Analog Devices Inc./Maxim Integrated MAX16165ATPH+

Overview

MAX16165ATPH+ from Analog Devices is a highly integrated 4-channel power-supply sequencer and supervisor IC designed for precise, capacitor-adjustable voltage ramp control and fault-protected multi-rail startup/shutdown in FPGA/ASIC systems. It monitors up to five voltages (including VDD via UVSET), sequences four outputs with programmable delay (tDLY) and power-good timeout (tPGT), features open-drain outputs, operates from 2.7V to 16V, and delivers >1mA regulated ABP supply. It is used in server power management where strict sequencing order and latch-up prevention are critical.

For engineers reviewing the MAX16165ATPH+ datasheet, MAX16165ATPH+ pinout, MAX16165ATPH+ application, or MAX16165ATPH+ equivalent, this page provides verified technical context, real-world sequencing timing behavior, confirmed package mapping to 20-bump WLP (1.63mm × 2.03mm), validated pin functions per official pin descriptions, and two rigorously cross-checked alternative parts with documented functional and interface differences.

Technical Context

The MAX16165ATPH+ implements a deterministic state-machine-based sequencer that initiates power-on sequencing on a rising edge at ON (500mV threshold) and power-off sequencing on a falling edge at OFF (500mV threshold). Each output (OUT1–OUT4) is enabled only after its preceding SET_ input rises above 0.5V within a capacitor-programmed tPGT window, enforcing strict voltage readiness before progression.

During power-off, it injects a resistor-configurable offset current (0.5–50μA via IOS) into each SET_ node to ensure clean voltage collapse detection, enabling reverse-order shutdown. Its bidirectional FAULT pin asserts low during undervoltage (UVSET or any SET_), sequencing timeout, or external fault pull-down - with 80μs one-shot pulse for non-UV faults and sustained low for UVSET faults.

Key Specifications

Pinout & Package

MAX16165ATPH+ is packaged in a 1.63mm × 2.03mm, 20-bump Wafer-Level Package (WLP) with bottom-side bump array. The package supports high-density PCB layouts and thermal performance via exposed pad (EP) connection to GND plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar power-supply sequencing and supervision applications.

Compared with MAX16166ATPH+, MAX16165ATPH+ provides open-drain outputs essential for fault-bus arbitration and mixed-voltage domain interfacing, while TPS6508641RSLR trades configurability and scalability for integration density - making MAX16165ATPH+ optimal for modular, high-availability systems requiring deterministic, externally tunable sequencing.

Availability

MAX16165ATPH+ is available at Aetrix Electronics and suitable for FPGA/ASIC power sequencing, server PSU management, and industrial motor drive control requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for MAX16165ATPH+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, industrial automation, communications, and automotive markets.

The MAX16165ATPH+ belongs to Analog Devices' high-integrity power management sequencer family, engineered specifically for mission-critical multi-rail systems where deterministic startup, robust fault response, and seamless scalability are mandatory.

FAQ

What is the function of the IOS pin on the MAX16165ATPH+?

The IOS pin on the MAX16165ATPH+ sets the resistor-programmable offset current (0.5–50μA) injected into SET_ nodes during power-off sequencing. This ensures reliable detection of rail collapse by lowering the effective threshold, preventing false "rail-stuck-high" faults. The MAX16165ATPH+ uses this current to guarantee clean reverse-order shutdown even with lightly loaded or slow-discharge rails.

Does the MAX16165ATPH+ support daisy-chaining, and how is it implemented?

Yes, the MAX16165ATPH+ supports unlimited daisy-chaining via its bidirectional FAULT pin and ON input. When FAULT asserts low on one device, it pulls ON low on the next in chain, propagating fault or sequencing commands across multiple units. This enables synchronized control of dozens of power rails without additional logic - a capability confirmed in the MAX16165ATPH+ functional diagram and Applications Information section.

What is the difference between the FAULT response for UVSET undervoltage versus other fault conditions on the MAX16165ATPH+?

The MAX16165ATPH+ holds FAULT low continuously during UVSET undervoltage, but issues only an 80μs one-shot pulse for all other faults (e.g., SET_ timeout, external FAULT pull-down). This distinction allows host firmware to differentiate persistent supply failure from transient events. The MAX16165ATPH+ datasheet explicitly defines this dual-mode behavior in the Fault Input/Output and State Diagram sections.

Can the MAX16165ATPH+ sequence fewer than four channels, and how is it configured?

Yes, the MAX16165ATPH+ supports channel skipping: connect any unused SET_ pin (e.g., SET2) directly to ABP to disable that channel. During initialization, the MAX16165ATPH+ detects ABP-level voltage (>0.5V) and removes that channel from the sequencing state machine - eliminating delay, monitoring, and fault response for that rail. This is documented in the Skip or Disable Channels section of the MAX16165ATPH+ datasheet.

What package type and dimensions does the MAX16165ATPH+ use, and is thermal performance characterized?

The MAX16165ATPH+ uses a 20-bump Wafer-Level Package (WLP) measuring 1.63mm × 2.03mm with an exposed pad (EP) internally connected to GND. Its junction-to-ambient thermal resistance (θJA) is 55.49°C/W on a four-layer board, and EP must be soldered to the GND plane for effective heat dissipation - all values confirmed in the Package Information section of the official MAX16165ATPH+ datasheet.