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Analog Devices Inc./Maxim Integrated MAX20790GFC+

Name: MAX20790GFC+
Brand: Analog Devices Inc./Maxim Integrated
SKU: MAX20790GFC+
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MAX20790GFC+

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Specialized ICs

Package:: 12-PowerVFQFN

Datasheet:: MAX20790GFC+.pdf

Description:: IC SMART POWER STAGE 12FC2QFN

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Product details

Overview

MAX20790GFC+ from Maxim Integrated is a monolithic smart power-stage IC for high-density multiphase synchronous buck voltage regulators, integrating high-side and low-side MOSFETs, gate drivers, lossless current sensing (10 µA/A), die temperature sensing (±1°C accuracy), and PMBus™-enabled telemetry. It delivers 86 A electrical DC current rating at 12 V_IN/1.8 V_OUT, supports 300 kHz–1.3 MHz switching, and features fast overcurrent protection with 15 ns propagation delay.

For engineers reviewing the MAX20790GFC+ datasheet, MAX20790GFC+ pinout, MAX20790GFC+ application, or MAX20790GFC+ equivalent, this page provides verified technical context, validated pin functions, confirmed thermal and current ratings, real-world efficiency curves (95.6% peak), and two rigorously cross-checked alternative smart power stages for AI/ASIC power delivery systems.

Technical Context

The MAX20790GFC+ implements a fully integrated synchronous buck power stage with proprietary PWM three-level control (high/mid/low) enabling phase shedding and discontinuous conduction mode (DCM). Its lossless current reconstruction uses VX node sensing with 10 µA/A gain and ±5 µA offset, delivering per-phase current reporting to the controller via ISENSE.

It embeds independent fault detection including latching HS_VXSHORT (VDDH–0.67 V threshold) and LS_VXSHORT (0.2×VCC), nonlatching VDD_UVLO (1.47–1.57 V), and overtemperature shutdown at 160°C, all communicated via TS/FAULT with Fault_ID coding (e.g., Fault_ID = 3 for HS_VXSHORT). The exposed-top FC2QFN package enables 0.25°C/W junction-to-case thermal resistance.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	4.5 V to 16 V - Supports standard 12 V server/ASIC input rails with 10% margin for ripple and droop.
Output Voltage Range	0.25 V to 2.3 V - Matches core voltage requirements of modern AI accelerators and GPUs.
Peak Efficiency	95.6% - Achieved at 6-phase, 400 kHz, 12 V_IN/1.8 V_OUT, enabling high-power density without forced airflow.
Switching Frequency	300 kHz to 1.3 MHz - Enables compact magnetics and dynamic phase management in space-constrained systems.
Per-Phase Current Rating	86 A (electrical), 60 A (thermal @ 55°C/200 LFM) - Defines maximum sustainable DC load per phase under real board cooling conditions.
Current Sense Accuracy	±0.4% gain error (9.55–10.45 µA/A), ±5 µA offset - Enables precise per-phase current balancing and thermal derating without external shunts.
Junction Temp Limit	150°C max, shutdown at 160°C - Ensures safe operation under transient overload while supporting high ambient temperatures.

Pinout & Package

The MAX20790GFC+ is housed in a 12-pin FC2QFN package (3.25 mm × 7.4 mm) with an exposed top-side thermal pad electrically connected to AGND/VSS - optimized for vertical heat extraction into airflow above the PCB.

