My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX17510ATC/V+
- Part No.:
- MAX17510ATC/V+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Special Purpose Regulators
- Package:
- 10-WFDFN Exposed Pad
- Datasheet:
-
MAX17510ATC/V+.pdf
- Description:
- DDR LDO; (1.5A MIN)
- Quantity:
- Payment:
- Shipping:
Inventory:4,189
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX17510ATC/V+ from Analog Devices is a high-precision, dual-direction DDR linear regulator designed for active termination of DDR memory buses. It sources and sinks up to 3A peak (typ), delivers 0.5V–1.5V output from 1.1V–3.6V input, uses separate 3.3V bias (VCC) for gate drive, and features ±15mV max load-regulation error over –40°C to +125°C. It is deployed in DDR4/DDR5 memory subsystems requiring fast transient response and tracking reference capability.
For engineers reviewing the MAX17510ATC/V+ datasheet, MAX17510ATC/V+ pinout, MAX17510ATC/V+ application, or MAX17510ATC/V+ equivalent, key selection considerations include its dual-source/sink current capability, thermal shutdown at +165°C, PGOOD startup delay of 2ms (typ), ±150mV PGOOD trip window, and compatibility with ceramic/polymer output capacitors in compact TDFN packages.
Technical Context
The MAX17510ATC/V+ implements a dual-MOSFET linear architecture with independent n-channel source and sink pass transistors, enabling bidirectional current flow required for DDR VTT termination. Its external reference input (REFIN) directly sets the regulated output voltage (VOUTS = VREFIN), while REFOUT provides a buffered, low-impedance DDR reference supply (VTTR) capable of sourcing/sinking >5mA.
Operation relies on a dedicated 2.7V–3.6V VCC bias rail to drive internal MOSFET gates-decoupling control logic efficiency from the lower VIN rail (1.1V–3.6V). It integrates shoot-through protection, soft-start (200µs), current limiting (1.5A min to 4.2A max over temperature), and thermal shutdown with 15°C hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Range | 0.5V to 1.5V - set precisely by external REFIN voltage; supports DDR3/4/5 VTT tracking requirements. |
| Source/Sink Current Limit | 1.5A (min) to 4.2A (max) - guaranteed over –40°C to +125°C; enables robust DDR bus termination under dynamic load steps. |
| Load Regulation Error | ±15mV (max) - ensures stable VTT within JEDEC-specified tolerance bands across full ±1A load range. |
| PGOOD Startup Delay | 1ms to 3.5ms (typ 2ms) - provides reliable power sequencing confirmation before system initialization proceeds. |
| Thermal Shutdown Threshold | +165°C (rising edge) - protects die integrity during sustained overload or poor PCB heatsinking. |
| Input Voltage Range (VIN) | 1.1V to 3.6V - allows direct connection to memory supply rails (e.g., VDDQ = 1.2V, 1.35V, 1.5V) with minimal dropout loss. |
| VCC Bias Supply Range | 2.7V to 3.6V - powers gate drivers independently, enabling high-efficiency operation even when VIN is near VOUT. |
Pinout & Package
MAX17510ATC/V+ is housed in a 10-pin, 3mm × 3mm thin DFN package with exposed pad (TDFN-EP), optimized for thermal performance in space-constrained DDR memory modules. The exposed pad must be soldered to AGND for effective heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - REFOUT | Buffered reference output | Unity-gain VTTR buffer; sources/sinks >5mA; bypass with ≥0.33µF ceramic capacitor to AGND. |
| 2 - VCC | Analog bias supply input | Powers control circuitry and MOSFET gate drivers; requires ≥1µF ceramic bypass to AGND. |
| 3 - AGND | Analog ground reference | Reference node for REFIN, REFOUT, SHDN, PGOOD; connects internally to exposed pad. |
| 4 - REFIN | External voltage reference input | Sets regulated VOUTS = VREFIN; accepts 0.5V–1.5V; input bias current ±1µA (max). |
| 5 - PGOOD | Open-drain power-good indicator | Asserts high-Z after 2ms regulation lock; trips low within 10µs if VOUTS deviates ±150mV. |
| 6 - OUTS | Remote output sense input | Connects to DDR termination capacitors; internally tied to OUT via 12kΩ resistor for Kelvin sensing. |
| 7 - SHDN | Active-low shutdown control | Drives low to disable regulation; OUT pulled to GND via 8Ω MOSFET; REFOUT remains active. |
