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Analog Devices Inc./Maxim Integrated MAX3000EEBP

Part No.:
MAX3000EEBP
Manufacturer:
Analog Devices Inc./Maxim Integrated
Category:
Translators, Level Shifters
Package:
Datasheet:
AetrixMAX3000EEBP.pdf
Description:
IC TRANSLTR BIDIRECTIONAL 20UCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,057

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Product details

Overview

MAX3000EEBP from Maxim Integrated is an 8-channel bidirectional logic-level translator IC designed for voltage-domain bridging between low-voltage (VL = +1.2V to +5.5V) and higher-voltage (VCC = +1.65V to +5.5V) digital systems. It operates at a guaranteed 230kbps data rate, features ±15kV HBM ESD protection on VCC-side I/Os, consumes only 0.1µA in shutdown mode, and requires no direction control pin. It is used in cellphone cradles and portable POS systems where robust, low-power level shifting between ASICs and 3.3V/5V peripherals is required.

For engineers reviewing the MAX3000EEBP datasheet, MAX3000EEBP pinout, MAX3000EEBP application, or MAX3000EEBP equivalent, key selection criteria include its bidirectional architecture without direction pin, guaranteed 230kbps throughput under 50pF load, ±15kV ESD rating on VCC I/Os, ultra-low 0.1µA shutdown current, and compatibility with UCSP package constraints in space-constrained portable designs.

Technical Context

The MAX3000EEBP employs a passive-bidirectional MOSFET-based translation architecture that enables automatic signal flow in either direction (VL ↔ VCC) per channel without external direction control. Its input thresholds are dynamically referenced to VL and VCC (VIHL/VILL = 2/3×VL and 1/3×VL; VIHC/VILC = 2/3×VCC and 1/3×VCC), ensuring reliable switching across wide voltage combinations.

It integrates an EN pin that places all eight VCC-side I/Os into high-impedance state while enabling 6kΩ pulldowns on VL-side I/Os during shutdown, reducing both VCC and VL supply currents to <2µA. The device supports full rail-to-rail operation and tolerates VL ≥ VCC during power-up without latch-up or damage.

Key Specifications

ParameterValue and Actual Design Meaning
Data RateGuaranteed 230kbps - ensures reliable SPI/MICROWIRE communication over 50pF loads at 25°C.
VL Supply Range+1.2V to +5.5V - enables interface with 1.2V, 1.8V, 2.5V, 3.3V, or 5V logic domains on low-voltage side.
VCC Supply Range+1.65V to +5.5V - supports translation up to 5V systems while maintaining compatibility with 1.8V–3.3V host controllers.
ESD Protection±15kV HBM on VCC-side I/Os - eliminates need for external TVS diodes in externally routed signal paths (e.g., USB/UART connectors).
Shutdown Current0.1µA max - reduces system standby power in battery-powered devices such as smart card readers and GPS modules.
Propagation Delay1000ns max (I/O VL → I/O VCC) - defines worst-case timing budget for synchronous protocols like SPI clocked at ≤230kHz.
Channel Count8 independent bidirectional channels - matches standard 8-bit parallel buses or dual 4-bit SPI interfaces without multiplexing.

Pinout & Package

The MAX3000EEBP is packaged in a 4mm × 5mm, 20-bump UCSP™ (Ultra-Compact Silicon Package) with exposed pad (EP) for thermal grounding. Pin mapping follows the UCSP layout with VL and VCC power pins adjacent to GND for optimal decoupling, and I/O pairs arranged to minimize trace crosstalk in dense PCB layouts.

Pin/TerminalCircuit RoleDesign Meaning
I/O VL1–I/O VL8VL-referenced bidirectional I/OConnect to low-voltage domain signals (e.g., 1.8V ASIC GPIO); automatically translate to VCC levels and vice versa.
I/O VCC1–I/O VCC8VCC-referenced bidirectional I/OInterface directly with 3.3V/5V peripherals; no level-shifting buffer needed on host side.
VLLow-voltage supply inputMust be bypassed with 0.1µF capacitor to GND; sets logic thresholds for VL-side I/Os.
VCCHigh-voltage supply inputMust be bypassed with 0.1µF capacitor to GND; sets logic thresholds for VCC-side I/Os and powers internal circuitry.
ENEnable control inputPull low to disable VCC-side outputs (3-state) and activate 6kΩ pulldowns on VL-side I/Os for bus hold during sleep.
GNDGround referenceCommon return path for both domains; must connect to exposed pad (EP) for thermal and noise performance.

Key Features

FeatureDesign Value
Bidirectional translation without direction pinEliminates PCB routing complexity and firmware overhead for direction management in full-duplex interfaces like UART or I²C.
±15kV HBM ESD protection on VCC I/OsEnables direct connection to external ports (e.g., cradle docking connectors) without discrete ESD components.
0.1µA shutdown supply currentExtends battery life in portable POS terminals by minimizing quiescent drain during idle periods.
1.2V minimum VL operationSupports next-generation ultra-low-voltage ASICs and FPGA I/O banks operating at 1.2V core logic.
UCSP package (4mm × 5mm)Reduces board area by >60% vs. TSSOP-20, critical for slim cellphone accessories and wearable device interfaces.

Applications

Cellphone CradlesSmart Card Readers

Use Scenario: Docking station translating UART/I²C signals between 1.8V smartphone SoC and 3.3V host MCU.

