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Analog Devices Inc./Maxim Integrated MAX1809EEE+TG002

Part No.:
MAX1809EEE+TG002
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Special Purpose Regulators
Package:
-
Datasheet:
AetrixMAX1809EEE+TG002.pdf
Description:
INTEGRATED CIRCUIT
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Inventory:4,250

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Product details

Overview

The MAX1809EEE+TG002 from Maxim Integrated is a reversible-energy-flow, constant-off-time, synchronous PWM step-down DC-DC converter optimized for DDR memory active termination. It delivers ±3A sourcing/sinking current, achieves up to 93% efficiency at 1.25V/3.3V operation, supports 3V–5.5V input, and provides 1.1V–VIN adjustable output with ±1% accuracy-enabling precise VTT regulation in notebook/subnotebook DDR systems.

For engineers reviewing the MAX1809EEE+TG002 datasheet, MAX1809EEE+TG002 pinout, MAX1809EEE+TG002 application, or MAX1809EEE+TG002 equivalent, key selection considerations include its bidirectional current capability, programmable 0.24–5.2µs off-time (up to 1MHz), internal 90mΩ PMOS / 70mΩ NMOS switches, thermal shutdown, and 16-pin QSOP package compatibility with DDR termination load-transient response requirements.

Technical Context

The MAX1809EEE+TG002 implements a current-mode, constant-off-time PWM architecture that enables true bidirectional energy flow-sourcing current during normal buck operation and sinking current to return energy to VIN during bus termination discharge. Its control loop regulates by dynamically adjusting on-time while holding off-time fixed via external RTOFF.

This architecture delivers fast line/load transient response, inherent frequency stability under varying loads, and seamless transition between sourcing and sinking modes without mode switching artifacts. The device integrates a precision reference (1.100V ±1.1%), feedback comparator with 20mV load regulation error, and internal gate drivers optimized for low shoot-through risk in synchronous rectification.

Key Specifications

ParameterValue and Actual Design Meaning
Output Current±3A continuous sourcing/sinking-supports DDR VTT rail dynamic termination of high-speed memory buses.
Input Voltage Range3.0V to 5.5V-compatible with standard notebook battery and main supply rails.
Output Voltage Range1.1V to VIN-adjustable via external reference (EXTREF) or resistor divider at FB pin.
Switching FrequencyUp to 1MHz-set by RTOFF; enables compact magnetics and reduced EMI filtering.
EfficiencyUp to 93% at 1.25V/3.3V-achieved via integrated 90mΩ PMOS + 70mΩ NMOS synchronous switches.
Feedback Accuracy±1% (±12mV at VEXTREF = 1.25V)-ensures tight DDR termination voltage compliance (e.g., 1.25V ±40mV).
Shutdown Current<1µA-minimizes system standby power in portable applications.

Pinout & Package

The MAX1809EEE+TG002 is packaged in a 16-pin QSOP (Quad Small Outline Package) with gull-wing leads, rated for -40°C to +85°C operation. Thermal performance relies on proper PCB copper area and grounding per layout guidelines.

Pin/TerminalCircuit RoleDesign Meaning
IN (Pins 2,4)Power InputConnects to main supply rail (3V–5.5V); all IN pins must be externally tied together.
LX (Pins 3,14,16)Switch NodeDrain connection of internal PMOS/NMOS switches; connects directly to inductor and output filter.
EXTREF (Pin 7)Voltage Reference InputSets regulated output voltage; e.g., 1.25V for DDR VTT; device remains off until EXTREF > REF.
FB (Pin 9)Feedback InputDirect connection to output (fixed mode) or resistive divider (adjustable mode); senses regulated voltage.
TOFF (Pin 8)Off-Time ProgrammingResistor-to-GND sets constant off-time (0.24–5.2µs), determining switching frequency up to 1MHz.
SS (Pin 6)Soft-Start ControlCapacitor-to-GND limits inrush current; 4µA current source ramps internal current limit from 0 to full scale.
SHDN (Pin 1)Shutdown EnableLogic-low disables all circuitry and MOSFETs; draws <1µA; logic-high or VCC connection enables operation.
GND (Pins 11,15)Analog GroundReference node for analog circuitry; tie to system ground plane with low-inductance path.
VCC (Pin 12)Analog SupplyPowers internal analog blocks; requires 10Ω + 2.2µF RC filter for noise immunity.
REF (Pin 10)Internal Reference Output1.100V ±1.1% reference; bypass to GND with 1µF capacitor for stability.
PGND (Pins 13,15)Power GroundReturn path for NMOS switch current; connect to local power ground near LX and output capacitor.

