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Analog Devices Inc./Maxim Integrated MAX2322EUP+T
- Part No.:
- MAX2322EUP+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- RF Misc ICs and Modules
- Package:
- 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Datasheet:
-
MAX2322EUP+T.pdf
- Description:
- IC LNA/MIXER SIGE ADJ 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,256
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Product details
Overview
MAX2322EUP+T from Maxim Integrated is a silicon germanium (SiGe) dual-band LNA/mixer IC designed for CDMA cellular/PCS RF front-ends. It operates in both cellular (800–1000 MHz) and PCS (1800–2500 MHz) bands, delivers 14.5 dB high-gain LNA performance with 1.4 dB noise figure (cellular band), supports pin-selectable low-gain mode (−17 dB gain reduction), and integrates LO frequency doubler functionality. It targets battery-sensitive handset applications requiring ultra-low current in paging mode.
For engineers reviewing the MAX2322EUP+T datasheet, MAX2322EUP+T pinout, MAX2322EUP+T application, or MAX2322EUP+T equivalent, key selection criteria include its dual-band LNA/mixer integration, 15–19.5 mA operating supply current across modes, TSSOP-EP package thermal performance, and compatibility with CDMA/TDMA/WCDMA multi-mode transceiver architectures.
Technical Context
The MAX2322EUP+T implements a dual-path SiGe RF front-end with independent low-band (LNAINL/MIXINL) and high-band (LNAINH/MIXINH) signal chains. Its LNA features two gain states-high-gain/high-linearity (14–16 dB) and pin-selectable low-gain/high-linearity (−1.5 to −2 dB)-with corresponding IIP3 of +6 to +13.5 dBm and NF of 1.4–4.5 dB depending on mode and band.
It includes an integrated LO frequency doubler (enabled via LOX2 pin), dual differential CDMA mixer outputs (CDMA+/CDMA−), single-ended FM mixer output (FMOUT), and separate LO buffer enable (BUFFEN) for independent power control. All RF paths support 50 Ω system impedance and are characterized over −40°C to +85°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | +2.7 V to +3.6 V - Enables direct integration with 3.3 V mobile power rails without level-shifting. |
| Operating Supply Current | 15–19.5 mA - Covers high-gain, low-gain, and paging modes; critical for standby time optimization in handsets. |
| LNA Gain (Cellular Band) | 14.5 dB (typ) - Delivers sufficient gain before downconversion while maintaining cascaded linearity. |
| Input IP3 (Cellular Band) | +12.5 dBm (typ, high-gain mode) - Mitigates intermodulation from strong adjacent-channel interferers. |
| Noise Figure (Cellular Band) | 1.4 dB (typ, high-gain mode) - Ensures high sensitivity in weak-signal reception scenarios. |
| LO Frequency Doubler | Integrated - Reduces external VCO complexity by enabling PCS-band operation from lower-frequency LO sources. |
| Package | 20-pin TSSOP-EP (6 mm × 6.3 mm) - Exposed paddle enhances thermal dissipation for sustained RF performance. |
Pinout & Package
MAX2322EUP+T is housed in a 20-pin TSSOP-EP package with exposed thermal pad (EP), optimized for RF thermal management and PCB-level grounding in compact handset layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (RBIAS) | LNA bias-setting resistor connection | 20 kΩ to ground sets nominal LNA linearity; adjustable for trade-off between gain, NF, and IIP3. |
| 2 (LNAOUTL) | Low-band LNA output | Differential-capable node requiring pull-up inductor + series capacitor for 50 Ω matching to mixer. |
| 3 (LNAOUTH) | High-band LNA output | Same interface as LNAOUTL; enables concurrent dual-band receive path design. |
| 6 (LNAINL) | Low-band RF input | AC-coupled input with integrated ESD protection; requires external matching network for 50 Ω broadband match. |
| 4 (LNAINH) | High-band RF input | Independent RF path; allows simultaneous cellular/PCS band reception without switching loss. |
| 9 (LOLIN) | Low-frequency LO input | Accepts 700–1150 MHz LO for FM or cellular digital mode; referenced to GND. |
| 10 (LOHIN) | High-frequency LO input | Accepts 1600–2300 MHz LO; used in PCS mode with or without doubler (LOX2-controlled). |
| 15 (BUFFEN) | LO buffer enable | Active-high control; powers LO buffers independently to minimize current when LO not active. |
| 16/17 (CDMA+/CDMA−) | Differential IF outputs | 50 Ω-terminated differential pair; supports direct connection to baseband ADC or IF filter. |
| 13 (FMOUT) | FM mixer single-ended output | Requires pull-up inductor + series capacitor; optimized for lower-current FM demodulation path. |
