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Analog Devices Inc./Maxim Integrated MAX1740EUB+T
- Part No.:
- MAX1740EUB+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
MAX1740EUB+T.pdf
- Description:
- IC INTERFACE SPECIALIZED 10UMAX
- Quantity:
- Payment:
- Shipping:
Inventory:2,170
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Product details
Overview
MAX1740EUB+T from Maxim Integrated is a SIM/smart card level translator IC providing bidirectional data, unidirectional clock/reset level shifting, ±10kV HBM ESD protection on all card-contact pins, and shutdown control for safe card insertion/removal in GSM handsets and smart card readers. It operates with DVCC = +1.425V to +5.5V (controller side) and VCC = +2.25V to +5.5V (card side), drawing ≤2.5µA quiescent current.
For engineers reviewing the MAX1740EUB+T datasheet, MAX1740EUB+T pinout, MAX1740EUB+T application, or MAX1740EUB+T equivalent, this page delivers verified electrical parameters, validated µMAX-10 pin mapping, real-world SIM interface timing behavior, and confirmed alternatives for multivoltage smart card system design.
Technical Context
The MAX1740EUB+T integrates three dedicated level-shifting paths: CIN→CLK and RIN→RST (unidirectional controller-to-card), and DATA↔IO (bidirectional with internal 20kΩ pull-up to DVCC and 10kΩ pull-up to VCC). Its transfer-gate architecture supports level translation regardless of DVCC ≥ VCC or DVCC ≤ VCC relationships.
Shutdown is activated by driving SHDN low (MAX1740-specific), forcing CLK, RST, and IO actively low while disabling the DATA–IO transfer gate and reducing total supply current to ≤0.01µA. All card-side pins (CLK, RST, IO, VCC, GND) meet ±10kV HBM ESD per GSM 11.11/11.12.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DVCC Range | +1.425V to +5.5V - supports 1.8V/2.5V/3.3V/5V controller logic without external level shifters |
| VCC Range | +2.25V to +5.5V - matches standard SIM/smart card voltage requirements (3V/5V) |
| Total Quiescent Current | ≤2.5µA - enables ultra-low-power operation in battery-powered mobile handsets |
| Shutdown Current | ≤0.01µA - ensures zero-load state during SIM hot-swap, preventing card damage |
| ESD Protection | ±10kV HBM on CLK/RST/IO/VCC/GND - satisfies GSM 11.11/11.12 compliance for field-reliable deployment |
| Max CLK Frequency | 5MHz at VCC = 2.7V–5.5V - supports full-speed SIM clocking up to 5MHz (GSM Class 10) |
| DATA Pull-Up | 13–28kΩ to DVCC - provides robust open-drain termination for I²C-/SPI-like bidirectional protocols |
Pinout & Package
MAX1740EUB+T is housed in a 10-pin µMAX package (3.0mm × 3.0mm × 1.09mm), RoHS-compliant, no exposed pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - DATA | Controller-side bidirectional I/O | Open-drain I/O with 20kΩ internal pull-up to DVCC; connects to microcontroller DATA line; requires external open-drain driver or DDRV (MAX1741 only) |
| 2 - IO | Card-side bidirectional I/O | Open-drain I/O with 10kΩ internal pull-up to VCC; connects directly to SIM card I/O pin; actively pulled low in shutdown |
| 3 - VCC | Card-side power supply | +2.25V to +5.5V input powering card-side outputs (CLK, RST, IO); bypass capacitor required for ESD compliance |
| 4 - CLK | Card-side clock output | Unidirectional level-shifted output driven from CIN; actively pulled low during shutdown; meets SIM clock timing specs |
| 5 - RST | Card-side reset output | Unidirectional level-shifted output driven from RIN; actively pulled low during shutdown; ensures safe card reset sequencing |
| 6 - GND | System ground reference | Common return for both controller and card domains; must be low-impedance connection to meet ESD path requirements |
| 7 - CIN | Controller clock input | Logic-level input referenced to DVCC; drives CLK output; accepts 1.425V–5.5V swing; 5ns rise/fall time compatible |
| 8 - RIN | Controller reset input | Logic-level input referenced to DVCC; drives RST output; same voltage range and timing as CIN |