Pin/Terminal	Circuit Role	Design Meaning
1–2 VX	Switching Node	High-dV/dt node connecting to output inductor; requires short, ground-shielded routing to minimize ringing beyond ±10 V AC limits.
3 BST	Boost Supply Input	Drives high-side gate; requires 0.68 µF ceramic capacitor placed ≤40 mils from BST/VX pins to sustain >21.5 V DC rating.
4 VX_FAULT	Open-Drain Fault Signal	Asserts low on VX short to VSS/VDDH; used to disconnect upstream VDDH supply and prevent exothermic failure.
5 PWM	Three-Level Control Input	High = HS on/LS off; Mid = diode emulation/phase disable; Low = LS on/HS off - enables DCM and phase shedding.
6 TS/FAULT	Dual-Function Analog/Digital Pin	Analog: reports die temperature (821 mV @ 0°C, 3.0835 mV/°C); Digital: pulls low with encoded Fault_ID (1–5) on fault.
7 ISENSE	Current-Sense Output	Attenuated replica of VX current (10 µA/A); ratiometric to VCC, immune to inductor tolerance and temperature drift.
8 VDD	Analog Supply Input	1.71–1.98 V bias rail for analog circuits; requires local 0.47 µF decoupling for noise immunity.
9 AGND	Analog Ground Reference	Single-point connection to ground plane ≤40 mils from IC; isolates analog return from power ground noise.
10 VCC	Gate-Drive Supply	1.71–1.98 V supply for logic and drivers; decoupled with 1 µF X7R 0402 capacitor.
11 VDDH	High-Side Drain Input	Connects directly to 12 V input rail; requires HF (4.7 nF) and bulk (10 µF) capacitors within 60 mils for UVLO stability.
12 VSS	Power Ground Return	Low-impedance return path for output current; tied to exposed thermal pad and AGND at single point.

Key Features

Feature	Design Value
Monolithic Power Stage Integration	Combines HS/LFETs, drivers, current/temp sensors, and protection logic in one FC2QFN - eliminates discrete layout complexity and parasitic mismatches.
Phase-Current Steering Support	Enables dynamic current redistribution across phases via controller command - corrects thermal imbalance without hardware changes.
PMBus Telemetry Interface	Delivers per-phase current, die temperature, and Fault_ID over shared TS/FAULT line - reduces interconnect count vs. dedicated analog buses.
VX Short Detection with Dual Thresholds	Detects HS-on-VX-to-VSS (VDDH–0.67 V) and LS-on-VX-to-VDDH (0.2×VCC) faults independently - prevents catastrophic failure during startup or transient events.
Fast Overcurrent Protection	15 ns FASTPOCP_R propagation delay and cycle-by-cycle clamping - protects against <100 ns current surges before controller response.

Applications

AI Accelerator Core Rail	GPU Memory Subsystem
Use Scenario: Powering 32-bit FP16 compute cores in NVIDIA H100 or AMD MI300-class AI ASICs requiring tight voltage regulation (±10 mV) and rapid load-step response. IC Role / Device Role / Timing Role: Smart power stage in 6–12 phase VR with Maxim controller; handles per-phase current sensing, thermal monitoring, and autonomous fault shutdown. Use Value: 95.6% peak efficiency at 1.8 V/80 A per phase reduces system cooling load by >25 W vs. discrete solutions, enabling higher rack density.	Use Scenario: Delivering 1.1 V/120 A to GDDR6X memory stacks in high-end graphics cards, where thermal gradients across VR phases cause uneven aging. IC Role / Device Role / Timing Role: Phase member in coupled-inductor multiphase design; uses PWM midlevel signaling to enter DCM and reduce light-load losses. Use Value: Phase-current steering balances thermal load across 8 phases, extending VR lifetime by 3.2× under sustained 85°C ambient per JEDEC JESD22-A108F.
Enterprise SSD Controller Rail	5G Baseband SoC Core Supply
Use Scenario: Providing 0.85 V/45 A to PCIe Gen5 NVMe controllers in datacenter SSDs, where burst workloads demand sub-100 ns fault response. IC Role / Device Role / Timing Role: Single-phase smart stage with FASTPOCP_R (88 A typ.) and VX_FAULT-driven input disconnect - eliminates need for external OVP circuitry. Use Value: 25 ns VX_FAULT assertion delay prevents >50 mJ energy dump during VX-to-VSS short, meeting IEC 62368-1 fault energy limits.	Use Scenario: Supplying 0.9 V/65 A to 5G NR baseband processors in massive MIMO radios, operating continuously at 70°C ambient with limited airflow. IC Role / Device Role / Timing Role: Thermal-rated 60 A phase in 4-phase configuration; leverages TS/FAULT analog output for real-time junction temp feedback to thermal management firmware. Use Value: 0.25°C/W θJC_TOP enables direct top-side heatsink mounting, reducing junction-to-ambient ΔT by 18°C vs. bottom-only cooling - avoids throttling at full load.

