My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX2032ETP+
- Part No.:
- MAX2032ETP+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- RF Mixers
- Package:
- 20-WQFN Exposed Pad
- Datasheet:
-
MAX2032ETP+.pdf
- Description:
- IC MXR 650MHZ-1GHZ UP/DWN 20TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,077
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX2032ETP+ from Maxim Integrated is a high-linearity passive upconverter/downconverter mixer designed for base-station RF front-ends. It delivers +33dBm IIP3, 7dB noise figure, and 7dB conversion loss across 650–1000MHz RF and 650–1250MHz LO bands, supporting high-side LO injection in WCDMA/LTE and WiMAX base stations.
For engineers reviewing the MAX2032ETP+ datasheet, MAX2032ETP+ pinout, MAX2032ETP+ application, or MAX2032ETP+ equivalent, this page provides verified RF performance data, integrated balun functionality, LO switch isolation specs, thermal behavior over –40°C to +85°C, and pin-compatible alternatives for multi-band PCB reuse.
Technical Context
The MAX2032ETP+ implements a double-balanced passive mixer core with on-chip RF and LO baluns, enabling single-ended RF/LO interfaces while maintaining image rejection and port match. Its dual-input LO-selectable SPDT switch provides 49dB isolation between LO1 and LO2 with 50ns switching time, optimized for frequency-agile architectures requiring rapid LO path reconfiguration.
Operation requires only 0dBm nominal LO drive and draws ≤100mA supply current at 4.75–5.25V. Performance is guaranteed across –40°C to +85°C at the exposed pad (TC), with thermal resistance θJC = +13°C/W - critical for high-density RF module thermal management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| RF Frequency Range | 650MHz to 1000MHz - supports GSM 850/900, WCDMA Band V/VI, and 700MHz LTE uplink/downlink bands. |
| LO Frequency Range | 650MHz to 1250MHz - enables high-side injection for downconversion and flexible upconversion in cellular infrastructure. |
| Conversion Loss | 7.0dB typical (downconverter) / 7.4dB typical (upconverter) - defines signal attenuation through mixing path; impacts cascaded noise figure and gain budget. |
| IIP3 | +33dBm typical at +25°C - determines third-order intermodulation distortion floor; critical for adjacent-channel interference suppression in multi-carrier base stations. |
| Noise Figure | 7.0dB single-sideband - sets minimum detectable signal level in receiver chains; measured with blocking signals up to +12dBm. |
| LO Switch Isolation | 49dB LO1-to-LO2 - ensures minimal crosstalk when selecting between two LO sources, preserving spectral purity in diversity or MIMO systems. |
| Supply Current | ≤100mA at VCC = 5V - enables low-power operation without external current limiting; supports thermal design under continuous RF excitation. |
Pinout & Package
The MAX2032ETP+ is housed in a 20-pin thin QFN package (5mm × 5mm) with exposed thermal pad (EP), rated for –40°C to +85°C operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 15 | LO2 / LO1 | Dual LO inputs; selected via LOSEL; support independent LO source routing for frequency agility. |
| 2, 3, 4, 6, 7, 12, 13, 14, 16, 17, 19, 20 | GND | Ground terminals including dedicated RF/IF/LO GNDs; require low-inductance PCB stitching to EP for optimal RF return path. |
| 5 | LOSEL | Logic-controlled LO input selector (VIL ≤ 0.8V, VIH ≥ 2V); enables fast switching between LO1 and LO2 paths. |
| 8 | RF | Single-ended RF port with integrated balun; connects directly to antenna or filter without external transformer. |
| 9, 10 | IF+, IF− | Differential IF output (downconvert) or input (upconvert); requires external IF balun or transformer for single-ended interface. |
| 11 | TAP | Current-setting node; external resistor adjusts bias current to trade power vs. linearity/performance. |
| 18 | LOBIAS | LO buffer bias control; sets LO drive sensitivity and switching speed of internal SPDT switch. |
| VCC (pins 11, 14, 16) | Supply | 4.75V–5.25V analog supply; multiple pins reduce IR drop and improve PSRR in high-frequency operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated RF & LO baluns | Eliminates need for external transformers, reducing BOM count and layout area while maintaining >17dB RF port return loss. |
