Analog Devices Inc./Maxim Integrated MAX1840EUB+TGC7

Overview

MAX1840EUB+TGC7 from Maxim Integrated is a SIM/smart card level translator IC integrating two unidirectional level shifters (for CLK and RST), one bidirectional level shifter (for DATA/IO), ±10kV ESD protection on all card contacts, 1.0µA total quiescent supply current, and SHDN-controlled insertion/removal support. It enables voltage translation between +1.4V–+5.5V controller-side (DVCC) and +1.7V–+5.5V card-side (VCC) rails in GSM cellular handsets.

For engineers reviewing the MAX1840EUB+TGC7 datasheet, MAX1840EUB+TGC7 pinout, MAX1840EUB+TGC7 application, or MAX1840EUB+TGC7 equivalent, key selection criteria include bidirectional data translation capability with internal pull-ups, shutdown-driven active low assertion on CLK/RST/IO, ESD robustness per GSM 11.11/11.12, and µMAX package compatibility with space-constrained SIM interfaces.

Technical Context

The MAX1840EUB+TGC7 implements discrete MOSFET-based transfer-gate level shifting for CLK and RST signals, with rail-to-rail input compatibility (DVCC ≥ VCC or DVCC ≤ VCC). Its bidirectional DATA/IO path uses open-drain topology with integrated 20kΩ pull-up to DVCC and 10kΩ pull-up to VCC, enabling interoperability with both open-drain and push-pull controllers when combined with SHDN sequencing.

Shutdown mode is triggered by driving SHDN low, which actively pulls CLK, RST, and IO to GND while disabling internal pull-ups and reducing total supply current to 0.01µA. All card-facing pins (CLK, RST, IO, VCC, GND) are protected to ±10kV HBM, validated under GSM 11.11/11.12 test conditions with 1µF VCC bypassing.

Key Specifications

Pinout & Package

MAX1840EUB+TGC7 is housed in a 10-pin µMAX package (3.0mm × 3.0mm × 1.09mm), RoHS-compliant, no exposed pad.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SIM/smart card level translation applications.

Compared with MAX1841EUB+, MAX1840EUB+TGC7 simplifies control with single SHDN input and eliminates DDRV routing complexity, making it optimal for open-drain-capable controllers. Unlike MAX3232ESE+, it delivers purpose-built SIM protocol translation with validated GSM compliance, not generic serial interface functionality.

Availability

MAX1840EUB+TGC7 is available at Aetrix Electronics and suitable for GSM handset design, smart card reader manufacturing, and low-power IoT eSIM integration requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for MAX1840EUB+TGC7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, communications, computing, and consumer applications.

The MAX1840EUB+TGC7 belongs to Maxim's SIM/smart card interface product line, engineered specifically to replace discrete level-shifting and ESD protection solutions in space- and power-constrained portable devices.

FAQ

What is the maximum clock frequency supported by the MAX1840EUB+TGC7?

The MAX1840EUB+TGC7 supports up to 20MHz CLK frequency when VCC is 2.7V–5.5V and DVCC is 1.4V–2.7V. At lower DVCC (e.g., 1.4V–2.25V) and VCC (1.7V–3.6V), the limit is 15MHz. These values are specified in the Electrical Characteristics table and validated by design per Note 4 in the datasheet.

Does the MAX1840EUB+TGC7 require external pull-up resistors on the DATA or IO lines?

No. The MAX1840EUB+TGC7 integrates a 20kΩ pull-up resistor from DATA to DVCC and a 10kΩ pull-up resistor from IO to VCC. These internal resistors eliminate the need for external components in standard open-drain configurations, reducing BOM count and PCB area.

How does the MAX1840EUB+TGC7 handle SIM card insertion and removal?

The MAX1840EUB+TGC7 supports safe hot-swap via its SHDN pin: asserting SHDN low actively pulls CLK, RST, and IO to GND and disables internal pull-ups, satisfying ISO/IEC 7816-3 mechanical timing requirements. This prevents bus contention and latch-up during card insertion or removal.

Is the MAX1840EUB+TGC7 compliant with GSM 11.11 and 11.12 standards?

Yes. The MAX1840EUB+TGC7 is explicitly stated in the datasheet to be compliant with GSM 11.11 and 11.12 test specifications, verified with ±10kV HBM ESD protection on all card-facing pins (CLK, RST, IO, VCC, GND) when used with a 1µF VCC bypass capacitor.

What is the shutdown current consumption of the MAX1840EUB+TGC7?

The MAX1840EUB+TGC7 draws only 0.01µA total supply current (ISHDN) when SHDN is driven low, or when either DVCC or VCC is removed. This ultra-low shutdown current enables energy-efficient SIM presence monitoring in battery-powered applications.