Analog Devices Inc./Maxim Integrated MAX14611ETD+T

Overview

MAX14611ETD+T from Maxim Integrated is a quad bidirectional low-voltage logic-level translator enabling interoperability between 0.9V–5.0V and 1.65V–5.5V domains. It supports I²C and MDIO buses with open-drain operation, features ±6kV HBM ESD protection on I/OVCC_ pins, operates from –40°C to +85°C, and delivers up to 20Mbps push-pull data rate in a 3mm × 3mm 14-pin TDFN-EP package.

For engineers reviewing the MAX14611ETD+T datasheet, MAX14611ETD+T pinout, MAX14611ETD+T application, or MAX14611ETD+T equivalent, key selection considerations include bidirectional level-shifting capability across asymmetric supply rails (VL = 0.9V, VCC = 3.3V), integrated 10kΩ pullups, three-state control via TS pin, thermal shutdown at +150°C, and compatibility with I²C timing requirements including rise-time acceleration.

Technical Context

The MAX14611ETD+T uses a transmission-gate architecture for true bidirectional voltage translation without direction control pins. Its internal one-shot rise-time accelerators reduce propagation delay and improve edge speed-enabling 20Mbps push-pull operation and 6Mbps open-drain performance-while maintaining ±0.5V absolute maximum tolerances on all I/O pins relative to their respective supplies.

It implements thermal short-circuit protection that forces three-state mode at +150°C junction temperature (with +20°C hysteresis), and supports independent power sequencing where VL may exceed VCC during startup. The TS input is referenced to VL and controls high-impedance state of both I/OVL_ and I/OVCC_ banks, disabling internal 10kΩ pullups and reducing supply current to <1µA.

Key Specifications

Pinout & Package

MAX14611ETD+T is housed in a 3mm × 3mm, 14-pin TDFN-EP package with exposed pad (EP) internally connected to GND. The package supports high thermal conductivity (θ_JA = 41°C/W) and RoHS-compliant reflow soldering (260°C peak).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX3378EETD+, the MAX14611ETD+T adds critical reliability features (thermal shutdown, ±6kV ESD) and speed (20Mbps vs. 10Mbps); versus TXS0104ERGYR, it offers deterministic timing and active fault management at the cost of requiring explicit TS control.

Availability

MAX14611ETD+T is available at Aetrix Electronics and suitable for I²C bus translation, MDIO interface bridging, low-voltage ASIC interfacing, and portable electronics power domain isolation requiring stable component supply across automotive-grade temperature ranges and long production lifecycles.

Supply support for MAX14611ETD+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX14611ETD+T belongs to Maxim's high-reliability level translation product line, engineered specifically for robust multivoltage system interoperability in space-constrained, thermally demanding environments such as telecom infrastructure and portable medical devices.

FAQ

What is the minimum operating voltage for VL on the MAX14611ETD+T?

The MAX14611ETD+T supports VL down to 0.9V, enabling direct interfacing with ultra-low-power ASICs and advanced-node processors. This 0.9V minimum is specified and guaranteed across the full –40°C to +85°C temperature range, with VIHL = VL – 0.2V and VILL = 0.15V ensuring reliable logic recognition even at lowest VL. Operation below 0.9V is not characterized and may result in undefined behavior or increased propagation delay.

Does the MAX14611ETD+T require external pullup resistors for I²C operation?

No, the MAX14611ETD+T integrates 10kΩ pullup resistors on both I/OVL_ and I/OVCC_ lines, eliminating the need for external resistors in standard I²C configurations. These internal pullups are enabled when TS = VL (normal operation) and automatically disabled when TS = GND (three-state mode). For applications requiring stronger pullups (e.g., high-capacitance buses), external resistors can be added in parallel without conflict.

How does the TS pin affect power consumption in the MAX14611ETD+T?

Driving TS low places the MAX14611ETD+T into three-state output mode, disconnecting internal 10kΩ pullups and reducing total supply current to less than 1µA (typical). In this state, both I/OVL_ and I/OVCC_ banks enter high-impedance, allowing multidrop bus architectures where multiple translators share the same lines. TS is VL-referenced, so logic-high is defined as VIH ≥ VL – 0.2V, ensuring compatibility with sub-1V control signals.

Can the MAX14611ETD+T translate between 5V and 1.8V logic levels?

Yes, the MAX14611ETD+T supports VCC up to 5.5V and VL down to 0.9V, making 5V ↔ 1.8V translation fully supported. However, ensure VL ≤ VCC + 0.3V during steady-state operation (per Absolute Maximum Ratings), meaning 1.8V VL is valid with 5V VCC since 1.8V ≤ 5.3V. The device maintains ±0.5V pin tolerances and guarantees VOHC = 0.7 × VCC and VOLL = 0.4V, ensuring noise margins meet 5V TTL and 1.8V CMOS thresholds.

What thermal protection mechanisms are built into the MAX14611ETD+T?

The MAX14611ETD+T incorporates thermal shutdown that activates at +150°C junction temperature (typical), forcing automatic entry into three-state output mode to halt current flow and prevent damage. Recovery occurs at +130°C (20°C hysteresis), restoring normal operation once cooled. This protection is independent of supply voltages and remains active in all operating modes-including shutdown and three-state-ensuring robustness during sustained bus contention or output short circuits.