Analog Devices Inc./Maxim Integrated MAX1740EUB

Overview

MAX1740EUB from Maxim Integrated is a SIM/smart card level translator IC designed for bidirectional data, unidirectional clock and reset signal translation between controller-side (DVCC = +1.425V to +5.5V) and card-side (VCC = +2.25V to +5.5V) domains in GSM cellular handsets. It integrates ±10kV HBM ESD protection on all card-contact pins (CLK, RST, IO, VCC, GND), features SHDN-controlled shutdown with 0.01µA total current, and operates up to 5MHz CLK frequency at VCC ≥2.7V.

For engineers reviewing the MAX1740EUB datasheet, MAX1740EUB pinout, MAX1740EUB application, or MAX1740EUB equivalent, key selection criteria include its dual-supply level-shifting architecture, active low-pull during shutdown, 10-pin µMAX package height of 1.09mm, compliance with GSM 11.11/11.12, and support for SPI/QSPI/MICROWIRE voltage translation in multivoltage embedded systems.

Technical Context

The MAX1740EUB implements three dedicated level-shifting paths: CIN→CLK and RIN→RST are unidirectional high-to-low and low-to-high translators; DATA↔IO forms a bidirectional open-drain path with internal 20kΩ pull-up to DVCC and 10kΩ pull-up to VCC. Its shutdown logic asserts SHDN to GND, forcing CLK/RST/IO low while disabling the DATA–IO transfer gate.

ESD protection is implemented per Human Body Model (HBM) on CLK, RST, IO, VCC, and GND pins - rated ±10kV - and remains functional across all operating states including shutdown and power removal. The device supports voltage translation regardless of DVCC/VCC relationship (DVCC ≥ VCC or DVCC ≤ VCC), enabling flexible supply sequencing in battery-powered portable designs.

Key Specifications

Pinout & Package

MAX1740EUB is housed in a 10-pin µMAX package (3.0mm × 3.0mm, 1.09mm height), RoHS-compliant, no exposed pad. Pin numbering follows standard top-view orientation with Pin 1 marked by dot or bevel.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SIM/smart card level translation applications.

Compared with MAX1741EUB, MAX1740EUB provides dedicated SHDN control essential for safe SIM insertion/removal sequencing, while MAX3232ESE+ serves an entirely different interface standard and cannot replace MAX1740EUB in smart card applications.

Availability

MAX1740EUB is available at Aetrix Electronics and suitable for GSM handset design, secure payment terminal development, and industrial SPI/MICROWIRE voltage translation requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MAX1740EUB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX1740EUB belongs to Maxim's SIM/smart card interface product line, engineered specifically to simplify multivoltage smart card integration in space- and power-constrained portable electronics while meeting stringent GSM certification requirements.

FAQ

What is the primary function of the MAX1740EUB in a GSM handset design?

The MAX1740EUB serves as a dedicated SIM/smart card level translator IC in GSM handsets, providing bidirectional data (DATA–IO), unidirectional clock (CIN→CLK), and reset (RIN→RST) translation between controller-side (DVCC = 1.425V–5.5V) and card-side (VCC = 2.25V–5.5V) domains. It also delivers ±10kV HBM ESD protection on all card-contact pins and enables safe hot insertion/removal via SHDN-controlled shutdown - all integrated in a 3mm × 3mm µMAX package.

Does the MAX1740EUB require external pull-up resistors for DATA or IO lines?

No, the MAX1740EUB includes internal pull-up resistors: 20kΩ from DATA to DVCC and 10kΩ from IO to VCC. These eliminate the need for external components in standard open-drain configurations. However, if the controller uses push-pull DATA signaling (not open-drain), the MAX1740EUB cannot drive it directly - in that case, the MAX1741EUB variant with DDRV input is required instead.

How does the MAX1740EUB handle power loss on either DVCC or VCC supply rail?

The MAX1740EUB automatically enters shutdown mode when either DVCC or VCC is removed, reducing total supply current to ≤0.01µA. During this state, CLK, RST, and IO are actively pulled low to prevent floating signals on the SIM socket - a critical requirement for GSM 11.11-compliant hot insertion/removal. This behavior is inherent to the IC's architecture and requires no external control.

Is the MAX1740EUB pin-compatible with the MAX1741EUB?

Yes, the MAX1740EUB and MAX1741EUB share identical 10-pin µMAX packaging and pin assignments. However, Pin 7 functions as SHDN in MAX1740EUB and as DDRV in MAX1741EUB, meaning they are not functionally interchangeable without circuit modification. Board layout can be reused, but firmware and external connections must match the selected variant's control scheme.

What GSM specifications does the MAX1740EUB comply with, and why does it matter?

The MAX1740EUB complies with GSM test specifications 11.11 (mechanical and electrical characteristics of SIM interface) and 11.12 (electrostatic discharge immunity). This compliance validates its ESD robustness (±10kV HBM), voltage translation accuracy, timing margins, and safe shutdown behavior - allowing handset manufacturers to reduce qualification time and avoid costly rework during type approval testing.