| 9 - DVCC | Controller-side power supply | +1.425V to +5.5V input powering controller-side circuitry (DATA, CIN, RIN, SHDN); decoupling mandatory |
| 10 - SHDN | Shutdown enable input | Active-low control (MAX1740 only); drives device into <0.01µA state; pulls CLK/RST/IO low and disables DATA–IO path |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional DATA–IO level translation | Enables full-duplex SIM communication across mismatched DVCC/VCC rails (e.g., 1.8V MCU ↔ 3V SIM) without external transceivers |
| ±10kV HBM ESD on card-contact pins | Eliminates need for discrete TVS diodes on CLK/RST/IO/VCC/GND, reducing BOM count and PCB area in space-constrained handsets |
| Automatic shutdown on supply loss | Guarantees safe state if DVCC or VCC fails - CLK/RST/IO forced low, preventing back-drive or latch-up during brownout |
| SHDN-controlled hot-swap support | Allows live SIM insertion/removal by asserting SHDN before physical contact, satisfying GSM mechanical safety requirements |
| GSM 11.11/11.12 compliance | Validated for use in certified GSM cellular telephones without additional qualification testing for SIM interface section |
Applications
| Smart Card Readers | SIM Interface in GSM Handsets |
|---|---|
|
Use Scenario: Desktop or portable reader interfacing ISO 7816 smart cards operating at 3V or 5V with a 1.8V/3.3V host MCU. IC Role / Device Role / Timing Role: Level translator and ESD protector for CLK, RST, and I/O signals; manages voltage domain isolation and hot-plug safety. Use Value: Enables single-chip interface between low-voltage controllers and legacy 5V smart cards while meeting IEC 61000-4-2 Level 4 ESD immunity. |
Use Scenario: Baseband processor in dual-SIM GSM mobile phone requiring independent level translation and ESD protection per SIM slot. IC Role / Device Role / Timing Role: Dedicated SIM interface IC handling clock/reset/data translation, shutdown sequencing, and GSM 11.11-compliant ESD. Use Value: Reduces system-level validation effort by integrating certified ESD and timing-compliant signal conditioning into one µMAX-10 device. |
| SPI/QSPI/MICROWIRE Level Translation | Secure Element Interface |
|
Use Scenario: 3.3V microcontroller communicating with 5V SPI flash or EEPROM using standard SCLK/CS/DIO protocol. IC Role / Device Role / Timing Role: Unidirectional clock/select translator (CIN→CLK, RIN→RST) and bidirectional data translator (DATA↔IO). Use Value: Supports 5MHz SPI clock rates with guaranteed 40–60% duty cycle, eliminating timing skew issues common in resistor-based translators. |
Use Scenario: Host processor connecting to embedded secure element (eSE) or UICC in payment-enabled wearables or IoT devices. IC Role / Device Role / Timing Role: Secure channel interface IC providing ESD-hardened, low-leakage, shutdown-safe connection to tamper-resistant hardware. Use Value: Maintains <0.01µA shutdown current during eSE sleep mode, extending battery life in always-on secure authentication applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM/smart card level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1741EUB+T | Replaces SHDN with DDRV input; adds system-side push-pull data driver for MCUs lacking open-drain outputs | Required when controller uses push-pull DATA output instead of open-drain; not pin-compatible due to DDRV vs SHDN pin swap | Select MAX1741EUB+T only if host MCU lacks open-drain capability on DATA line; otherwise MAX1740EUB+T is preferred for simpler control |
| MAX3232ESE+ | RS-232 transceiver with ±15kV ESD; no integrated SIM-level translation logic or shutdown control | Not suitable for SIM interface - lacks bidirectional DATA/IO path, GSM timing compliance, or VCC/DVCC dual-rail support | Not a functional alternative; included only as common mis-selection - verify SIM-specific function before substitution |
Compared with MAX1741EUB+T, MAX1740EUB+T offers simpler shutdown control but requires an open-drain controller DATA output; compared with MAX3232ESE+, MAX1740EUB+T delivers purpose-built SIM signal conditioning with validated GSM compliance and sub-µA power states.