| 8 - PGND | Power ground return | Return path for sink MOSFET; must be connected to low-impedance ground plane near IN/OUT. |
| 9 - OUT | Main regulated output | Delivers VTT to DDR termination network; capable of sourcing/sinking up to 3A peak. |
| 10 - IN | Power input supply | Drain connection of source MOSFET; accepts 1.1V–3.6V; bypass with ≥10µF ceramic capacitor to PGND. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-direction current capability | Sources and sinks up to 3A peak (typ) - meets DDR active termination demand for simultaneous pull-up/pull-down current. |
| Tracking reference interface | REFIN-to-VOUTS accuracy ±4mV (typ) at +25°C - enables precise VTT = VDDQ/2 tracking without external compensation. |
| Fast transient response | ≤10mV output deviation for ±1.5A load step - maintains signal integrity during DDR burst transfers. |
| Integrated fault protection | Current limit, thermal shutdown (+165°C), UVLO on VIN (0.9V–1.1V) and VCC (2.45V–2.65V) - prevents damage under overcurrent, overtemperature, or undervoltage conditions. |
| Automotive-grade reliability | Qualified per AEC-Q100 Grade 1 (–40°C to +125°C) - suitable for infotainment and ADAS memory subsystems requiring extended temperature operation. |
Applications
| DDR Memory Termination | Graphics Processor Core Supply |
|---|---|
Use Scenario: Providing matched VTT termination for DDR4/DDR5 memory channels in notebook/desktop platforms. IC Role / Device Role / Timing Role: Dual-direction linear regulator delivering precise, low-noise VTT referenced to VDDQ. Use Value: Maintains ±15mV load regulation across ±1A load swings, ensuring signal integrity and JEDEC compliance for high-speed memory interfaces. |
Use Scenario: Dynamically adjustable core supply for GPU voltage scaling during performance state transitions. IC Role / Device Role / Timing Role: Linear regulator with external REFIN control enabling rapid VOUT reconfiguration between two setpoints (e.g., 0.9V/1.25V). Use Value: Achieves <20µs transient settling via REFOUT-buffered reference and fast slew rate, supporting GPU DVFS without external DAC. |
| Chipset/RAM Power Delivery | Active Termination Buses |
Use Scenario: Low-voltage, high-current supply for chipset I/O or RAM auxiliary rails operating down to 0.5V. IC Role / Device Role / Timing Role: Precision LDO with 0.5V–1.5V programmable output and ±15mV regulation accuracy. Use Value: Delivers stable sub-1V rails with minimal dropout (RDS(ON) ≤ 0.25Ω), reducing power loss versus traditional LDOs in ultra-low-voltage domains. |
Use Scenario: Bidirectional termination for high-speed differential buses such as LPDDR or custom active-terminated interconnects. IC Role / Device Role / Timing Role: Source/sink regulator with shoot-through protection and 200µs soft-start. Use Value: Prevents bus contention during state transitions while limiting inrush current to protect upstream DC/DC converters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar DDR linear regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX17510ATB/V+ | Same electrical specs and pinout; differs only in top mark (AWX vs AWQ) and package thermal resistance (θJA = 41°C/W for both); identical -40°C to +125°C rating. | Functionally interchangeable in all DDR termination designs; no layout or firmware changes required. | Select MAX17510ATB/V+ only if legacy board design specifies that top mark or if inventory availability favors it. |
| TPS51200DRCR | TI DDR termination regulator; 3A sink/2A source; no REFOUT buffer; requires external reference; different pinout (10-pin VSON vs TDFN); θJA = 45°C/W. | Lacks integrated VTTR buffer and REFIN tracking; needs external resistor divider and reference IC for DDR3/4 VTT/VREF generation. | Choose only if existing TI-based platform mandates footprint compatibility or if REFOUT functionality is not required. |
Compared with MAX17510ATB/V+, the MAX17510ATC/V+ offers identical performance but reflects updated manufacturing traceability (top mark BFC); versus TPS51200DRCR, it eliminates external reference components and simplifies layout via integrated REFOUT and REFIN tracking-reducing BOM count and improving noise immunity in dense memory modules.
