on the others; their functional pinouts differ. While all share the same 36-bump UCSP footprint and power/ground/I/O assignments, the control pin mapping is distinct. Board layout must be verified against the MAX13108EEBX-specific pinout diagram - the MAX13108EEBX cannot be substituted without redesign.
MAX13108EEBX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 16
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State
- Data Rate:
- 20Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 36-WFBGA, CSPBGA
MAX13108EEBX FAQ
1.How can I place an order for MAX13108EEBX through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX13108EEBX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX13108EEBX reliable?
The price and inventory of MAX13108EEBX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX13108EEBX is usually 5 days.
3.What payment methods are accepted for MAX13108EEBX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX13108EEBX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX13108EEBX?
MAX13108EEBX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX13108EEBX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX13108EEBX?
For technical support, including MAX13108EEBX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX13108EEBX requirements.
6.How does Aetrix verify that MAX13108EEBX is sourced from the original manufacturer or authorized distributors?
All MAX13108EEBX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX13108EEBX meets industry standards.
7.What is the process for return or replacement of MAX13108EEBX?
All MAX13108EEBX units undergo pre-shipment inspection (PSI). If there is an issue with MAX13108EEBX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX13108EEBX part is unused and in its original packaging.
Return procedure for MAX13108EEBX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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