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Analog Devices Inc./Maxim Integrated MAX153EAP-T
- Part No.:
- MAX153EAP-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Analog to Digital Converters (ADC)
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
MAX153EAP-T.pdf
- Description:
- IC ADC 8BIT FLASH 20SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,682
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Product details
Overview
MAX153EAP-T from Maxim Integrated is a high-speed, µP-compatible 8-bit analog-to-digital converter (ADC) using half-flash architecture to deliver 660ns conversion time and 1Msps throughput. It operates from single +5V or dual ±5V supplies, supports unipolar/bipolar inputs, and features a dedicated POWERDN pin enabling 1µA typical power-down current-ideal for burst-mode data acquisition in portable radios and battery-powered systems.
For engineers reviewing the MAX153EAP-T datasheet, MAX153EAP-T pinout, MAX153EAP-T application, or MAX153EAP-T equivalent, key selection criteria include guaranteed 8-bit resolution with ±1 LSB total unadjusted error, ratiometric reference support, internal track/hold, no external clock requirement, and compatibility with standard microprocessor data buses via latched three-state outputs.
Technical Context
The MAX153EAP-T implements a two-stage half-flash architecture: a 4-bit flash ADC generates the MSBs, then an internal 4-bit DAC produces a residue voltage that feeds a second 4-bit flash stage for the LSBs-enabling full 8-bit conversion in 660ns. Its digital interface supports RD mode (MODE = GND) and WR-RD mode (MODE = VDD), with INT and RDY outputs providing timing control for µP wait-state synchronization.
Power management is tightly integrated: PWRDN asserts low to reduce VDD current to 1µA (typ), with wake-up time under 200ns; CS must remain high during shutdown to prevent incomplete conversions. Ratiometric operation is enabled by independent VREF+ and VREF− inputs, each with 1kΩ–4kΩ input resistance, supporting flexible reference sourcing including supply-derived or external precision references.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Resolution | 8-bit - delivers discrete quantization steps of 1/256 full-scale range, sufficient for medium-accuracy sensor digitization and control loop feedback. |
| Conversion Time | 660ns (WR-RD mode) - enables deterministic sampling intervals down to 1.23MHz maximum rate, critical for real-time servo loop closure. |
| Power-Down Current | 1µA typical (VDD = +5V) - reduces average system power in intermittent-sampling applications like cellular handset voice burst detection. |
| Full-Power Bandwidth | 1MHz - supports accurate digitization of signals up to 1MHz without amplitude roll-off, matching Nyquist criterion for 1Msps sampling. |
| Input Voltage Range | Unipolar: 0V to VREF+; Bipolar: VREF− to VREF+ (e.g., ±2.5V) - allows direct interfacing to transducer outputs referenced to ground or split supplies. |
| Total Unadjusted Error | ±1 LSB (unipolar range) - ensures monotonicity and guarantees no missing codes across full temperature range (−40°C to +85°C). |
| Supply Options | +5V only (unipolar) or ±5V (bipolar) - eliminates need for additional DC-DC converters in mixed-signal portable designs. |
Pinout & Package
MAX153EAP-T is housed in a 20-pin SSOP (Shrink Small Outline Package) with 0.65mm lead pitch, RoHS-compliant and moisture-sensitive level 1 (MSL1). The package supports surface-mount reflow assembly and provides thermal dissipation up to 640mW at +70°C ambient.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VIN | Analog Input | Accepts differential or single-ended voltage between VREF− and VREF+; 22pF input capacitance requires ≤2.2kΩ source impedance for full-speed acquisition. |
| 2–5, 14–17 D0–D7 | Three-State Data Outputs | Latched, bus-compatible outputs drive µP data bus directly; high-impedance state enables shared bus operation without external buffers. |
| 6 WR/RDY | Mode-Dependent Control/Status | In RD mode: open-collector READY output; in WR-RD mode: WRITE strobe input-reduces pin count vs. separate control lines. |
| 7 MODE | Interface Mode Select | Pulled low internally (50µA); logic low selects RD mode (single read pulse), high enables WR-RD pipelined operation. |
| 8 RD | Read Strobe | Active-low signal latches conversion result into output drivers; timing-critical for µP wait-state coordination. |
| 9 INT | Interrupt Output | Open-drain active-low signal indicates conversion completion; resets on rising edge of CS or RD-synchronizes µP polling. |
| 10 GND | Digital Ground | Reference return for digital I/O; must be star-connected to analog ground at single point to minimize noise coupling. |