Availability
MAX17510ATC/V+ is available at Aetrix Electronics and suitable for DDR memory termination, graphics processor core supplies, and active termination buses requiring stable component supply across automotive (-40°C to +125°C) and industrial temperature ranges.
Supply support for MAX17510ATC/V+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving precision instrumentation, communications, and industrial markets since 1965.
The MAX17510 is part of Analog Devices' DDR power management portfolio, engineered specifically for low-noise, high-transient-response active termination in DDR3/4/5 memory systems and dynamically scalable GPU core supplies.
FAQ
What is the maximum continuous output current capability of the MAX17510ATC/V+?
The MAX17510ATC/V+ supports ±1.6A RMS continuous output current for 100 seconds and ±2.5A RMS for 1 second under thermal-limited conditions. Its current-limit threshold is specified from 1.5A (min) to 4.2A (max) across –40°C to +125°C, enabling robust DDR bus termination during burst-mode operation. Peak sourcing/sinking capability reaches 3A (typ) with proper PCB thermal design.
Does the MAX17510ATC/V+ require an external reference voltage source?
No - the MAX17510ATC/V+ does not require an external reference source. It uses the voltage applied to its REFIN pin as the regulation setpoint (VOUTS = VREFIN), and its REFOUT pin provides a buffered, low-impedance copy of that reference (VTTR) capable of sourcing/sinking >5mA. This eliminates need for external reference ICs in DDR termination applications.
How does the PGOOD signal behave during startup and fault conditions for the MAX17510ATC/V+?
During startup, the MAX17510ATC/V+ holds PGOOD low until VOUTS remains within ±150mV of the REFIN-set voltage for 2ms (typ), then releases it to high-impedance. During faults-including output deviation >±150mV, thermal shutdown, or SHDN assertion-PGOOD pulls low within 10µs. A pullup resistor to VCC is required for logic-level interfacing.
Can the MAX17510ATC/V+ operate with input voltages below 1.2V?
Yes - the MAX17510ATC/V+ supports VIN as low as 1.1V (min), making it suitable for low-voltage DDR implementations such as LPDDR4/LPDDR5 where VDDQ may be 1.1V or 1.05V. Its n-channel MOSFET architecture and separate 3.3V VCC bias enable efficient regulation even with minimal VIN–VOUT differential.
Is the MAX17510ATC/V+ pin-compatible with earlier MAX1510 variants?
No - the MAX17510ATC/V+ shares the same 10-pin TDFN package and pinout as the MAX1510/MAX17510 family, but it is not pin-compatible with MAX1510 variants rated only to +85°C (e.g., MAX1510ETB). While electrically identical in function, MAX17510ATC/V+ is qualified for –40°C to +125°C operation and includes updated thermal specifications and automotive qualification (AEC-Q100 Grade 1).
MAX17510ATC/V+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 10-WFDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- LDO (Linear), DDR
- Voltage - Input:
- 1.1V ~ 3.6V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.5V ~ 1.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 10-TDFN (3x3)
MAX17510ATC/V+ FAQ
1.How can I place an order for MAX17510ATC/V+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX17510ATC/V+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX17510ATC/V+ reliable?
The price and inventory of MAX17510ATC/V+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX17510ATC/V+ is usually 5 days.
3.What payment methods are accepted for MAX17510ATC/V+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX17510ATC/V+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX17510ATC/V+?
MAX17510ATC/V+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX17510ATC/V+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX17510ATC/V+?
For technical support, including MAX17510ATC/V+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX17510ATC/V+ requirements.
6.How does Aetrix verify that MAX17510ATC/V+ is sourced from the original manufacturer or authorized distributors?
All MAX17510ATC/V+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX17510ATC/V+ meets industry standards.
7.What is the process for return or replacement of MAX17510ATC/V+?
All MAX17510ATC/V+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX17510ATC/V+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX17510ATC/V+ part is unused and in its original packaging.
Return procedure for MAX17510ATC/V+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX17510ATC/V+ Tags
-
TPS51206DSQR
Texas Instruments
-
TPS51200DRCR
Texas Instruments
-
TPS51200DRCT
Texas Instruments
-
TPS62740DSSR
Texas Instruments
-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi
-
RT9026GSP
Richtek USA Inc.
-
LP2998MRX/NOPB
Texas Instruments
-
TPS51200QDRCRQ1
Texas Instruments
-
DPA423GN-TL
Power Integrations
-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
