Analog Devices Inc./Maxim Integrated MAX14689AETB+T

Overview

The MAX14689AETB+T from Maxim Integrated is a 10-pin TDFN-EP ultra-small, low-on-resistance (0.25Ω typ) double-pole/double-throw (DPDT) analog switch with Beyond-the-Rails™ capability, enabling distortion-free signal switching from −5.5V to +5.5V independent of VCC. It operates from a single +1.6V to +5.5V supply, draws only 40µA typical supply current at 1.6V, and supports break-before-make timing for reliable audio/video routing in portable devices.

For engineers reviewing the MAX14689AETB+T datasheet, MAX14689AETB+T pinout, MAX14689AETB+T application, or MAX14689AETB+T equivalent, key selection criteria include its ±15kV HBM ESD protection on COM/NO/NC pins, 0.001% THD+N audio performance, 110MHz −3dB bandwidth, high-impedance fail-safe mode when unpowered, and dual-package availability (WLP and TDFN).

Technical Context

The MAX14689AETB+T implements a BiCMOS-based DPDT topology with two independent SPDT switches sharing one digital control input (CB), where logic low connects each COM_ to its NC_ terminal and logic high connects to NO_. Its Beyond-the-Rails architecture uses internal charge pumps and rail-to-rail input stages to maintain linear conduction across the full −5.5V to +5.5V analog range without requiring negative supplies or level-shifting circuitry.

Switching behavior is characterized by guaranteed break-before-make operation (up to 250µs at 1.8V), 5µs minimum turn-off time, and on-resistance flatness of just 0.001Ω over the entire signal range - critical for preserving signal integrity in high-fidelity audio paths. Thermal shutdown activates at +150°C with 25°C hysteresis, ensuring robust operation under sustained load.

Key Specifications

Pinout & Package

The MAX14689AETB+T is housed in a 10-pin, 2.5mm × 2.0mm thermally enhanced TDFN package with exposed pad (EP), optimized for compact portable layouts and efficient heat dissipation (θJA = 102°C/W on 4-layer board). The EP must be soldered to GND for thermal and ESD performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DPDT analog switch applications.

Compared with MAX14689EWL+T, the MAX14689AETB+T offers superior thermal management via EP grounding and easier reworkability, while TMUX1574RSVR trades rail-to-rail flexibility and ESD integration for higher channel count - making MAX14689AETB+T optimal for space-constrained yet thermally demanding portable audio/video routing.

Availability

The MAX14689AETB+T is available at Aetrix Electronics and suitable for smartphone audio routing, tablet video multiplexing, and portable media player output switching requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX14689AETB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and power management ICs for industrial, automotive, communications, and consumer applications.

The MAX14689AETB+T belongs to Maxim's ultra-low-RON analog switch family, engineered specifically for high-fidelity, rail-independent signal routing in battery-powered portable electronics with stringent ESD and size requirements.

FAQ

What is the maximum analog signal voltage the MAX14689AETB+T can handle when unpowered?

The MAX14689AETB+T supports analog signal voltages from −5.5V to +5.5V on all NC_, NO_, and COM_ pins even when VCC = 0V. This fail-safe capability prevents damage during hot-plug events or power sequencing mismatches in portable systems, and is enabled by internal ESD structures and oxide-isolated switch architecture.

Does the MAX14689AETB+T require external ESD protection in smartphone designs?

No - the MAX14689AETB+T integrates ±15kV HBM ESD protection on COM1/COM2, ±15kV HBM on NC_/NO_, and ±2kV HBM on all other pins. This eliminates the need for discrete ESD diodes in typical smartphone audio/video front-end layouts, reducing BOM cost and PCB area while maintaining IEC 61000-4-2 compliance.

Can the MAX14689AETB+T be powered directly from a microcontroller GPIO pin?

Yes - with only 40µA typical supply current at 1.6V, the MAX14689AETB+T can be powered directly from a standard GPIO pin capable of sourcing ≥100µA. This simplifies power architecture in space-constrained designs and avoids adding a dedicated LDO, provided the GPIO voltage meets the +1.6V to +5.5V VCC range.

What is the significance of the exposed pad (EP) on the MAX14689AETB+T TDFN package?

The exposed pad (EP) on the MAX14689AETB+T must be soldered to a GND plane to achieve specified thermal performance (θJA = 102°C/W) and full ESD robustness. Leaving EP floating degrades thermal resistance by ~30% and reduces ESD immunity, especially on COM pins - proper EP grounding is mandatory for reliable operation in production designs.

How does the MAX14689AETB+T achieve Beyond-the-Rails™ operation without external supplies?

The MAX14689AETB+T achieves Beyond-the-Rails™ operation using internal charge-pump circuitry and rail-to-rail input stage design that dynamically extends gate drive beyond VCC and GND. This allows MOSFET switches to remain fully enhanced across −5.5V to +5.5V analog signals regardless of VCC level - confirmed by guaranteed RON flatness and THD+N performance across the full range.