| Built-in LO SPDT switch | 49dB isolation and 50ns switching enable dual-LO architectures without external RF switches or relays. |
| External current-setting resistor | Allows dynamic adjustment of supply current and IIP3 trade-off - e.g., reduced ICC lowers thermal load in compact modules. |
| Pin compatibility with MAX2039/MAX2041 | Enables shared PCB layout across 650–1000MHz and 1700–2200MHz bands, accelerating multi-band base station development. |
| Low LO drive requirement | Operates with –3dBm to +3dBm LO input - compatible with low-power synthesizers and reduces LO chain amplification needs. |
Applications
| WCDMA/LTE Base Stations | GSM 850/900 EDGE Base Stations |
|---|---|
Use Scenario: Downconverting 824–894MHz uplink signals to 140–160MHz IF in macrocell transceivers. IC Role / Device Role / Timing Role: Passive mixer core with integrated baluns and LO switch, performing RF-to-IF translation with minimal added noise. Use Value: +33dBm IIP3 suppresses in-band intermodulation from co-located carriers; 7dB NF maintains receiver sensitivity under strong blocker conditions. | Use Scenario: Upconverting 160MHz IF to 869–894MHz transmit band in BTS power amplifier driver stages. IC Role / Device Role / Timing Role: High-linearity upconverter with 7.4dB conversion loss and 24dBm P1dB, driving subsequent PA stages. Use Value: Low LO leakage (–35dBm at IF port) prevents spurious emissions; pin compatibility simplifies dual-band GSM/WCDMA board reuse. |
| iDEN® Base Stations | WiMAX™ Customer Premise Equipment |
Use Scenario: Frequency translation in narrowband TDMA repeaters operating at 800MHz band with strict adjacent-channel rejection requirements. IC Role / Device Role / Timing Role: Dual-LO mixer enabling rapid channel hopping via LOSEL-controlled switching between two synthesized sources. Use Value: 49dB LO1–LO2 isolation prevents cross-coupling during switching; 50ns settling ensures timing compliance in burst-mode transmission. | Use Scenario: IF-to-RF upconversion in fixed wireless access units targeting 2.3–2.7GHz bands using external LO multiplication. IC Role / Device Role / Timing Role: High-dynamic-range mixer accepting 0dBm LO drive and delivering clean RF output with <–75dBc 3LO–3RF spurs. Use Value: Integrated baluns simplify impedance matching to microstrip lines; 20-pin QFN enables compact RF module integration with thermal EP. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar passive mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX2029ETP+ | Optimized for low-side LO injection (570–900MHz LO range); same 20-pin QFN package and pinout. | Used where LO frequency < RF frequency (e.g., direct-conversion receivers); not suitable for high-side injection architectures. | Select MAX2029ETP+ only when system architecture mandates low-side LO injection and LO frequency falls below RF band. |
| MAX2039ETP+ | Identical pinout and function but rated for 1700–2200MHz RF/LO bands; shares same biasing and LO switch architecture. | Targets PCS, AWS, and 2.5GHz WiMAX bands; cannot replace MAX2032ETP+ in sub-1GHz designs due to frequency-dependent balun tuning. | Choose MAX2039ETP+ for 1.7–2.2GHz applications requiring identical layout and thermal profile - enables scalable multi-band platform design. |
Compared with MAX2029ETP+ and MAX2039ETP+, the MAX2032ETP+ uniquely supports high-side LO injection across 650–1000MHz while providing the highest IIP3 (+33dBm) in its class - making it optimal for interference-limited cellular base station receivers where linearity dominates SNR budgeting.
Availability
MAX2032ETP+ is available at Aetrix Electronics and suitable for WCDMA/LTE base stations, GSM EDGE infrastructure, iDEN repeaters, and WiMAX CPE requiring stable component supply, extended temperature operation, and high-volume RF production support.
Supply support for MAX2032ETP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, industrial, and automotive markets.
The MAX2032 belongs to Maxim's high-linearity passive mixer product line, engineered specifically for cellular infrastructure applications demanding wide dynamic range, integrated baluns, and multi-LO flexibility in compact form factors.
FAQ
What is the recommended LO drive level for MAX2032ETP+?
