Analog Devices Inc./Maxim Integrated MAX1741EUB+T

Overview

MAX1741EUB+T from Maxim Integrated is a SIM/smart card level translator IC integrating two unidirectional level shifters (for CLK and RST), one bidirectional level shifter (for DATA/IO), ±10kV HBM ESD protection on all card-contact pins, and a system-side data driver (DDRV) for controllers lacking open-drain outputs. It operates with DVCC = +1.425V to +5.5V (controller side) and VCC = +2.25V to +5.5V (card side), drawing ≤2.5µA quiescent current, and is used in GSM cellular handsets and smart card readers.

For engineers reviewing the MAX1741EUB+T datasheet, MAX1741EUB+T pinout, MAX1741EUB+T application, or MAX1741EUB+T equivalent, key selection criteria include bidirectional data translation capability with DDRV support, ultra-low shutdown current (0.01µA), 10-pin µMAX package height (1.09mm), GSM 11.11/11.12 compliance, and compatibility with 1.425V–5.5V logic supply ranges.

Technical Context

The MAX1741EUB+T implements voltage-level translation between asymmetric power domains: controller-side DVCC (1.425V–5.5V) and card-side VCC (2.25V–5.5V), supporting both DVCC ≥ VCC and DVCC ≤ VCC configurations. Its internal architecture includes dedicated transfer gates for CIN→CLK and RIN→RST unidirectional paths, plus a bidirectional DATA↔IO path with integrated 20kΩ pull-up to DVCC and 10kΩ pull-up to VCC.

Unlike the MAX1740, the MAX1741EUB+T features DDRV - a dedicated system-side data input enabling push-pull microcontrollers to drive the card-side IO without external components. During shutdown (triggered by DVCC = GND, VCC = GND, or DDRV = GND), CLK, RST, and IO are actively pulled low, and internal pull-ups are disconnected to prevent leakage.

Key Specifications

Pinout & Package

MAX1741EUB+T uses a 10-pin µMAX package (3mm × 3mm, 1.09mm height), no exposed pad, RoHS-compliant, and rated for –40°C to +85°C operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SIM/smart card level translation applications.

Compared with MAX1740EUB+T, the MAX1741EUB+T adds DDRV-driven data output for push-pull controllers but shares identical package, ESD rating, and shutdown behavior. Neither part is pin-compatible with MAX3232ESE+, which serves a fundamentally different interface protocol and voltage domain.

Availability

MAX1741EUB+T is available at Aetrix Electronics and suitable for GSM handset design, smart card reader manufacturing, and wearable eSIM integration requiring stable component supply, long-lifecycle availability, and traceable sourcing.

Supply support for MAX1741EUB+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.

The MAX1741EUB+T belongs to Maxim's SIM/smart card interface product line, engineered specifically to simplify compliant, low-power, space-efficient SIM card connectivity in mobile and portable electronics.

FAQ

What is the primary function of the MAX1741EUB+T in a SIM card interface?

The MAX1741EUB+T serves as a dedicated level translator between asymmetric voltage domains: it shifts controller-side signals (DVCC = 1.425V–5.5V) to card-side levels (VCC = 2.25V–5.5V) for CLK, RST, and bidirectional DATA/IO. Its integrated DDRV input allows push-pull microcontrollers to drive the SIM card's IO line without external components, making the MAX1741EUB+T essential for compact, low-power GSM handset and eSIM designs.

How does the MAX1741EUB+T handle shutdown during SIM card insertion or removal?

The MAX1741EUB+T enters shutdown when DVCC = GND, VCC = GND, or DDRV = GND - automatically pulling CLK, RST, and IO low to meet GSM 11.11 mechanical safety requirements. In this state, total supply current drops to 0.01µA, and internal pull-up resistors disconnect to prevent current leakage into the card socket. This behavior ensures safe hot-swap operation without external sequencing circuitry.

Can the MAX1741EUB+T operate with DVCC lower than VCC, such as 1.8V controller driving a 3V SIM card?

Yes, the MAX1741EUB+T explicitly supports DVCC ≤ VCC operation - including 1.8V DVCC driving 3V VCC - without external biasing or level-shifting components. Its transfer-gate architecture maintains valid logic thresholds (VIL = 0.2·DVCC, VIH = 0.7·DVCC) and output drive strength (VOL ≤ 0.4V, VOH ≥ 0.8·VCC) across the full specified range, enabling direct use in modern low-voltage mobile SoC designs interfacing to legacy 3V/5V SIM cards.

What is the role of the DDRV pin on the MAX1741EUB+T, and how does it differ from the MAX1740EUB+T?

The DDRV pin on the MAX1741EUB+T is a dedicated system-side data input that enables push-pull microcontrollers (e.g., most ARM Cortex-M MCUs) to drive the SIM card's IO line without requiring open-drain configuration. When DDRV is asserted, it overrides the DATA pin's direction and sources current to IO via an internal driver. The MAX1740EUB+T lacks DDRV and instead uses SHDN for shutdown control, making it unsuitable for systems without open-drain GPIOs.

Does the MAX1741EUB+T meet GSM certification requirements for SIM card interfaces?

Yes, the MAX1741EUB+T is explicitly designed and validated to comply with GSM test specifications 11.11 and 11.12, covering mechanical safety (hot-swap sequencing), electrical characteristics (voltage levels, timing), and ESD robustness (±10kV HBM on CLK, RST, IO, VCC, GND). This compliance is documented in Maxim's official datasheet and enables direct use in certified GSM handsets and smart card readers without additional qualification testing.