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Analog Devices Inc./Maxim Integrated MAX17080GTL+T
- Part No.:
- MAX17080GTL+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 40-WFQFN Exposed Pad
- Datasheet:
-
MAX17080GTL+T.pdf
- Description:
- IC REG CTRLR AMD SVI 3OUT 40TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,500
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Product details
Overview
The MAX17080GTL+T from Maxim Integrated is a triple-output, fixed-frequency step-down controller for AMD Serial VID (SVI) CPU and northbridge core supplies. It integrates two high-current synchronous buck controllers (SMPS1/SMPS2) operating 180° out-of-phase and one 3A internal-switch buck converter (SMPS3) for NB core, supporting 4V–26V battery input and delivering ±0.5% VOUT accuracy over line/load/temperature in notebook/desktop systems.
For engineers reviewing the MAX17080GTL+T datasheet, MAX17080GTL+T pinout, MAX17080GTL+T application, or MAX17080GTL+T equivalent, key selection considerations include SVI-2 compliance, dual-phase interleaving for reduced input capacitance, programmable 100–600kHz switching frequency per core SMPS, thermistor-based VRHOT thermal fault output, and true differential current sensing for load-line accuracy.
Technical Context
The MAX17080GTL+T implements a fixed-frequency PWM architecture with transient phase repeat to improve dynamic response and reduce required output capacitance. Its dual-core SMPSs support split or combinable outputs detected at power-up, with dynamic phase selection optimizing active/sleep efficiency and programmable AC/DC droop for precise voltage positioning.
SMPS3 operates at twice the switching frequency of the core SMPSs (e.g., 600kHz vs. 300kHz), enabling smaller external components. The device features integrated gate drivers (RON(DH_) ≤ 2.5Ω, RON(DL_) ≤ 0.6Ω), adjustable slew-rate control, and a 7-bit on-board DAC (0–1.550V output range) for fine-grained VID code transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Configuration | Triple-output: two external high-current SMPSs (CPU cores) + one 3A internal-switch SMPS (northbridge) |
| Switching Frequency | 100–600kHz per core SMPS; 2× that for NB SMPS (e.g., 200–1200kHz) - enables optimized EMI and component size trade-offs |
| VOUT Accuracy | ±0.5% over line, load, and temperature (measured at FBDC_ for cores, OUT3 for NB) - ensures stable CPU/NB voltage under dynamic loads |
| Input Voltage Range | VIN = 4–26V (core SMPSs); VIN3 = 2.7–5.5V (NB SMPS) - supports wide-range battery and rail inputs in mobile platforms |
| Protection Features | OVP/UVP (250–350mV trip), thermal shutdown (160°C), VRHOT output, and PWRGD - provides robust system-level fault handling |
| Interface | AMD SVI-2 compliant 2-wire serial interface (SVC/SVD), switchable address, 3.4MHz max clock - enables dynamic VID programming and low-power pulse-skipping states |
| Package | 40-pin TQFN (7mm × 7mm, 0.5mm pitch), RoHS-compliant, -40°C to +105°C operation - suitable for space-constrained mobile PCB layouts |
Pinout & Package
The MAX17080GTL+T is housed in a 40-pin thin quad flat no-lead (TQFN) package with exposed thermal pad, measuring 7mm × 7mm and 0.8mm maximum height. Pin numbering follows standard counter-clockwise convention starting from the top-left corner (Pin 1 marked by dot or bevel).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SHDN | Shutdown control input | Active-low enable; <1µA shutdown current when pulled low - enables system-level power sequencing |
| PWRGD | Power-good status output | Open-drain output asserting high when all outputs are within ±150mV of target - used for processor reset coordination |
| VRHOT | Thermal-fault indicator | Open-drain output asserting low when die temperature exceeds programmable threshold - triggers CPU throttling or shutdown |
| SVC, SVD | SVI serial interface clock/data | 2-wire bidirectional bus compliant with AMD SVI-2 timing; supports dynamic VID updates and individual SMPS state control |
| FBDC_, FBAC_, OUT3 | Feedback inputs/outputs | FBDC_: DC voltage sense for core SMPSs; FBAC_: AC droop/current balance amplifier input; OUT3: NB SMPS regulated output - enables precision voltage positioning and load sharing |
| LX1, LX2, LX3 | Power switch node connections | LX1/LX2: high-current phase nodes for external MOSFETs; LX3: integrated 3A switch node - defines critical high-di/dt routing zones |
| CSP_, CSN_, ILIM12, ILIM3 | Current-sense and limit inputs | Differential current sensing (CSP_/CSN_) for accurate load-line control; ILIM12 sets core current limit; ILIM3 configures NB peak current (2.2–4.5A) |
