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Analog Devices Inc./Maxim Integrated MAX1841EUB+
- Part No.:
- MAX1841EUB+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Specialized
- Package:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Datasheet:
-
MAX1841EUB+.pdf
- Description:
- IC TRANS LEVEL SIM 10-UMAX
- Quantity:
- Payment:
- Shipping:
Inventory:123
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Product details
Overview
MAX1841EUB+ from Maxim Integrated is a smart card/SIM level translator IC with integrated bidirectional data driver (DDRV), ±10kV ESD protection on all card-contact pins, and dual-supply operation (DVCC: +1.4V to +5.5V; VCC: +1.7V to +5.5V). It enables reliable 1.8V/3V/5V SIM interface in GSM handsets by translating reset, clock, and serial data signals while supporting hot insertion/removal via active shutdown control.
For engineers reviewing the MAX1841EUB+ datasheet, MAX1841EUB+ pinout, MAX1841EUB+ application, or MAX1841EUB+ equivalent, this device is selected for low-quiescent-current (1.0µA operating, 0.01µA shutdown) SIM/smart card interfacing where system controllers lack open-drain outputs - requiring DDRV-driven data transmission and controlled IO/CLK/RST pull-low during card handling.
Technical Context
The MAX1841EUB+ implements three dedicated level-shifting paths: unidirectional CIN→CLK and RIN→RST (controller-to-card), and bidirectional DATA↔IO (controller↔card), with internal 20kΩ pull-up to DVCC on DATA and 10kΩ pull-up to VCC on IO. Its DDRV input enables push-pull controller compatibility by driving IO high without relying on external circuitry.
Shutdown is triggered by removing either DVCC or VCC (auto-shutdown), or by pulling DDRV low (MAX1841-specific behavior per pin description). During shutdown, CLK, RST, and IO are actively pulled low, and the DATA–IO transfer gate is disabled - meeting GSM 11.11/11.12 requirements for safe card insertion/removal.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| DVCC Range | +1.4V to +5.5V - supports ultra-low-voltage controllers (e.g., 1.8V ASICs) and legacy 5V systems without level-shifter cascading. |
| VCC Range | +1.7V to +5.5V - matches full SIM voltage spec (1.8V/3V/5V), enabling single-part support across multi-standard cards. |
| Total Operating Current | 1.0µA - enables always-on SIM detection in battery-critical mobile applications without measurable drain impact. |
| Shutdown Current | 0.01µA - ensures negligible leakage during card removal, preserving system sleep integrity. |
| ESD Protection | ±10kV HBM on CLK/RST/IO/VCC/GND - exceeds IEC 61000-4-2 Level 4, eliminating need for external TVS diodes at card socket. |
| Max CLK Frequency | 20MHz (VCC=2.7–5.5V, DVCC=1.4–2.7V) - supports full-speed SIM clocking (e.g., 5MHz fCLK with 20% margin) in high-throughput readers. |
| DATA Pullup Resistance | 13–28kΩ to DVCC - provides robust noise immunity and fast rise time for 1.8V/3.3V logic without external resistors. |
Pinout & Package
MAX1841EUB+ is housed in a 10-pin µMAX package (3.0mm × 3.0mm × 1.09mm), RoHS-compliant, no exposed pad.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (DATA) | Controller-side bidirectional data I/O | Open-drain output with 20kΩ internal pull-up to DVCC; receives card data and transmits controller data when DDRV is inactive. |
| 2 (CIN) | Controller clock input | Unidirectional level shifter input; drives CLK output with rail-to-rail translation (DVCC → VCC). |
| 3 (RIN) | Controller reset input | Unidirectional level shifter input; drives RST output with rail-to-rail translation (DVCC → VCC). |
| 4 (GND) | Ground reference | Common return for both controller and card sides; must be low-impedance to maintain ESD path integrity. |
| 5 (DDRV) | Controller data driver input | Active-high signal that forces IO high when driven high; enables push-pull microcontrollers to drive SIM data without external MOSFET. |
| 6 (CLK) | Card-side clock output | Level-shifted clock output to SIM; actively pulled low during shutdown to prevent false card activation. |
| 7 (RST) | Card-side reset output | Level-shifted reset output to SIM; actively pulled low during shutdown to ensure card reset state before insertion. |
| 8 (VCC) | Card-side supply voltage | Power input for SIM/smart card side; requires 1µF bypass capacitor to GND for ±10kV ESD compliance. |
| 9 (DVCC) | Controller-side supply voltage | Power input for system controller side; sets logic thresholds (VIL = 0.2×DVCC, VIH = 0.7×DVCC). |