Key Features

FeatureDesign Value
Reversible Energy FlowSource/sink ±3A continuously-enables active DDR bus termination with energy recovery to input rail.
Integrated Power Switches90mΩ PMOS + 70mΩ NMOS at VIN = 4.5V-eliminates external Schottky diode and reduces conduction losses.
Programmable Constant Off-TimeRTOFF-set tOFF from 0.24µs to 5.2µs-allows optimization of efficiency, noise, and component size across 300kHz–1MHz range.
Adjustable Soft-StartCapacitor-controlled ramp of current limit-prevents input surge during power-up and shutdown exit.
100% Duty-Cycle ModeEnables low-dropout operation-maintains regulation even when VOUT ≈ VIN, critical for marginally powered systems.
Output Short-Circuit ProtectionDisables switching and enters hiccup mode-limits fault energy and prevents thermal runaway during sustained shorts.

Applications

DDR Memory TerminationActive Termination Buses

Use Scenario: Regulating VTT rail for DDR SDRAM modules in notebooks and subnotebooks, where termination voltage must track half the DDR supply (e.g., 1.25V for 2.5V VDDQ) with fast load transients.

IC Role / Device Role / Timing Role: Active termination supply delivering ±3A bidirectional current to maintain signal integrity on high-speed parallel memory buses.

Use Value: Enables compliant DDR timing margins by maintaining ±40mV output tolerance under ±2A load steps, with <10µs transient recovery per typical operating characteristics.

Use Scenario: Providing dynamically adjustable termination for multi-drop parallel buses (e.g., SCSI, PCI-X) requiring impedance matching during data transmission and idle states.

IC Role / Device Role / Timing Role: Programmable termination regulator sourcing/sinking current to match bus impedance and suppress reflections during signal transitions.

Use Value: Reduces board-level component count by replacing discrete op-amp + FET solutions with single-chip ±3A regulation and built-in soft-start.

Low-Voltage Embedded SystemsPortable Computing Power Rails

Use Scenario: Generating stable 1.1V–3.3V auxiliary supplies in FPGA/CPU companion ICs where space and efficiency are constrained.

IC Role / Device Role / Timing Role: High-efficiency step-down converter supporting variable output setpoints via external reference or resistor network.

Use Value: Achieves 93% peak efficiency at light loads due to low-quiescent-current design and synchronous rectification-extending battery life.

Use Scenario: Powering DDR I/O interfaces in ultraportable laptops with strict thermal and footprint constraints.

IC Role / Device Role / Timing Role: Compact 16-pin QSOP DC-DC solution delivering regulated VTT with thermal shutdown and undervoltage lockout.

Use Value: Meets JEDEC DDR specifications using only external inductor, capacitor, and RTOFF-no compensation components required.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional DC-DC regulator applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS51200DRCR3A sink-only DDR termination regulator; no sourcing capability; fixed 1.5V output or adjustable via resistor divider; 2MHz max frequency.Designed exclusively for DDR VTT sinking; lacks reversible energy flow; requires external sourcing path for bidirectional operation.Select when only sink functionality is needed and higher switching frequency justifies trade-off in unidirectional operation.
ISL6236IRZ3A dual-output buck controller with independent sourcing/sinking per channel; external MOSFETs required; supports 0.7V–5.5V output; 1.5MHz max frequency.Modular architecture allows flexible rail assignment but increases BOM count and layout complexity versus integrated switches.Select when system requires multiple independently regulated termination rails or higher voltage flexibility beyond 5.5V input.

Compared with TPS51200DRCR and ISL6236IRZ, the MAX1809EEE+TG002 uniquely integrates bidirectional ±3A switching, constant-off-time control, and internal 90mΩ/70mΩ FETs in a 16-pin QSOP-reducing total solution size and eliminating external gate drive complexity for DDR VTT applications.

