My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX1840EUB+
- Part No.:
- MAX1840EUB+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
MAX1840EUB+.pdf
- Description:
- IC INTERFACE SPECIALIZED 10UMAX
- Quantity:
- Payment:
- Shipping:
Inventory:2,507
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX1840EUB+ from Maxim Integrated is a low-voltage SIM/smart card level translator IC integrating two unidirectional level shifters (for CLK and RST), one bidirectional level shifter (for DATA/IO), ±10kV ESD protection on all card contacts, 1.0µA total operating supply current, and SHDN-controlled shutdown for safe SIM insertion/removal in GSM handsets.
For engineers reviewing the MAX1840EUB+ datasheet, MAX1840EUB+ pinout, MAX1840EUB+ application, or MAX1840EUB+ equivalent, this device supports multivoltage SIM interfaces where DVCC (1.4V–5.5V) and VCC (1.7V–5.5V) operate independently, enables SPI/QSPI/MICROWIRE level translation, and delivers guaranteed 5–20MHz CLK frequency operation with active low-level shutdown behavior.
Technical Context
The MAX1840EUB+ implements dual-rail level translation using transfer-gate architecture, supporting bidirectional data flow between controller-side (DVCC) and card-side (VCC) domains without direction control signals. Its internal 20kΩ pull-up on DATA to DVCC and 10kΩ pull-up on IO to VCC enable open-drain interface compatibility.
Shutdown is triggered by driving SHDN low, which actively pulls CLK, RST, and IO to GND while disabling the DATA–IO transfer gate and reducing total supply current to 0.01µA. ESD protection meets ±10kV HBM on CLK, RST, IO, VCC, and GND per GSM 11.11/11.12 compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DVCC Range | +1.4V to +5.5V - supports ultra-low-voltage controllers (e.g., 1.8V ASICs) up to 5V legacy systems |
| VCC Range | +1.7V to +5.5V - matches SIM card voltage requirements across 3V and 5V cards |
| Total Operating Current | 1.0µA - enables battery-powered GSM handsets to maintain >1-year standby with minimal quiescent drain |
| ESD Protection | ±10kV HBM on CLK/RST/IO/VCC/GND - satisfies GSM 11.11/11.12 socket-level ESD immunity requirements |
| Max CLK Frequency | 20MHz at VCC=2.7–5.5V/DVCC=1.4–2.7V - supports full-speed SIM clocking (e.g., 5MHz fCLK with 4x oversampling) |
| Shutdown Current | 0.01µA - ensures zero-card-insertion leakage during hot-swap events |
| DATA Pullup | 20kΩ to DVCC - provides defined logic-high state for open-drain controller interfaces without external resistors |
Pinout & Package
MAX1840EUB+ is housed in a 10-pin µMAX package (3.0mm × 3.0mm, 1.09mm height), pin-compatible with industry-standard 10-lead µMAX footprint and half the area of an 8-pin SO.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - DATA | Controller-side bidirectional I/O | Open-drain output with 20kΩ internal pull-up to DVCC; connects to controller's open-drain DATA line |
| 2 - CLK | Card-side clock output | Level-shifted output driven from CIN; actively pulled low during SHDN |
| 3 - RST | Card-side reset output | Level-shifted output driven from RIN; actively pulled low during SHDN |
| 4 - GND | System ground reference | Common return for both DVCC and VCC domains; required for ESD path integrity |
| 5 - SHDN | Shutdown control input | Active-low enable; drives CLK/RST/IO low and disables DATA–IO path when asserted |
| 6 - CIN | Controller clock input | Accepts 0–DVCC square wave; level-shifts to VCC domain for CLK output |
| 7 - RIN | Controller reset input | Accepts 0–DVCC logic; level-shifts to VCC domain for RST output |
| 8 - DVCC | Controller-side supply | +1.4V to +5.5V logic rail; powers internal logic and DATA pull-up |
| 9 - VCC | Card-side supply | +1.7V to +5.5V SIM/smart card rail; powers IO pull-up and level-shifting circuitry |