| 10 (IO) | Card-side bidirectional data I/O | Open-drain output with 10kΩ internal pull-up to VCC; connects directly to SIM I/O pin; actively pulled low in shutdown. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DDRV data driver | Eliminates need for external transistor/MOSFET when interfacing with push-pull MCU GPIOs - reduces BOM count and layout area. |
| Auto-shutdown on supply loss | Guarantees CLK/RST/IO go low within microseconds if DVCC or VCC fails - prevents SIM latch-up or undefined card states. |
| Bidirectional level translation | Supports DVCC ≥ VCC or DVCC ≤ VCC configurations - enables direct 1.8V MCU ↔ 3V SIM and 3.3V MCU ↔ 5V SIM links without voltage sequencing. |
| ±10kV ESD on card pins | Meets IEC 61000-4-2 Contact Discharge Level 4 - removes requirement for discrete ESD protection diodes at SIM socket. |
| 10-pin µMAX footprint | Half the area of 8-pin SOIC - saves >30% PCB space vs. legacy solutions, critical for compact handset designs. |
Applications
| GSM Cellular Handset SIM Interface | Smart Card Reader for Payment Terminals |
|---|---|
Use Scenario: Integrating 1.8V application processor with 3V SIM card in slim-profile mobile phone. IC Role / Device Role / Timing Role: Level translator and ESD protector for CLK, RST, and bidirectional I/O; DDRV enables processor GPIO to drive SIM data without open-drain constraint. Use Value: Enables direct interface with zero external components beyond 1µF VCC bypass capacitor - reduces bill-of-materials and routing complexity. |
Use Scenario: Adding contact-based EMV smart card support to portable POS terminal powered by 3.3V system rail. IC Role / Device Role / Timing Role: Voltage translator between 3.3V host MCU and 1.8V/3V/5V smart card; auto-shutdown ensures safe card swap during field use. Use Value: Guarantees <0.01µA shutdown current and active low assertion on all card pins - meets PCI PTS v6.0 power and safety requirements. |
| SPI/QSPI Level Translation | MICROWIRE Interface Bridge |
Use Scenario: Connecting 3.3V microcontroller SPI master to 5V sensor slave with shared clock and chip-select lines. IC Role / Device Role / Timing Role: Unidirectional level shifter for SCLK and CS (via CIN→CLK, RIN→RST), bidirectional for MOSI/MISO (via DATA↔IO). Use Value: Supports 20MHz clock rate with <20ns propagation delay - preserves timing margins in high-speed SPI peripherals without added latency. |
Use Scenario: Interfacing 1.8V baseband processor to legacy MICROWIRE-compatible secure element in IoT gateway. IC Role / Device Role / Timing Role: Translates MICROWIRE clock (CIN→CLK), frame sync (RIN→RST), and bidirectional data (DATA↔IO) across 1.8V/3V domains. Use Value: Internal pull-ups eliminate need for external resistors on all signal lines - simplifies layout and improves signal integrity at 10MHz MICROWIRE rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SIM/smart card level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX1840EUB+ | Lacks DDRV pin; uses SHDN for shutdown control instead of DDRV-driven IO control; identical pinout except Pin 5 = SHDN (not DDRV). | Requires open-drain controller outputs for DATA line; unsuitable for push-pull MCUs without external driver circuitry. | Select MAX1840EUB+ only when system controller has native open-drain GPIOs and shutdown sequencing is managed externally. |
| MAX3232ESE+ | RS-232 transceiver with ±15kV ESD; no SIM-specific level-shifting architecture, no DDRV, no auto-shutdown, different pin function mapping. | Designed for UART voltage translation, not SIM protocol timing or GSM compliance; lacks bidirectional DATA/IO path and card-side VCC regulation interface. | Not a functional substitute - MAX3232ESE+ serves serial communication, not SIM interface; use only if redesigning to RS-232 smart card reader architecture. |
Compared with MAX1840EUB+, the MAX1841EUB+ adds DDRV functionality for push-pull MCU compatibility but shares identical package, ESD rating, and shutdown behavior. Unlike MAX3232ESE+, it delivers purpose-built SIM timing, auto-shutdown, and bidirectional data translation - making it the only drop-in solution for GSM 11.11-compliant handheld designs.
Availability
MAX1841EUB+ is available at Aetrix Electronics and suitable for GSM cellular handsets, EMV payment terminals, portable medical devices, and industrial smart card readers requiring stable component supply, long-term lifecycle assurance, and full traceability.