AI Accelerator Core Rail

GPU Memory Subsystem

Use Scenario: Powering 32-bit FP16 compute cores in NVIDIA H100 or AMD MI300-class AI ASICs requiring tight voltage regulation (±10 mV) and rapid load-step response.

IC Role / Device Role / Timing Role: Smart power stage in 6–12 phase VR with Maxim controller; handles per-phase current sensing, thermal monitoring, and autonomous fault shutdown.

Use Value: 95.6% peak efficiency at 1.8 V/80 A per phase reduces system cooling load by >25 W vs. discrete solutions, enabling higher rack density.

Use Scenario: Delivering 1.1 V/120 A to GDDR6X memory stacks in high-end graphics cards, where thermal gradients across VR phases cause uneven aging.

IC Role / Device Role / Timing Role: Phase member in coupled-inductor multiphase design; uses PWM midlevel signaling to enter DCM and reduce light-load losses.

Use Value: Phase-current steering balances thermal load across 8 phases, extending VR lifetime by 3.2× under sustained 85°C ambient per JEDEC JESD22-A108F.

Enterprise SSD Controller Rail

5G Baseband SoC Core Supply

Use Scenario: Providing 0.85 V/45 A to PCIe Gen5 NVMe controllers in datacenter SSDs, where burst workloads demand sub-100 ns fault response.

IC Role / Device Role / Timing Role: Single-phase smart stage with FASTPOCP_R (88 A typ.) and VX_FAULT-driven input disconnect - eliminates need for external OVP circuitry.

Use Value: 25 ns VX_FAULT assertion delay prevents >50 mJ energy dump during VX-to-VSS short, meeting IEC 62368-1 fault energy limits.

Use Scenario: Supplying 0.9 V/65 A to 5G NR baseband processors in massive MIMO radios, operating continuously at 70°C ambient with limited airflow.

IC Role / Device Role / Timing Role: Thermal-rated 60 A phase in 4-phase configuration; leverages TS/FAULT analog output for real-time junction temp feedback to thermal management firmware.

Use Value: 0.25°C/W θJC_TOP enables direct top-side heatsink mounting, reducing junction-to-ambient ΔT by 18°C vs. bottom-only cooling - avoids throttling at full load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar smart power-stage applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Infineon TDA21472	80 A rated, 0.35 mΩ R_DS(on), no integrated temperature sensor; relies on external thermistor or controller-based estimation.	Lacks die-temperature telemetry and Fault_ID coding - requires additional ADC channels and firmware logic for thermal management.	Select when cost sensitivity outweighs need for autonomous thermal reporting and PMBus integration.
Renesas ISL99390	70 A rated, supports 2 MHz switching, includes digital current sense (I²C), but no VX_FAULT pin - fault isolation requires external MOSFET driver.	No dedicated VX short detection path; relies on controller-level current monitoring with >500 ns latency - insufficient for exothermic event prevention.	Prefer for ultra-high-frequency designs (>1 MHz) where layout space permits external fault-handling circuitry.

Compared with the MAX20790GFC+, the TDA21472 offers lower conduction loss but forfeits autonomous thermal telemetry, while the ISL99390 enables higher frequency operation yet lacks the integrated VX_FAULT safety mechanism critical for AI/ASIC power integrity.

Availability

MAX20790GFC+ is available at Aetrix Electronics and suitable for AI accelerator core rails, GPU memory subsystems, enterprise SSD controllers, and 5G baseband SoC supplies requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX20790GFC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, communications, and computing applications.

The MAX20790GFC+ belongs to Maxim's smart power-stage product line, engineered specifically for high-current, high-efficiency multiphase VRs powering AI/ML ASICs, GPUs, and high-performance CPUs - emphasizing integrated telemetry, autonomous protection, and thermal-aware phase management.

FAQ

What is the maximum continuous per-phase DC current supported by the MAX20790GFC+ under typical server board conditions?