| 10 - IO | Card-side bidirectional I/O | Open-drain output with 10kΩ internal pull-up to VCC; connects directly to SIM DATA pin |
Key Features
| Feature | Design Value |
|---|---|
| Independent DVCC/VCC rails | Enables level translation even when DVCC < VCC (e.g., 1.8V MCU ↔ 3V SIM) or DVCC > VCC (e.g., 5V MCU ↔ 1.8V eSIM) |
| Integrated ESD protection | ±10kV HBM on all card-facing pins eliminates need for external TVS diodes in GSM-certified designs |
| Active shutdown behavior | SHDN assertion forces CLK/RST/IO to GND - satisfies GSM requirement for zero-voltage card insertion |
| Bidirectional DATA/IO path | No direction-control pin required; automatic signal flow detection via transfer-gate architecture |
| GSM 11.11/11.12 compliance | Validated for use in certified cellular handsets without additional qualification testing |
Applications
| GSM Cellular Handset SIM Interface | Smart Card Reader for Payment Terminals |
|---|---|
Use Scenario: Interfacing a 1.8V application processor to a 3V or 5V SIM card in a dual-mode GSM/UMTS handset. IC Role / Device Role / Timing Role: Level translator and ESD protector for CLK, RST, and bidirectional DATA lines between baseband SoC and SIM socket. Use Value: Eliminates discrete level shifters and external ESD protection, reducing BOM count by 6+ components while meeting GSM 11.11/11.12 compliance out-of-box. |
Use Scenario: Enabling a 3.3V microcontroller in a PCI-compliant payment terminal to communicate with ISO 7816-compliant smart cards. IC Role / Device Role / Timing Role: Voltage-domain isolator and protocol-transparent bidirectional data bridge for T=0/T=1 smart card protocols. Use Value: Supports full 5MHz clock rate with <10ns propagation delay skew, ensuring timing margin for EMV L2 certification without custom layout tuning. |
| SPI/QSPI Level Translation | MICROWIRE Interface Bridge |
Use Scenario: Connecting a 3.3V host MCU to a 5V SPI flash memory in industrial control HMI panels. IC Role / Device Role / Timing Role: Unidirectional level shifter for SCLK/CS and bidirectional shifter for MOSI/MISO in standard SPI topology. Use Value: Enables direct connection without bus buffers or direction-control logic; maintains 20MHz SCLK edge integrity with <5% duty-cycle distortion. |
Use Scenario: Bridging a 1.8V sensor hub MCU to a 3V MICROWIRE ADC in portable medical devices. IC Role / Device Role / Timing Role: Clock and data level translator preserving MICROWIRE's three-wire serial protocol timing constraints. Use Value: Guarantees setup/hold times for DIN/DOUT relative to SCLK under all DVCC/VCC combinations, eliminating protocol timeouts in battery-critical applications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM/smart card level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1841EUB+ | Includes DDRV input for push-pull controller outputs; lacks SHDN pin; same package and pinout except DDRV replaces SHDN | Required when system controller lacks open-drain DATA capability (e.g., most ARM Cortex-M GPIOs) | Select MAX1841EUB+ if controller uses push-pull outputs; MAX1840EUB+ if SHDN-controlled safe insertion is mandatory |
| TI TXS0102DCUR | 2-channel bidirectional translator only; no integrated ESD; no SIM-specific shutdown behavior; 8-pin VSSOP | Requires external ±15kV ESD diodes and discrete power sequencing for SIM insertion; not GSM-certified | Use only in non-GSM, low-ESD-risk embedded systems where cost is primary constraint and certification is not required |
Compared with MAX1841EUB+, MAX1840EUB+ provides hardware-safe SIM insertion via SHDN but requires open-drain controller outputs; compared with TXS0102DCUR, MAX1840EUB+ integrates GSM-compliant ESD and shutdown logic, eliminating four external components and enabling direct certification.