Supply support for MAX1841EUB+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX1840/MAX1841 product line was designed specifically to meet GSM 11.11/11.12 SIM interface requirements - delivering integrated level shifting, ESD protection, and hot-swap safety in minimal footprint for space-constrained mobile platforms.
FAQ
What is the primary function of the MAX1841EUB+ in a GSM handset design?
The MAX1841EUB+ serves as a dedicated SIM/smart card level translator, providing bidirectional data translation (via DATA and IO pins), unidirectional clock/reset translation (CIN→CLK, RIN→RST), ±10kV ESD protection on all card-contact pins, and DDRV-driven data transmission for push-pull microcontrollers. In GSM handsets, it ensures compliant, low-power, hot-swap-safe interface between 1.8V/3.3V application processors and 1.8V/3V/5V SIM cards - directly implementing GSM 11.11/11.12 requirements without external components beyond a single 1µF VCC bypass capacitor.
How does the DDRV pin on the MAX1841EUB+ differ from the SHDN pin on the MAX1840EUB+?
The DDRV pin on the MAX1841EUB+ is a dedicated data driver input that enables push-pull microcontrollers to drive the SIM card's IO line high without requiring external circuitry; when DDRV is high, IO is actively driven high. In contrast, the SHDN pin on the MAX1840EUB+ is a shutdown control input that, when pulled low, disables level translation and pulls CLK, RST, and IO low. The MAX1841EUB+ does not include SHDN - its shutdown is automatic upon DVCC or VCC removal, and DDRV remains functional during normal operation but has no shutdown role.
Can the MAX1841EUB+ operate with DVCC = 1.8V and VCC = 5.0V simultaneously?
Yes, the MAX1841EUB+ supports simultaneous DVCC = 1.8V and VCC = 5.0V operation. Its level-shifting architecture is explicitly designed for cross-voltage-domain translation in either direction (DVCC ≥ VCC or DVCC ≤ VCC). Electrical specifications confirm valid operation across the full DVCC range (+1.4V to +5.5V) and VCC range (+1.7V to +5.5V), including the 1.8V/5.0V combination. This enables direct interfacing of ultra-low-voltage application processors with legacy 5V SIM cards - a key requirement in backward-compatible GSM designs.
What is the significance of the 0.01µA shutdown current specification for the MAX1841EUB+?
The 0.01µA shutdown current (ISHDN) specifies the total supply current drawn by the MAX1841EUB+ when either DVCC or VCC is removed - a condition that automatically triggers shutdown mode. This ultra-low leakage ensures minimal battery drain during SIM card removal or system sleep states in portable devices. For example, in a handset with a 300mAh battery, 0.01µA draw extends theoretical shelf life by over 34 years - making the MAX1841EUB+ suitable for always-on, battery-operated applications where power budget is constrained to nanoampere levels during idle periods.
Does the MAX1841EUB+ require external pull-up resistors on the DATA or IO lines?
No, the MAX1841EUB+ integrates internal pull-up resistors: 13–28kΩ from DATA to DVCC and 6.5–14kΩ from IO to VCC. These are fully characterized across temperature and voltage, eliminating the need for external resistors in standard SIM/smart card interfaces. The internal pull-ups provide guaranteed rise times and noise immunity while reducing BOM count and PCB area - a key advantage over discrete level-shifter solutions that mandate external resistor networks for each signal line.
MAX1841EUB+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- Smart Card
- Interface:
- MICROWIRE™, QSPI™, Serial, SPI™
- Voltage - Supply:
- 1.4V ~ 5.5V, 1.7V ~ 5.5V
- Supplier Device Package:
- 10-uMAX/uSOP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MAX1841EUB+ FAQ
1.How can I place an order for MAX1841EUB+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX1841EUB+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX1841EUB+ reliable?
The price and inventory of MAX1841EUB+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1841EUB+ is usually 5 days.
3.What payment methods are accepted for MAX1841EUB+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1841EUB+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX1841EUB+?
MAX1841EUB+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX1841EUB+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX1841EUB+?
For technical support, including MAX1841EUB+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1841EUB+ requirements.
6.How does Aetrix verify that MAX1841EUB+ is sourced from the original manufacturer or authorized distributors?
All MAX1841EUB+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1841EUB+ meets industry standards.
7.What is the process for return or replacement of MAX1841EUB+?
All MAX1841EUB+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX1841EUB+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX1841EUB+ part is unused and in its original packaging.
Return procedure for MAX1841EUB+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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