| 11 VREF− / 12 VREF+ | Reference Span Terminals | Define zero-code (VREF−) and full-scale (VREF+) voltages; ratiometric operation rejects supply drift when reference ties to same source as sensor. |
| 13 CS | Chip Select | Active-low enable; must be high during power-down to prevent spurious conversion attempts and excessive current draw. |
| 18 PWRDN | Power-Down Control | CMOS/TTL-compatible input; low = 1µA shutdown; recovery time <200ns allows rapid duty-cycled operation in burst-mode systems. |
| 19 VSS / 20 VDD | Supply Rails | VSS = 0V (unipolar) or −5V (bipolar); VDD = +5V; bypassing requires 4.7µF electrolytic + 0.1µF ceramic per rail to suppress switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Half-flash conversion architecture | Combines speed of flash ADC with reduced comparator count (15 vs. 255 for full 8-bit flash), achieving 660ns conversion with lower power and die area. |
| Ratiometric reference inputs | VREF+ and VREF− terminals allow direct connection to sensor excitation or supply rails, eliminating gain drift errors in bridge or RTD measurement circuits. |
| No external clock required | Internal timing circuitry synchronizes conversion to WR/RD control edges-removes clock distribution complexity and jitter sensitivity in µP-centric systems. |
| Internal track/hold function | Integrated T/H captures analog input for 160ns minimum acquisition time, removing need for external sample-hold amplifier in most medium-bandwidth applications. |
| µP-compatible digital interface | Three-state latched outputs, memory-mapped or I/O-port behavior, and interrupt/ready signaling eliminate glue logic-reducing BOM and PCB area. |
Applications
| Portable Radio Signal Digitization | Battery-Powered Sensor Node |
|---|---|
Use Scenario: Digitizing IF or baseband analog signals in handheld two-way radios operating on intermittent battery power. IC Role / Device Role / Timing Role: High-speed ADC capturing 1Msps bursts during voice transmission windows while minimizing average current draw. Use Value: 1µA power-down current extends battery life between transmissions; 660ns conversion enables precise timing alignment with RF front-end gating signals. |
Use Scenario: Sampling temperature, pressure, or accelerometer outputs in remote IoT nodes powered by coin-cell batteries. IC Role / Device Role / Timing Role: Low-power analog front-end digitizer triggered by MCU wake-up events, entering deep sleep between readings. Use Value: Guaranteed ±1 LSB accuracy over −40°C to +85°C ensures calibration stability; ratiometric reference rejects supply voltage sag during battery discharge. |
| Cellular Handset Voice Path | High-Speed Servo Loop Feedback |
Use Scenario: Converting microphone or audio codec outputs in GSM/CDMA handsets where size and power are constrained. IC Role / Device Role / Timing Role: µP-synchronized ADC interfacing directly to baseband processor data bus without address decoding logic. Use Value: 20-pin SSOP footprint saves board space; unipolar/bipolar flexibility supports both electret mic biasing and differential line-in configurations. |
Use Scenario: Capturing position or current feedback in motor control systems requiring sub-microsecond loop latency. IC Role / Device Role / Timing Role: Real-time analog monitor feeding closed-loop PWM controller with deterministic 660ns conversion delay. Use Value: Full-power bandwidth of 1MHz preserves signal integrity of fast-rising encoder or shunt voltage edges; internal T/H eliminates external component delays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 8-bit, high-speed ADC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADS7822U | SPI interface, 2.7V–5.25V supply, 1MSPS, 1µA shutdown, but no bipolar input support and requires external reference. | Better suited for low-voltage, single-supply µC systems with SPI peripherals; lacks native µP bus interface and ratiometric capability. | Select when SPI-native microcontrollers dominate the design and bipolar input is unnecessary. |
| MAX1113ECM | Same manufacturer, 8-bit, 1.5Msps, but uses successive approximation (SAR), higher 2.5mW operating power, and no power-down pin. | Higher speed and better SNR (50dB vs. 45dB), yet draws 25× more active current-unsuitable for burst-mode battery operation. | Choose only when absolute speed and SNR outweigh power constraints, and continuous sampling is required. |
Compared with ADS7822U and MAX1113ECM, the MAX153EAP-T uniquely balances µP bus compatibility, true bipolar/unipolar flexibility, ratiometric operation, and ultra-low 1µA shutdown-making it optimal for resource-constrained, µP-driven portable instrumentation where interface simplicity and power cycling are essential.