| BST1, BST2, BST3 | Bootstrap supply inputs | Charge pump supplies for high-side gate drivers; BST1/BST2 drive external MOSFETs; BST3 drives internal NB switch - requires ceramic bootstrap capacitors |
Key Features
| Feature | Design Value |
|---|---|
| True 180° interleaved dual-phase operation | Reduces RMS input ripple current by ~70%, minimizing required bulk input capacitance and EMI filter size |
| Programmable slew-rate control | Adjustable transition speed (2.5–25mV/µs) between VID codes prevents overshoot/undershoot during dynamic voltage scaling |
| Transient phase repeat architecture | Improves transient response without increasing output capacitance - reduces total CPU core output cap by up to 30% |
| Integrated 3A NB SMPS with 100mΩ/50mΩ MOSFETs | Eliminates external power stage for northbridge supply, reducing BOM count and layout complexity |
| Thermistor-based VRHOT with 115mV hysteresis | Enables precise, programmable thermal monitoring using low-cost NTC thermistors - avoids need for external ADC or sensor IC |
| True differential current sensing | Delivers ±3% current-limit tolerance and <1% load-line error - critical for accurate CPU adaptive voltage positioning |
Applications
| Mobile Notebook CPU Core Supply | Desktop AMD Platform Northbridge Supply |
|---|---|
Use Scenario: Power delivery for dual-core or quad-core AMD mobile processors (e.g., Turion, Athlon Neo) in ultraportable notebooks with strict thermal and space constraints. IC Role / Device Role / Timing Role: Triple-output SVI controller managing dynamic voltage scaling, phase interleaving, and thermal fault signaling for CPU and NB domains. Use Value: Enables 180° interleaving to cut input capacitor volume by 40%, while VRHOT integration eliminates discrete thermal monitoring circuitry. | Use Scenario: Primary core voltage regulator for AMD 700-series chipset northbridges in compact desktop motherboards requiring high-efficiency, low-noise 1.0–1.3V rails. IC Role / Device Role / Timing Role: Integrated 3A NB SMPS with independent 2× switching frequency and programmable droop for stable memory controller voltage under burst loads. Use Value: Reduces external component count by 12 parts (MOSFETs, drivers, sense resistors) versus discrete solutions, improving board-level reliability. |
| AMD SVI-Compliant Laptop Reference Design | Voltage-Positioned Step-Down Converter for Embedded x86 Systems |
Use Scenario: Base platform design for ODMs building Windows-based laptops targeting AMD APU platforms with configurable power states (C-states, P-states). IC Role / Device Role / Timing Role: SVI-2 interface master coordinating real-time VID updates from CPU, soft-start sequencing, and PWRGD assertion timing aligned to BIOS requirements. Use Value: Supports full AMD-defined power-state transitions (including deep sleep pulse-skipping) without firmware modification or external sequencer IC. | Use Scenario: High-precision core supply in industrial embedded x86 systems (e.g., COM Express modules) requiring tight voltage regulation across -40°C to +105°C ambient. IC Role / Device Role / Timing Role: Fixed-frequency buck controller with ±0.5% VOUT accuracy, differential current sensing, and thermal protection for mission-critical compute modules. Use Value: Maintains 1.2V ±6mV regulation across full temperature range and load step (0–15A), eliminating need for post-regulation LDOs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output CPU core supply applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1993ETL+ | Single-output SVI controller; no NB SMPS; supports only one CPU core rail; 500kHz max switching frequency | Targeted at legacy single-core AMD platforms; lacks interleaving, VRHOT, and triple-output capability | Select only for cost-sensitive, low-complexity designs where NB supply is handled separately and thermal monitoring is external |
| RT8802AGQW | Triple-output controller with integrated MOSFETs for all three channels; 30V max VIN; no SVI interface - uses SMBus/PMBus | Designed for Intel VR12/VR12.5 platforms; incompatible with AMD SVI protocol and VID code mapping | Choose only for Intel-based systems or where PMBus telemetry and digital control outweigh AMD-specific SVI compatibility |
Compared with MAX1993ETL+ and RT8802AGQW, the MAX17080GTL+T uniquely combines AMD SVI-2 compliance, dual-phase interleaving, integrated NB SMPS, and thermistor-based VRHOT in a single 40-pin TQFN - making it the only drop-in solution for new AMD mobile platform designs requiring full feature parity.
