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Analog Devices Inc./Maxim Integrated MAX1917EEE+TG24

Part No.:
MAX1917EEE+TG24
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Special Purpose Regulators
Package:
-
Datasheet:
AetrixMAX1917EEE+TG24.pdf
Description:
INTEGRATED CIRCUIT
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,310

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Product details

Overview

The MAX1917EEE+TG24 from Maxim Integrated is a synchronous buck controller optimized for DDR memory power management, integrating VTT and VTTR termination supplies with 1/2VDDR tracking. It delivers ±25A sourcing/sinking capability, maintains VTT/VTTR within ±1% of 1/2VDDR, operates from 4.5V–14V input, and achieves up to 96% efficiency using Quick-PWM™ architecture in a 16-pin QSOP package - deployed in notebook, desktop, and server DDR2/DDR3 memory subsystems.

For engineers reviewing the MAX1917EEE+TG24 datasheet, MAX1917EEE+TG24 pinout, MAX1917EEE+TG24 application, or MAX1917EEE+TG24 equivalent, key selection criteria include its dual-sourcing/sinking current capability, resistor-programmable current limit (35–230 mV), 200–550 kHz preset switching frequencies, no external sense-resistor overcurrent protection, and integrated 5V VL regulator supporting gate drive and external loads.

Technical Context

The MAX1917EEE+TG24 implements Maxim's proprietary Quick-PWM™ control architecture, enabling sub-1µs on-time adjustment based on EN/HSD (input voltage) and DDR (reference voltage) inputs - delivering fast transient response without fixed-frequency clock dependency. Its valley-current sensing uses low-side FET RDS(ON) for lossless overcurrent detection, with programmable positive/negative current limits (±85–230 mV range).

It integrates a 5V VL LDO regulator (4.8–5.2 V, 35 mA RMS), dual-tracking outputs (VTT and VTTR referenced to DDR), and adaptive dead-time control between DH and DL drivers. The POK open-drain output asserts high only when both VTT and VTTR remain within ±12% of regulation - critical for DDR bus integrity monitoring.

Key Specifications

Parameter Value and Actual Design Meaning
V+ Input Range 4.5V to 14V - supports wide-input DDR supply rails including 5V, 12V, and 28V (with resistor divider)
Output Tracking Accuracy ±1% of 1/2VDDR for both VTT and VTTR - meets JEDEC DDR2/DDR3 termination tolerance requirements
Current Capability ±25A sourcing/sinking - enables full DDR termination load handling without external amplifiers
Switching Frequency 200/300/400/550 kHz preset (FSEL-selectable); up to 1 MHz variable - avoids IF bands and simplifies EMI filtering
Current-Limit Threshold Programmable 35–230 mV via ILIM resistor - sets peak current limit without sense resistor, scaling with MOSFET RDS(ON)
Efficiency Up to 96% at 1.25V/7A - achieved via all-N-FET synchronous rectification and low-driver RDS(ON) (DH: 1.4–2.5 Ω, DL sink: 0.75–1.25 Ω)
VL Regulator Output 5.0 V ±0.2 V, 35 mA RMS - powers internal logic, reference, and external gate drivers; bypassable for 4.5–5.5V operation

Pinout & Package

Package: 16-pin QSOP (16 QSOP), surface-mount, 3.9mm × 9.9mm body, 1.0mm pitch.

Pin/Terminal Circuit Role Design Meaning
1 EN/HSD Enable / High-Side Drain Monitor Dual-function: grounds IC for <5 µA shutdown; or connects to high-side FET drain to measure input voltage for on-time calculation
2 DDR DDR Reference Input Sets VTT and VTTR to exactly 1/2VDDR; accepts 0–3.6 V - enables dynamic tracking across DDR voltage modes
3 POK Power-OK Open-Drain Output Asserts high only when both VTT and VTTR are within ±12% of target - used for system power sequencing and fault reporting
4 VTT VTT Feedback Input Connects to VTT output node; closes feedback loop for precision 1/2VDDR regulation with ±1% accuracy
5 ILIM Current-Limit Threshold Adjustment Accepts resistor-to-GND to set current-limit threshold (35–230 mV); defaults to 100 mV when tied to VL
6 FSEL Frequency Select Configures switching frequency: GND=550 kHz, REF=400 kHz, floating=300 kHz, VL=200 kHz - enables noise-sensitive layout optimization
7 REF Reference Bypass 2.00 V ±20 mV internal reference; requires ≥0.22 µF ceramic cap to GND for stability and noise immunity
8 GND Analog/Digital Ground Common return for reference, logic, and feedback circuits; must be low-impedance Kelvin connection to PGND
9 VTTR VTTR Reference Output Sources/sinks up to ±25 mA; tracks 1/2VDDR; requires ≥1 µF ceramic bypass capacitor for DDR bus termination stability
10 V+ Main Supply Input Powers VL regulator and VTTR circuitry; 4.5–14 V range; requires ≥0.22 µF bypass capacitor
11 VL Internal 5V Regulator Output Supplies 5.0 V ±0.2 V to internal blocks and external gate drivers; connect to V+ if V+ = 4.5–5.5 V to bypass regulator
12 DL Low-Side Gate Driver Output Drives low-side N-FET gate; sink RDS(ON) = 0.75–1.25 Ω; includes adaptive dead-time control to prevent shoot-through
13 PGND Power Ground High-current return path for LX, DL, and low-side FET; must be separate low-inductance plane from analog GND
14 BST Bootstrap Supply Provides gate drive voltage for high-side N-FET; requires ≥0.47 µF capacitor to LX; series RBST resistor mitigates shoot-through
15 DH High-Side Gate Driver Output Drives high-side N-FET gate; RDS(ON) = 1.4–2.5 Ω; turn-on timing synchronized with adaptive DL dead time
16 LX Inductor Switching Node Connects to inductor and high/low-side FET sources; carries full switching current; requires short, low-inductance PCB trace