Availability
MAX153EAP-T is available at Aetrix Electronics and suitable for cellular telephones, portable radios, and battery-powered systems requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for MAX153EAP-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX153EAP-T belongs to Maxim's high-speed data acquisition product line, designed specifically for µP-centric, low-power, portable instrumentation where fast conversion, minimal external components, and robust temperature performance are mandatory.
FAQ
What is the operating temperature range for the MAX153EAP-T?
The MAX153EAP-T is rated for −40°C to +85°C, matching the "E" grade designation in its part number. This extended industrial temperature range ensures reliable operation in portable radios, cellular handsets, and outdoor sensor nodes where ambient conditions vary widely. All electrical specifications-including ±1 LSB total unadjusted error and 660ns conversion time-are guaranteed across this full range.
Does the MAX153EAP-T require an external clock signal?
No, the MAX153EAP-T does not require an external clock. Its conversion timing is fully controlled by the WR, RD, and CS digital inputs-enabling direct µP bus interfacing without clock generation circuitry. Internal timing circuitry ensures deterministic 660ns conversion in WR-RD mode, eliminating clock jitter concerns and simplifying system-level timing design for the MAX153EAP-T.
How does the power-down feature of the MAX153EAP-T work, and what is the wake-up time?
The MAX153EAP-T enters ultra-low-power mode when the PWRDN pin is driven low, reducing VDD supply current to 1µA typical. Wake-up occurs within 200ns of PWRDN returning high, after which a new conversion can begin in ≤360ns (200ns power-up + 160ns acquisition). During shutdown, CS must remain high to prevent invalid conversion attempts-this behavior is explicitly specified for the MAX153EAP-T in its datasheet.
Can the MAX153EAP-T operate with bipolar input signals, and what supply configuration is needed?
Yes, the MAX153EAP-T supports true bipolar inputs (e.g., ±2.5V) when configured with dual ±5V supplies: VDD = +5V and VSS = −5V. VREF+ and VREF− are set to +2.5V and −2.5V respectively, defining the zero-code and full-scale points. This configuration is production-tested and guaranteed for the MAX153EAP-T across its full −40°C to +85°C range, with ±1 LSB full-scale error specification.
What package type is used for the MAX153EAP-T, and is it RoHS-compliant?
The MAX153EAP-T uses a 20-pin SSOP (Shrink Small Outline Package) with 0.65mm lead pitch, designated by the "A" in the suffix per Maxim's ordering guide. It is RoHS-compliant, indicated by the "+" in the full orderable part number MAX153EAP+, and rated MSL1 for moisture sensitivity-supporting standard reflow soldering without baking. This package provides compact footprint and thermal performance up to 640mW at +70°C for the MAX153EAP-T.
MAX153EAP-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Number of Bits:
- 8
- Sampling Rate (Per Second):
- 1M
- Number of Inputs:
- 1
- Input Type:
- Single Ended
- Data Interface:
- Parallel
- Configuration:
- S/H-ADC
- Ratio - S/H:ADC:
- 1:1
- Number of A/D Converters:
- 1
- Architecture:
- Flash
- Reference Type:
- External
- Voltage - Supply, Analog:
- ±5V, 5V
- Voltage - Supply, Digital:
- ±5V, 5V
- Features:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Supplier Device Package:
- 20-SSOP
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
MAX153EAP-T FAQ
1.How can I place an order for MAX153EAP-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX153EAP-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX153EAP-T reliable?
The price and inventory of MAX153EAP-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX153EAP-T is usually 5 days.
3.What payment methods are accepted for MAX153EAP-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX153EAP-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX153EAP-T?
MAX153EAP-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX153EAP-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX153EAP-T?
For technical support, including MAX153EAP-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX153EAP-T requirements.
6.How does Aetrix verify that MAX153EAP-T is sourced from the original manufacturer or authorized distributors?
All MAX153EAP-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX153EAP-T meets industry standards.
7.What is the process for return or replacement of MAX153EAP-T?
All MAX153EAP-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX153EAP-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX153EAP-T part is unused and in its original packaging.
Return procedure for MAX153EAP-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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