Availability
The MAX17080GTL+T is available at Aetrix Electronics and suitable for mobile notebook CPU core supplies, AMD desktop platform northbridge supplies, and voltage-positioned step-down converters requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX17080GTL+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for computing, communications, and industrial applications.
The MAX17080GTL+T belongs to Maxim's AMD Serial VID controller product line, designed specifically to meet the dynamic voltage scaling, thermal management, and multi-rail sequencing requirements of AMD mobile and desktop processor platforms.
FAQ
What is the maximum supported switching frequency for the core SMPS channels in the MAX17080GTL+T?
The MAX17080GTL+T supports an adjustable switching frequency range of 100kHz to 600kHz for each core SMPS (SMPS1 and SMPS2). This is set via the ROSC resistor, with nominal values including 300kHz (ROSC = 143kΩ) and 600kHz (ROSC = 71.4kΩ). The NB SMPS (SMPS3) operates at twice this frequency - up to 1.2MHz - enabling smaller magnetics and output capacitors. Frequency accuracy is ±7.5% over temperature.
Does the MAX17080GTL+T support AMD SVI-2 protocol, and what are the key interface requirements?
Yes, the MAX17080GTL+T is fully AMD SVI-2 compliant. It uses the SVC (clock) and SVD (data) pins for bidirectional 2-wire communication, supporting up to 3.4MHz clock frequency. Interface requirements include VDDIO = 1.0–2.7V logic supply, input thresholds at 0.3×/0.7× VDDIO with 0.14× VDDIO hysteresis, and strict timing (e.g., tSU;DAT ≥ 10ns, tHD;DAT ≥ 70ns). The MAX17080GTL+T also supports switchable SVI address for multi-controller configurations.
How does the MAX17080GTL+T implement thermal protection, and what is the role of the VRHOT pin?
Thermal protection in the MAX17080GTL+T is implemented via the VRHOT pin, which outputs an open-drain signal asserting low when the die temperature exceeds a programmable threshold derived from an external NTC thermistor connected to the THRM pin. The trip point is set at 30% of VCC (29.5–30.5%) with 115mV hysteresis. VRHOT directly interfaces with AMD processors to trigger thermal throttling or safe shutdown - no external comparator or ADC is needed, simplifying system thermal design.
What is the purpose of the FBAC_ pin on the MAX17080GTL+T, and how does it differ from FBDC_?
The FBAC_ pin on the MAX17080GTL+T is the input to the AC droop and current-balance amplifier, used to implement precise load-line regulation and inter-phase current matching. Unlike FBDC_, which senses the DC output voltage for regulation (connected to the feedback divider), FBAC_ monitors the differential current-sense signal (CSP_ – CSN_) to generate a dynamic offset proportional to load current. This enables adaptive voltage positioning (AVP) required by modern AMD CPUs to maintain stability during rapid load transients.
Can the MAX17080GTL+T operate with separate input supplies for its core and NB SMPS sections?
Yes, the MAX17080GTL+T supports independent input supplies: the core SMPSs (SMPS1/SMPS2) accept VIN = 4–26V, while the NB SMPS (SMPS3) accepts VIN3 = 2.7–5.5V. This allows flexible power architecture design - for example, using a main battery rail for CPU cores and a dedicated 3.3V or 5V auxiliary rail for the northbridge. Each section has its own UVLO threshold (VIN3 UVLO = 2.5–2.7V), ensuring reliable startup sequencing even with mismatched input voltages.
MAX17080GTL+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 40-WFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Applications:
- Controller, AMD SVI
- Voltage - Input:
- 2.7V ~ 5.5V
- Number of Outputs:
- 3
- Voltage - Output:
- 0.013V ~ 1.55V
- Operating Temperature:
- -40°C ~ 105°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-TQFN (5x5)
MAX17080GTL+T FAQ
1.How can I place an order for MAX17080GTL+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX17080GTL+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX17080GTL+T reliable?
The price and inventory of MAX17080GTL+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX17080GTL+T is usually 5 days.
3.What payment methods are accepted for MAX17080GTL+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX17080GTL+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX17080GTL+T?
MAX17080GTL+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX17080GTL+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX17080GTL+T?
For technical support, including MAX17080GTL+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX17080GTL+T requirements.
6.How does Aetrix verify that MAX17080GTL+T is sourced from the original manufacturer or authorized distributors?
All MAX17080GTL+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX17080GTL+T meets industry standards.
7.What is the process for return or replacement of MAX17080GTL+T?
All MAX17080GTL+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX17080GTL+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX17080GTL+T part is unused and in its original packaging.
Return procedure for MAX17080GTL+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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