| 19 (MIXINL) | Low-band mixer input | Connects to LNAOUTL; completes low-band downconversion chain with internal passive mixer core. |
| 12 (LOLOUT) | Low-frequency LO buffer output | Open-collector; requires ≤100 Ω pull-up for drive capability into external VCO or divider. |
| 11 (LOHOUT) | High-frequency LO buffer output | Same topology as LOLOUT; supports local LO distribution without external amplification. |
| 8 (GAIN) | Gain-select logic input | Pin-selectable: high = high-gain LNA mode; low = low-gain (−17 dB) bypass mode. |
| 7 (LIN) | Linearity-select logic input | Controls LNA bias point; used with RBIAS to fine-tune IIP3/NF trade-off. |
| 18 (SHDN) | Shutdown logic input | Active-low; reduces ICC to 0.1 µA for full system sleep state compliance. |
| 14 (VCC) | Power supply | Must be bypassed with 1000 pF capacitor near pin to suppress RF supply noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-band LNA/mixer integration | Single-chip solution for cellular + PCS bands eliminates discrete switch + dual-LNA layout complexity. |
| Pin-selectable low-gain LNA mode | Reduces gain by 17 dB and supply current by 3 mA - extends battery life during non-critical reception. |
| Integrated LO frequency doubler | Enables PCS-band operation using lower-cost, lower-frequency VCOs - reduces BOM count and layout area. |
| 0.1 µA shutdown current | Meets stringent 3GPP idle-mode power requirements for GSM/CDMA handsets. |
| Exposed-pad TSSOP package | Thermal resistance θJA ≈ 45°C/W - sustains 15–20 mA RF operation without derating at +85°C ambient. |
Applications
| CDMA Dual-Mode Handset Front-End | Multi-Band WLL Base Station Receiver |
|---|---|
Use Scenario: Simultaneous cellular (850 MHz) and PCS (1900 MHz) receive in a single-slot CDMA phone supporting IS-95 and cdma2000 standards. IC Role / Device Role / Timing Role: Dual-path LNA/mixer front-end providing gain, noise suppression, and image rejection prior to quadrature demodulation. Use Value: 14.5 dB LNA gain and +12.5 dBm IIP3 ensure robust link budget in urban multipath environments with co-site interferers. | Use Scenario: Fixed wireless access unit receiving uplink signals from subscriber units across 800 MHz and 1900 MHz bands in rural deployments. IC Role / Device Role / Timing Role: High-linearity RF front-end conditioning signal before digitization in wide-dynamic-range ADC. Use Value: Low 1.4 dB noise figure preserves SNR for weak long-distance signals; TSSOP-EP package simplifies thermal design in sealed enclosures. |
| Tri-Mode (CDMA/GSM/PDC) Mobile Terminal | FM Radio Integration Module |
Use Scenario: Single-board implementation supporting CDMA (cellular), GSM (PCS), and PDC (Japanese cellular) bands in global roaming handsets. IC Role / Device Role / Timing Role: Reconfigurable LNA/mixer core dynamically switched per band via BAND, GAIN, and LIN pins. Use Value: Pin-selectable modes eliminate need for external GPIO-controlled RF switches - reduces bill-of-materials and insertion loss. | Use Scenario: Embedded FM radio receiver in smartphones where space and current budget constrain analog front-end options. IC Role / Device Role / Timing Role: Dedicated FM mixer path (LOLIN + FMOUT) operating at 87.5–108 MHz with 9.7–12.7 dB conversion gain. Use Value: 10.6 mA typical FM-mode current and 11.1 dB noise figure meet portable audio SNR requirements without dedicated FM IC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-band LNA/mixer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX2320EUP+T | Lacks integrated LO doubler; uses external doubler or higher-frequency VCO for PCS band. | Suitable for designs where LO architecture is fixed and doubler is already present off-chip. | Select when minimizing die size and cost is prioritized over LO subsystem integration. |
| MAX2321EUP+T | Includes LO frequency divider (not doubler); supports different LO synthesis topologies (e.g., integer-N PLL with ÷2). | Better suited for systems using lower-frequency reference clocks and requiring precise LO phase alignment. | Choose when system-level LO generation relies on division rather than multiplication. |
Compared with MAX2320EUP+T and MAX2321EUP+T, the MAX2322EUP+T uniquely integrates an LO doubler-reducing external component count for PCS-band LO generation-while retaining identical pinout, supply, and thermal specifications for drop-in replacement in existing layouts.
Availability
MAX2322EUP+T is available at Aetrix Electronics and suitable for CDMA handset design, wireless local loop receivers, and tri-mode mobile terminal development requiring stable component supply, consistent parametric performance, and long-term production continuity.