Key Features

Feature Design Value
Quick-PWM™ Control Architecture Enables <1 µs on-time adjustment and near-instantaneous load transient response - eliminates loop delay of conventional PWM, reducing required output capacitance by up to 50%
No Sense-Resistor Overcurrent Protection Uses low-side FET RDS(ON) as current-sense element - eliminates power loss and board space of external shunt, while supporting ±25A bidirectional current limiting
Integrated 5V VL Regulator Delivers 35 mA RMS at 5.0 V ±0.2 V - powers internal logic, reference, and external gate drivers; bypassable for 4.5–5.5V operation to improve efficiency and extend low-VIN capability
Programmable Switching Frequency Four preset frequencies (200/300/400/550 kHz) via FSEL pin - allows avoidance of sensitive IF bands (e.g., 455 kHz) and optimization of inductor size vs. efficiency trade-offs
VTT/VTTR Tracking Accuracy Maintains both outputs within ±1% of 1/2VDDR across temperature and load - satisfies JEDEC DDR2/DDR3 termination voltage tolerance for reliable bus signaling
Adaptive Dead-Time Control Monitors DL output to delay DH turn-on until low-side FET is fully off - prevents shoot-through in high-current synchronous buck stages without requiring external timing components

Applications

DDR Memory Termination Server Memory Subsystem

Use Scenario: Providing matched VTT and VTTR termination voltages for DDR2/DDR3 memory buses in high-speed computing platforms.

IC Role / Device Role / Timing Role: Synchronous buck controller generating and tracking two independent 1/2VDDR supplies with ±1% accuracy and ±25A bidirectional current capability.

Use Value: Eliminates need for discrete op-amps or dedicated termination ICs; reduces BOM count and improves JEDEC compliance margin under dynamic load transients.

Use Scenario: Powering memory termination and reference supplies in dual-CPU servers with multi-rank DDR3 RDIMMs.

IC Role / Device Role / Timing Role: Dual-output tracking controller delivering stable VTTR (±25mA) and VTT (±25A) with POK monitoring for system-level power sequencing.

Use Value: Enables single-chip solution for high-current termination with built-in fault reporting (POK), reducing layout complexity and improving thermal performance vs. discrete regulators.

Notebook DDR Power Management Desktop Memory Voltage Regulation

Use Scenario: Low-power DDR termination in thin-and-light notebooks where shutdown current <5 µA is critical for battery life.

IC Role / Device Role / Timing Role: Enable-controlled buck controller with ultra-low shutdown current and integrated VL regulator for gate drive and biasing.

Use Value: Achieves <5 µA shutdown current while maintaining full functionality - extends standby time without compromising DDR bus readiness during wake events.

Use Scenario: Generating precise VTT and VTTR for overclocked DDR3 memory modules in enthusiast desktop motherboards.

IC Role / Device Role / Timing Role: High-efficiency (96%) synchronous controller with programmable current limit and frequency selection for stable operation under extreme load swings.

Use Value: Supports aggressive droop compensation and voltage positioning via external resistor, minimizing output voltage deviation (<±40 mV) during 0→25A load steps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR termination controller applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISL6537CRZ-T Fixed 300 kHz switching frequency; no FSEL programmability; requires external 5V supply for gate drive (no integrated VL) Lacks integrated VL regulator and programmable frequency - increases external component count and limits input voltage flexibility Select when fixed-frequency operation suffices and external 5V rail is available; not drop-in due to missing VL and different pinout
TPS51116PWR Supports DDR3 only; lower sourcing/sinking current (±15A); uses external sense resistor for overcurrent protection Lower current rating and sense-resistor dependency reduce efficiency and board area savings vs. MAX1917EEE+TG24 Choose for cost-sensitive DDR3-only designs where ±15A suffices; requires redesign for DDR2 support or higher current demands

Compared with ISL6537CRZ-T and TPS51116PWR, the MAX1917EEE+TG24 provides unique integration of VL regulator, FSEL-programmable frequency, and lossless valley-current sensing - enabling fewer external components, wider input range (4.5–14V), and tighter tracking (±1%) in space-constrained DDR memory power systems.