Availability

The MAX1809EEE+TG002 is available at Aetrix Electronics and suitable for DDR memory termination, active bus termination, and low-voltage embedded power rails requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for MAX1809EEE+TG002 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for computing, communications, and industrial applications.

The MAX1809EEE+TG002 belongs to Maxim's high-efficiency DC-DC converter product line, engineered specifically for DDR memory active termination and fast-transient, bidirectional power delivery in portable computing platforms.

FAQ

What is the maximum continuous output current capability of the MAX1809EEE+TG002?

The MAX1809EEE+TG002 delivers ±3A continuous sourcing and sinking current. This bidirectional capability is confirmed in the Electrical Characteristics table (ILIMIT = 3.5A to 4.7A) and General Description, enabling it to actively terminate DDR memory buses by both supplying and absorbing energy during signal transitions. The internal 90mΩ PMOS and 70mΩ NMOS switches sustain this current at typical input voltages without derating under proper thermal conditions.

How does the MAX1809EEE+TG002 achieve reversible energy flow?

The MAX1809EEE+TG002 achieves reversible energy flow through its constant-off-time, current-mode PWM architecture that dynamically controls both the PMOS high-side switch and NMOS synchronous rectifier. When the output voltage exceeds the setpoint (e.g., during bus discharge), the device operates in synchronous boost mode-sinking current from VOUT back to VIN. This behavior is explicitly documented in the Detailed Description section and functional diagram, distinguishing it from conventional unidirectional buck regulators.

What package type is used for the MAX1809EEE+TG002 and what are its thermal considerations?

The MAX1809EEE+TG002 uses a 16-pin QSOP package, as confirmed in the Ordering Information table. Its thermal resistance is specified as θJA = 80°C/W with 0.5in² copper area and no forced airflow. To ensure reliable operation at full ±3A load, the PCB layout must provide adequate copper pour on the GND and PGND connections, avoid routing high-current traces over sensitive analog nodes, and follow Maxim's recommended grounding scheme-particularly separating analog and power grounds at a single point.

Can the MAX1809EEE+TG002 be used for non-DDR applications?

Yes, the MAX1809EEE+TG002 supports general-purpose adjustable step-down conversion from 1.1V to VIN with 3V–5.5V input. Its ±3A bidirectional capability, programmable off-time, and 1% output accuracy make it suitable for active termination in SCSI, PCI-X, or custom high-speed buses, as well as low-voltage auxiliary rails in FPGA/CPU power systems-provided the application requires fast transient response and energy recovery functionality.

What is the role of the TOFF pin on the MAX1809EEE+TG002 and how is it configured?

On the MAX1809EEE+TG002, the TOFF pin (Pin 8) sets the constant off-time via an external resistor (RTOFF) connected to GND. Values from 36kΩ to 430kΩ program tOFF from 0.4µs to 4µs, determining switching frequency up to 1MHz. This configuration is validated in the Electrical Characteristics table (tOFF vs. RTOFF) and Figure 4, and enables optimization of efficiency, EMI, and inductor size without modifying control-loop compensation.

MAX1809EEE+TG002 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Obsolete
Applications:
-
Voltage - Input:
-
Number of Outputs:
-
Voltage - Output:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

MAX1809EEE+TG002 FAQ

1.How can I place an order for MAX1809EEE+TG002 through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX1809EEE+TG002 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX1809EEE+TG002 reliable?

The price and inventory of MAX1809EEE+TG002 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1809EEE+TG002 is usually 5 days.

3.What payment methods are accepted for MAX1809EEE+TG002?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1809EEE+TG002 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX1809EEE+TG002?

MAX1809EEE+TG002 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX1809EEE+TG002 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX1809EEE+TG002?

For technical support, including MAX1809EEE+TG002 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1809EEE+TG002 requirements.

6.How does Aetrix verify that MAX1809EEE+TG002 is sourced from the original manufacturer or authorized distributors?

All MAX1809EEE+TG002 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1809EEE+TG002 meets industry standards.

7.What is the process for return or replacement of MAX1809EEE+TG002?

All MAX1809EEE+TG002 units undergo pre-shipment inspection (PSI). If there is an issue with MAX1809EEE+TG002, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX1809EEE+TG002 part is unused and in its original packaging.

Return procedure for MAX1809EEE+TG002:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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