Availability
MAX1740EUB+T is available at Aetrix Electronics and suitable for GSM handset design, smart card reader manufacturing, and secure element interface development requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for MAX1740EUB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX1740EUB+T belongs to Maxim's SIM/smart card interface product line, engineered specifically to simplify multivoltage smart card integration in space- and power-constrained portable electronics.
FAQ
What is the maximum clock frequency supported by the MAX1740EUB+T?
The MAX1740EUB+T supports a maximum CLK frequency of 5MHz when VCC is between 2.7V and 5.5V, with output duty cycle maintained between 40% and 60%. At lower VCC (2.25V–3.6V), the max frequency is 4MHz. These values are guaranteed by design per the datasheet timing specifications.
Does the MAX1740EUB+T require external pull-up resistors on the DATA or IO lines?
No. The MAX1740EUB+T integrates a 20kΩ pull-up resistor from DATA to DVCC and a 10kΩ pull-up resistor from IO to VCC. These internal terminations eliminate the need for external components in standard open-drain SIM interfaces, reducing BOM cost and board area.
How does the MAX1740EUB+T handle power loss on either DVCC or VCC supply rail?
The MAX1740EUB+T automatically enters shutdown mode when either DVCC or VCC is removed. In this state, CLK, RST, and IO are actively pulled low, the DATA–IO transfer gate is disabled, and total supply current drops to ≤0.01µA - preventing back-driving or latch-up during brownout conditions.
Is the MAX1740EUB+T compliant with GSM 11.11 and 11.12 test specifications?
Yes. The MAX1740EUB+T is explicitly stated in its datasheet as compliant with GSM test specifications 11.11 and 11.12, covering SIM mechanical, electrical, and ESD requirements - including ±10kV HBM protection on all card-contact pins (CLK, RST, IO, VCC, GND).
Can the MAX1740EUB+T be used with a 1.425V controller supply (DVCC)?
Yes. The MAX1740EUB+T supports DVCC down to +1.425V, enabling direct interface with ultra-low-voltage microcontrollers (e.g., 1.4V–1.8V core logic). All logic inputs (CIN, RIN, SHDN) and outputs (DATA) remain fully functional across this range, with VIH/VIL thresholds scaling proportionally to DVCC.
MAX1740EUB+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Smart Card
- Interface:
- MICROWIRE™, QSPI™, Serial, SPI™
- Voltage - Supply:
- 1.43V ~ 5.5V, 2.25V ~ 5.5V
- Supplier Device Package:
- 10-uMAX/uSOP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MAX1740EUB+T FAQ
1.How can I place an order for MAX1740EUB+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX1740EUB+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX1740EUB+T reliable?
The price and inventory of MAX1740EUB+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1740EUB+T is usually 5 days.
3.What payment methods are accepted for MAX1740EUB+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1740EUB+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX1740EUB+T?
MAX1740EUB+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX1740EUB+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX1740EUB+T?
For technical support, including MAX1740EUB+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1740EUB+T requirements.
6.How does Aetrix verify that MAX1740EUB+T is sourced from the original manufacturer or authorized distributors?
All MAX1740EUB+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1740EUB+T meets industry standards.
7.What is the process for return or replacement of MAX1740EUB+T?
All MAX1740EUB+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX1740EUB+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX1740EUB+T part is unused and in its original packaging.
Return procedure for MAX1740EUB+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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