Availability

The MAX1917EEE+TG24 is available at Aetrix Electronics and suitable for DDR2/DDR3 memory termination, server memory subsystems, and notebook power management requiring stable component supply, JEDEC-compliant tracking accuracy, and low-quiescent-current shutdown.

Supply support for MAX1917EEE+TG24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for computing, communications, and industrial applications.

The MAX1917EEE+TG24 belongs to Maxim's DDR power-management controller product line, designed specifically to replace discrete solutions with integrated VTT/VTTR tracking, high-current bidirectional capability, and Quick-PWM™ transient response for DDR2/DDR3 memory interfaces.

FAQ

What is the maximum sourcing and sinking current capability of the MAX1917EEE+TG24?

The MAX1917EEE+TG24 supports ±25A continuous sourcing and sinking current for VTT and VTTR outputs. This bidirectional capability is essential for DDR memory termination, where current flows into or out of the bus depending on data patterns. The controller maintains regulation within ±1% of 1/2VDDR across this full range, verified per JEDEC specifications in typical operating conditions.

How does the MAX1917EEE+TG24 achieve overcurrent protection without a sense resistor?

The MAX1917EEE+TG24 uses valley-current sensing via the low-side MOSFET's RDS(ON) to detect current without an external sense resistor. A precision 5 µA current source at the ILIM pin develops a voltage across an external resistor, setting the current-limit threshold (35–230 mV). This method eliminates power loss and PCB area associated with shunt resistors while supporting both positive and negative current limits.

Can the MAX1917EEE+TG24 be used for DDR2 and DDR3 memory standards?

Yes, the MAX1917EEE+TG24 supports both DDR2 and DDR3 memory standards. Its DDR input accepts 0–3.6V, covering DDR2 (1.8V) and DDR3 (1.5V) reference voltages, and its ±1% VTT/VTTR tracking accuracy meets JEDEC requirements for both standards. The device has been validated in typical application circuits for 1.25V/7A (DDR3) and 1.8V/12A (DDR2) configurations.

What is the role of the EN/HSD pin on the MAX1917EEE+TG24?

The EN/HSD pin on the MAX1917EEE+TG24 serves a dual function: when grounded, it places the IC in ultra-low-power shutdown (<5 µA); when connected to the high-side MOSFET drain, it monitors input voltage to dynamically adjust on-time for constant-frequency operation. This dual use reduces pin count and enables accurate input-voltage-dependent PWM control without external sensing components.

Does the MAX1917EEE+TG24 include an internal voltage regulator, and what is its purpose?

Yes, the MAX1917EEE+TG24 integrates a 5V VL linear regulator (4.8–5.2 V, 35 mA RMS) that powers internal PWM logic, reference circuitry, and gate drivers. When V+ is 4.5–5.5V, VL can be tied directly to V+ to bypass the regulator - improving efficiency and extending operation down to 4.5V input. This integration eliminates the need for an external 5V supply in most DDR power designs.

MAX1917EEE+TG24 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
-
Packaging:
Bulk
Product Status:
Obsolete
Applications:
-
Voltage - Input:
-
Number of Outputs:
-
Voltage - Output:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

MAX1917EEE+TG24 FAQ

1.How can I place an order for MAX1917EEE+TG24 through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX1917EEE+TG24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX1917EEE+TG24 reliable?

The price and inventory of MAX1917EEE+TG24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX1917EEE+TG24 is usually 5 days.

3.What payment methods are accepted for MAX1917EEE+TG24?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX1917EEE+TG24 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX1917EEE+TG24?

MAX1917EEE+TG24 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX1917EEE+TG24 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX1917EEE+TG24?

For technical support, including MAX1917EEE+TG24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX1917EEE+TG24 requirements.

6.How does Aetrix verify that MAX1917EEE+TG24 is sourced from the original manufacturer or authorized distributors?

All MAX1917EEE+TG24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX1917EEE+TG24 meets industry standards.

7.What is the process for return or replacement of MAX1917EEE+TG24?

All MAX1917EEE+TG24 units undergo pre-shipment inspection (PSI). If there is an issue with MAX1917EEE+TG24, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX1917EEE+TG24 part is unused and in its original packaging.

Return procedure for MAX1917EEE+TG24:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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