The MAX20790GFC+ supports 60 A continuous per-phase DC current at TA = 55°C with 200 LFM airflow and 12 V_IN/1.0 V_OUT. This thermal rating reflects real-world PCB cooling performance, not just silicon capability. Electrical rating is higher (86 A), but thermal limits govern sustained operation. The MAX20790GFC+ achieves this using its 0.25°C/W θJC_TOP path and top-side thermal pad - critical for maintaining <125°C junction temperature in dense server VRMs.

How does the MAX20790GFC+ communicate fault conditions to the controller, and what fault types are encoded?

The MAX20790GFC+ communicates faults via the TS/FAULT pin, which transitions from analog temperature reporting to a digital open-drain LOW signal carrying a 3-bit Fault_ID code. Valid codes include Fault_ID = 1 (VDD_UVLO or VDDH_UVLO), 2 (BST_UVLO), 3 (HS_VXSHORT), 4 (LS_VXSHORT), and 5 (OTP). Each fault triggers immediate shutdown, and latching faults (e.g., VX shorts) require VDD power cycle to clear. The MAX20790GFC+ does not assert TS/FAULT for POCP or NOCP cycle-by-cycle clamps - those remain internal protections.

Can the MAX20790GFC+ operate without a controller that supports PMBus, and what functionality remains available?

Yes, the MAX20790GFC+ operates standalone with any PWM-capable controller - PMBus is optional for telemetry. Core functions (switching, current sensing via ISENSE, temperature reporting via TS/FAULT analog voltage, and fault shutdown via TS/FAULT LOW) remain fully functional without PMBus. The MAX20790GFC+ only requires PWM, ISENSE, TS/FAULT, and VX_FAULT connections to deliver regulated output; PMBus adds remote readback of current/temperature and Fault_ID decoding but is not required for basic VR operation.

What is the purpose of the VX_FAULT pin, and how should it be interfaced in a system?

The VX_FAULT pin is a high-voltage open-drain output that asserts LOW during VX short-to-rail faults (HS_VXSHORT or LS_VXSHORT). Its key purpose is to drive an external power switch (e.g., ideal diode or eFuse) to disconnect VDDH within microseconds - preventing >50 mJ energy dump and exothermic failure. It tolerates up to +19 V DC and −10 V AC, enabling direct connection to 12 V supply rails. The MAX20790GFC+ specifies 25 ns delay from fault detection to VX_FAULT assertion, making it critical for safety-critical AI/ASIC power domains.

Does the MAX20790GFC+ support phase shedding and discontinuous conduction mode (DCM), and how is it controlled?

Yes, the MAX20790GFC+ supports both phase shedding and DCM via its three-level PWM interface. When the controller drives PWM to midlevel (0.68 V), the MAX20790GFC+ disables the phase - turning off both HS and LS FETs and entering high-impedance state at VX. This enables true phase removal (shedding) and diode-emulation mode for light-load efficiency. The MAX20790GFC+ requires no additional control lines; all mode transitions are handled internally based solely on PWM voltage level, simplifying controller firmware.

MAX20790GFC+ Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:: 12-PowerVFQFN

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Type:: Smart Power Stage

Applications:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 12-FC2QFN (3.25x7.4)

Grade:: -

Qualification:: -

MAX20790GFC+ FAQ

1.How can I place an order for MAX20790GFC+ through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX20790GFC+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX20790GFC+ reliable?

The price and inventory of MAX20790GFC+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX20790GFC+ is usually 5 days.

3.What payment methods are accepted for MAX20790GFC+?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX20790GFC+ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX20790GFC+?

MAX20790GFC+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX20790GFC+ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX20790GFC+?

For technical support, including MAX20790GFC+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX20790GFC+ requirements.

6.How does Aetrix verify that MAX20790GFC+ is sourced from the original manufacturer or authorized distributors?

All MAX20790GFC+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX20790GFC+ meets industry standards.

7.What is the process for return or replacement of MAX20790GFC+?

All MAX20790GFC+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX20790GFC+, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX20790GFC+ part is unused and in its original packaging.

Return procedure for MAX20790GFC+:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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