Availability
MAX1840EUB+ is available at Aetrix Electronics and suitable for GSM handset design, smart card reader manufacturing, and SPI/MICROWIRE interface bridging requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for MAX1840EUB+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for automotive, industrial, communications, and consumer applications.
The MAX1840EUB+ belongs to Maxim's SIM/smart card interface product line, engineered specifically to simplify multivoltage SIM integration in space-constrained, battery-sensitive GSM handsets while meeting stringent ESD and insertion-safety requirements.
FAQ
What is the primary function of the MAX1840EUB+ in a GSM handset design?
The MAX1840EUB+ serves as a dedicated SIM/smart card level translator and ESD protector, providing bidirectional DATA, unidirectional CLK and RST level shifting between controller-side (DVCC) and card-side (VCC) voltage domains. In GSM handsets, it enables safe, compliant interfacing of low-voltage baseband processors (e.g., 1.8V) with 3V or 5V SIM cards while meeting GSM 11.11/11.12 ESD and insertion requirements - all within a 3mm × 3mm µMAX package.
How does the SHDN pin on the MAX1840EUB+ improve SIM card insertion safety?
The SHDN pin on the MAX1840EUB+ enables hardware-controlled shutdown: when driven low, it actively pulls CLK, RST, and IO to GND and disables the DATA–IO transfer gate. This ensures zero voltage on all SIM contact points prior to insertion - satisfying GSM specification requirements for safe hot-plug operation. Total supply current drops to 0.01µA in this state, minimizing battery drain during card swap events.
Can the MAX1840EUB+ translate between DVCC = 1.8V and VCC = 5.0V?
Yes, the MAX1840EUB+ supports level translation with DVCC ≥ VCC or DVCC ≤ VCC. Its transfer-gate architecture allows operation with DVCC = 1.8V and VCC = 5.0V - a common configuration in modern GSM handsets using low-power 1.8V application processors interfacing with legacy 5V SIM cards. Electrical characteristics including VOL, VOH, and timing remain valid across this full voltage combination range.
What is the maximum supported clock frequency for the MAX1840EUB+ CLK output?
The MAX1840EUB+ supports a maximum CLK output frequency of 20MHz when VCC is 2.7V–5.5V and DVCC is 1.4V–2.7V. At lower DVCC (e.g., 1.8V) and higher VCC (e.g., 5V), the device sustains 15MHz operation. These values are guaranteed by design per the datasheet and ensure reliable timing margins for ISO/IEC 7816-3 compliant smart card communication at full speed.
Does the MAX1840EUB+ require external pull-up resistors on the DATA or IO lines?
No, the MAX1840EUB+ integrates internal pull-up resistors: 20kΩ from DATA to DVCC and 10kΩ from IO to VCC. These eliminate the need for external resistors in standard open-drain configurations, reducing PCB area and BOM count. The values are optimized to meet ISO/IEC 7816-3 rise-time requirements while limiting current draw during logic-low states.
MAX1840EUB+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- Smart Card
- Interface:
- MICROWIRE™, QSPI™, Serial, SPI™
- Voltage - Supply:
- 1.4V ~ 5.5V, 1.7V ~ 5.5V
- Supplier Device Package:
- 10-uMAX/uSOP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MAX1840EUB+ FAQ
1.How can I place an order for MAX1840EUB+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX1840EUB+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX1840EUB+ reliable?
The price and inventory of MAX1840EUB+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1840EUB+ is usually 5 days.
3.What payment methods are accepted for MAX1840EUB+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1840EUB+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX1840EUB+?
MAX1840EUB+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX1840EUB+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX1840EUB+?
For technical support, including MAX1840EUB+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1840EUB+ requirements.
6.How does Aetrix verify that MAX1840EUB+ is sourced from the original manufacturer or authorized distributors?
All MAX1840EUB+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1840EUB+ meets industry standards.
7.What is the process for return or replacement of MAX1840EUB+?
All MAX1840EUB+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX1840EUB+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX1840EUB+ part is unused and in its original packaging.
Return procedure for MAX1840EUB+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX1840EUB+ Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