The MAX2032ETP+ operates optimally with an LO drive level between –3dBm and +3dBm, with 0dBm being the nominal value. This low drive requirement allows direct interfacing with low-power synthesizers and reduces the need for LO buffer amplifiers. Exceeding +3dBm may increase distortion, while levels below –3dBm degrade conversion loss and IIP3 performance - both specified in the AC Electrical Characteristics table under Recommended AC Operating Conditions.
Does MAX2032ETP+ support both upconversion and downconversion?
Yes, the MAX2032ETP+ is a bidirectional passive mixer supporting both upconversion (IF → RF) and downconversion (RF → IF) modes. Its datasheet provides separate AC Electrical Characteristics tables for each mode, confirming 7.4dB conversion loss in upconverter operation and 7.0dB in downconverter operation - both with validated performance across –40°C to +85°C and full LO/RF bandwidth coverage.
How does the LOSEL pin function in MAX2032ETP+?
The LOSEL pin on the MAX2032ETP+ controls the internal SPDT LO switch: logic-low (≤0.8V) selects LO1, and logic-high (≥2V) selects LO2. With 49dB isolation and 50ns switching time, it enables rapid LO path reconfiguration in frequency-hopping or diversity systems. The pin accepts standard CMOS logic levels and requires no external pull-up/down resistors per the Absolute Maximum Ratings and DC Electrical Characteristics sections.
What is the role of the TAP pin on MAX2032ETP+?
The TAP pin on the MAX2032ETP+ serves as the external current-setting node. Connecting a resistor between TAP and GND adjusts the internal bias current, allowing designers to trade supply current (ICC) against linearity (IIP3) and noise figure. For example, increasing the resistor value reduces ICC and power dissipation but also lowers IIP3 - a documented design option in the Features list and Electrical Characteristics tables.
Is MAX2032ETP+ pin-compatible with other mixers in the same family?
Yes, the MAX2032ETP+ is pin-compatible with the MAX2039ETP+ and MAX2041ETP+ - all share identical 20-pin thin QFN (5mm × 5mm) footprints and pin assignments. This enables common PCB layouts across 650–1000MHz (MAX2032ETP+) and 1700–2200MHz (MAX2039ETP+/MAX2041ETP+) bands, reducing NRE costs and accelerating multi-band base station development cycles.
MAX2032ETP+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-WQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- RF Type:
- GSM, EDGE, CDMA
- Frequency:
- 650MHz ~ 1GHz
- Number of Mixers:
- 1
- Gain:
- -
- Noise Figure:
- 7dB
- Secondary Attributes:
- Up/Down Converter
- Current - Supply:
- 85mA
- Voltage - Supply:
- 4.75V ~ 5.25V
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TQFN (5x5)
MAX2032ETP+ FAQ
1.How can I place an order for MAX2032ETP+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX2032ETP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX2032ETP+ reliable?
The price and inventory of MAX2032ETP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX2032ETP+ is usually 5 days.
3.What payment methods are accepted for MAX2032ETP+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX2032ETP+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX2032ETP+?
MAX2032ETP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX2032ETP+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX2032ETP+?
For technical support, including MAX2032ETP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX2032ETP+ requirements.
6.How does Aetrix verify that MAX2032ETP+ is sourced from the original manufacturer or authorized distributors?
All MAX2032ETP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX2032ETP+ meets industry standards.
7.What is the process for return or replacement of MAX2032ETP+?
All MAX2032ETP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX2032ETP+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX2032ETP+ part is unused and in its original packaging.
Return procedure for MAX2032ETP+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX2032ETP+ Tags
-
MAX2671EUT+T
Analog Devices Inc./Maxim Integrated
-
ADEX-10+
Mini-Circuits
-
ADE-2+
Mini-Circuits
-
ADE-1+
Mini-Circuits
-
LT5560EDD#PBF
Analog Devices Inc.
-
LT5560EDD#TRPBF
Analog Devices Inc.
-
LTC5562IUC#TRPBF
Analog Devices Inc.
-
MAX2681EUT+T
Analog Devices Inc./Maxim Integrated
-
ADE-1ASK+
Mini-Circuits
-
ADE-1L+
Mini-Circuits
-
ADL5350ACPZ-R7
Analog Devices Inc.
-
AD608ARZ-RL
Analog Devices Inc.
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