Supply support for MAX2322EUP+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and RF solutions for communications, computing, and consumer markets.
The MAX232x family was engineered specifically for ultra-low-power, high-linearity RF front-ends in battery-powered CDMA and multi-mode cellular handsets, emphasizing SiGe process advantages in noise and linearity at sub-20 mA currents.
FAQ
What is the primary RF function of the MAX2322EUP+T?
The MAX2322EUP+T is a dual-band silicon germanium (SiGe) LNA/mixer IC that provides low-noise amplification and downconversion for both cellular (800–1000 MHz) and PCS (1800–2500 MHz) bands. It integrates two independent LNA paths, differential CDMA mixers, a single-ended FM mixer, and an on-chip LO frequency doubler. The MAX2322EUP+T enables compact, low-current front-end designs for CDMA, WCDMA, and multi-mode handsets without requiring external gain blocks or LO doublers.
Does the MAX2322EUP+T support pin-compatible replacement with other MAX232x variants?
Yes, the MAX2322EUP+T shares identical pinout, package (20-pin TSSOP-EP), supply voltage range (+2.7 V to +3.6 V), and thermal characteristics with MAX2320EUP+T, MAX2321EUP+T, and MAX2324EUP+T. However, functional differences exist: MAX2322EUP+T includes an integrated LO doubler (LOX2 pin), whereas MAX2320EUP+T lacks it and MAX2321EUP+T includes an LO divider instead. System-level validation of LO path configuration is required before substitution.
How does the LOX2 pin affect MAX2322EUP+T operation in PCS band?
The LOX2 pin on the MAX2322EUP+T enables or disables the internal LO frequency doubler. When LOX2 = high, the high-band LO input (LOHIN) accepts ~875 MHz and internally doubles it to ~1750 MHz for PCS-band mixing; when LOX2 = low, LOHIN accepts ~1750 MHz directly. This flexibility allows designers to use either a lower-frequency, lower-phase-noise VCO (with doubler enabled) or a fundamental PCS-band VCO (with doubler disabled), preserving the same MAX2322EUP+T footprint and biasing.
What is the significance of the RBIAS and RLNA pins on the MAX2322EUP+T?
RBIAS (Pin 1) and RLNA (Pin 3) on the MAX2322EUP+T configure the LNA's DC bias point to optimize the trade-off between noise figure (NF), gain, and input third-order intercept (IIP3). RBIAS connects a 20 kΩ resistor to ground for nominal operation; RLNA adjusts LNA linearity in high-gain modes. Together, they allow fine-tuning of LNA performance across temperature and process variation-critical for meeting CDMA ACPR and sensitivity specs across production lots and environmental conditions. The MAX2322EUP+T datasheet provides recommended resistor values for specific NF/IIP3 targets.
Can the MAX2322EUP+T operate in FM radio mode simultaneously with cellular/PCS receive?
No-the MAX2322EUP+T does not support true simultaneous operation across all three modes. Its FM mixer path (LOLIN + FMOUT) is mutually exclusive with the digital-mode LNA/mixer paths (LNAINL/LNAINH + MIXINL/MIXINH). Operation is controlled by logic inputs (BAND, GAIN, LIN, SHDN): FM mode activates only when configured via specific pin states (e.g., BAND low, GAIN low), disabling the CDMA mixer and LNA paths. Thus, the MAX2322EUP+T serves as a reconfigurable single-purpose front-end-not a concurrent triple-mode receiver-and requires external switching or time-multiplexed use in multi-standard devices.
MAX2322EUP+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Dual Band LNA/Mixer
- Frequency:
- 1.85GHz ~ 1.91GHz
- RF Type:
- PCS
- Secondary Attributes:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP-EP
MAX2322EUP+T FAQ
1.How can I place an order for MAX2322EUP+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX2322EUP+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX2322EUP+T reliable?
The price and inventory of MAX2322EUP+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX2322EUP+T is usually 5 days.
3.What payment methods are accepted for MAX2322EUP+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX2322EUP+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX2322EUP+T?
MAX2322EUP+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX2322EUP+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX2322EUP+T?
For technical support, including MAX2322EUP+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX2322EUP+T requirements.
6.How does Aetrix verify that MAX2322EUP+T is sourced from the original manufacturer or authorized distributors?
All MAX2322EUP+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX2322EUP+T meets industry standards.
7.What is the process for return or replacement of MAX2322EUP+T?
All MAX2322EUP+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX2322EUP+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX2322EUP+T part is unused and in its original packaging.
Return procedure for MAX2322EUP+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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