Analog Devices Inc./Maxim Integrated MAX1741EUB

Overview

MAX1741EUB from Maxim Integrated is a SIM/smart card level translator IC designed for bidirectional voltage-level shifting between controller-side (DVCC = +1.425V to +5.5V) and card-side (VCC = +2.25V to +5.5V) domains, integrating ±10kV HBM ESD protection on all card-contact pins (CLK, RST, IO, VCC, GND), a system-side data driver (DDRV), and automatic shutdown when either supply is removed. It enables secure, low-power GSM cellular phone SIM interfaces.

For engineers reviewing the MAX1741EUB datasheet, MAX1741EUB pinout, MAX1741EUB application, or MAX1741EUB equivalent, key selection criteria include its 10-pin µMAX package, 2.5µA max operating current, DDRV-enabled support for non-open-drain microcontrollers, ±10kV ESD rating per GSM 11.11/11.12, and bidirectional DATA/IO translation with internal 13–28kΩ pull-up to DVCC and 6.5–14kΩ pull-up to VCC.

Technical Context

The MAX1741EUB implements three dedicated level-shifting paths: unidirectional CIN→CLK and RIN→RST (controller-to-card), and bidirectional DATA↔IO (controller↔card), with internal transfer gates enabling direction control via drive state. Its DDRV input allows push-pull controllers to drive the card-side IO line without external circuitry.

Shutdown is triggered by removing DVCC, VCC, or driving DDRV low (MAX1741-specific active-low enable), pulling CLK, RST, and IO actively low while disabling internal pull-ups and reducing total supply current to ≤0.01µA. All card-contact pins meet ±10kV Human Body Model ESD per GSM 11.11/11.12.

Key Specifications

Pinout & Package

MAX1741EUB is housed in a 10-pin µMAX package (3mm × 3mm, 1.09mm height), no exposed pad, RoHS-compliant, and pin-compatible with MAX1740EUB except for SHDN/DDRV functionality.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SIM/smart card level translation applications.

Compared with MAX1740EUB, MAX1741EUB adds DDRV to support push-pull controllers without external components, while MAX3232ESE+ serves a different interface standard entirely and cannot replace SIM-level translation or meet GSM 11.11/11.12 requirements.

Availability

MAX1741EUB is available at Aetrix Electronics and suitable for GSM handset design, smart card reader manufacturing, and industrial SPI level-shifting applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MAX1741EUB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer markets.

The MAX1740/MAX1741 product line was engineered specifically for SIM and smart card interface compliance - delivering integrated level shifting, ESD protection, and shutdown control in minimal footprint for space- and power-constrained portable electronics.

FAQ

What is the primary function of the MAX1741EUB in a SIM interface?

The MAX1741EUB serves as a dual-supply level translator and ESD protector between a system controller (DVCC = 1.425–5.5V) and a SIM/smart card (VCC = 2.25–5.5V). It shifts CIN→CLK, RIN→RST unidirectionally and enables bidirectional DATA↔IO translation, with DDRV supporting push-pull controllers. Its ±10kV HBM ESD protection on all card-contact pins satisfies GSM 11.11/11.12 requirements, and MAX1741EUB's DDRV eliminates need for external drivers in modern microcontrollers.

How does the MAX1741EUB handle power loss on either supply rail?

MAX1741EUB automatically enters shutdown mode when DVCC, VCC, or DDRV is driven low - pulling CLK, RST, and IO actively low and disabling internal pull-up resistors. This guarantees safe SIM card insertion/removal per GSM specifications. Total supply current drops to ≤0.01µA, preventing backfeeding or latch-up. Unlike MAX1740EUB, MAX1741EUB uses DDRV (not SHDN) as the primary shutdown trigger, aligning with push-pull controller architectures.

Can the MAX1741EUB operate with DVCC lower than VCC?

Yes, MAX1741EUB supports bidirectional level translation regardless of relative supply voltages: it functions correctly with DVCC ≥ VCC (e.g., 3.3V controller → 1.8V card) or DVCC ≤ VCC (e.g., 1.8V controller → 5V card). This flexibility is enabled by its gate-controlled transfer structure and independent pull-up networks (DATA→DVCC, IO→VCC), making MAX1741EUB suitable for heterogeneous voltage systems without redesign.

What is the role of the DDRV pin on the MAX1741EUB?

The DDRV pin on MAX1741EUB is an active-high data driver enable that allows push-pull microcontrollers (lacking open-drain outputs) to drive the card-side IO line directly. When DDRV is high, the internal driver activates to source/sink current on IO; when low or tied to DVCC, MAX1741EUB reverts to standard open-drain bidirectional mode using DATA. This eliminates external MOSFETs or resistor networks required by MAX1740EUB in similar applications.

Does the MAX1741EUB require external passive components for basic operation?

No, MAX1741EUB integrates all essential passives: 13–28kΩ pull-up from DATA to DVCC and 6.5–14kΩ pull-up from IO to VCC. Only two 1µF ceramic bypass capacitors (one on DVCC, one on VCC) are required for stable operation and ±10kV ESD compliance. No external level-shifting resistors, TVS diodes, or pull-ups are needed - reducing BOM count and PCB area versus discrete solutions.