IC Role / Device Role / Timing Role: Bidirectional level shifter enabling full-duplex communication without direction control or protocol modification.

Use Value: Eliminates need for separate TX/RX translators and direction logic, reducing BOM count and PCB layer count in compact cradle PCBs.

Use Scenario: Contact-based smart card interface in handheld payment terminal with 1.2V card controller and 3.3V secure element.

IC Role / Device Role / Timing Role: Voltage-domain bridge supporting ISO/IEC 7816-3 T=0 protocol timing at 230kbps with guaranteed setup/hold margins.

Use Value: Enables direct 1.2V card interfacing without intermediate regulators or discrete FET translators, improving power efficiency and reliability.

Portable POS SystemsGPS Modules

Use Scenario: Battery-powered point-of-sale terminal connecting 1.8V microcontroller to 5V barcode scanner and thermal printer.

IC Role / Device Role / Timing Role: 8-channel translator handling parallel data bus and control lines (STB, ACK) simultaneously with matched propagation delay.

Use Value: Maintains timing coherence across all 8 lines (≤5ns skew), preventing data corruption during high-speed parallel transfers.

Use Scenario: GNSS receiver module interfacing 1.8V baseband processor with 3.3V RF front-end and antenna switch control lines.

IC Role / Device Role / Timing Role: Level shifter for serial control (SPI) and GPIO lines (reset, enable) with ESD-hardened VCC I/Os facing noisy RF sections.

Use Value: Prevents ESD-induced resets or latch-up in sensitive GPS timing circuits, improving cold-start reliability in automotive-grade modules.

Equivalent & Alternatives

The following parts are listed as comparable options for similar level translation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TXB0108PWRAuto-direction sensing, 3.3V-only VCCA, supports 1.2V–3.6V VCCB; no ±15kV ESD rating.Suitable for board-to-board translation within same PCB; not rated for external connector ESD stress.Select when cost and auto-bidirectionality outweigh ESD requirements and multi-voltage flexibility.
SN74AVC8T245RHLRDirection-controlled (DIR pin required), 1.2V–3.6V I/O range, 24mA drive strength; no integrated ESD protection.Requires external ESD protection and direction logic; better for high-drive, unidirectional buses.Select when driving heavy capacitive loads (>50pF) or requiring precise direction control in shared-bus arbitration.

Compared with TXB0108PWR and SN74AVC8T245RHLR, the MAX3000EEBP uniquely combines true bidirectionality without direction pin, ±15kV ESD hardening on VCC I/Os, and support for VL as low as 1.2V with VCC up to 5.5V-making it optimal for ruggedized portable interfaces where space, ESD resilience, and voltage flexibility are co-critical.

Availability

MAX3000EEBP is available at Aetrix Electronics and suitable for cellphone cradles, smart card readers, and portable POS systems requiring stable component supply across extended product lifecycles and industrial temperature ranges (-40°C to +85°C).

Supply support for MAX3000EEBP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, communications, and consumer applications.

The MAX3000E series was designed specifically for robust, low-power multivoltage system interfacing in portable and battery-operated equipment where ESD resilience, minimal footprint, and guaranteed low-speed timing are essential.

FAQ

What is the maximum guaranteed data rate for the MAX3000EEBP?

The MAX3000EEBP is guaranteed to operate at 230kbps across its full specified temperature range (-40°C to +85°C) and voltage range (VL = +1.2V to +5.5V, VCC = +1.65V to +5.5V) with 50pF load capacitance. This rate is validated per the MAX3000E datasheet timing characteristics table and applies specifically to the MAX3000EEBP variant-not the faster MAX3001E or MAX3002–MAX3012 family members.

Does the MAX3000EEBP require a direction control signal?

No, the MAX3000EEBP uses a passive-bidirectional architecture that automatically handles signal flow in either direction (VL ↔ VCC) on each of its eight channels without any direction pin or control logic. This eliminates firmware overhead and PCB routing for direction management, distinguishing it from direction-controlled translators like the SN74AVC8T245RHLR.

What package type is used for the MAX3000EEBP?

The MAX3000EEBP is supplied in a 4mm × 5mm, 20-bump UCSP™ (Ultra-Compact Silicon Package) with exposed thermal pad. This package is explicitly listed in the Maxim ordering information as "B20-1" and is distinct from the TSSOP-20 (U20-3) and TQFN-20 variants offered for other members of the MAX3000E family.

Can the MAX3000EEBP tolerate VL greater than VCC during power-up?

Yes, the MAX3000EEBP is designed to withstand VL ≥ VCC during power sequencing without latch-up or damage, as confirmed in the Absolute Maximum Ratings and Detailed Description sections of the datasheet. However, for normal operation, VL must be ≤ VCC to ensure correct logic threshold referencing and translation behavior.

What is the purpose of the EN pin on the MAX3000EEBP?

The EN pin on the MAX3000EEBP controls shutdown mode: when pulled low, it places all eight I/O VCCx pins in high-impedance (three-state) while activating internal 6kΩ pulldown resistors on all I/O VLx pins. This reduces both VCC and VL supply currents to <2µA, making it ideal for low-power sleep states in portable devices using the MAX3000EEBP.

MAX3000EEBP Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc./Maxim Integrated
Series:
-
Package/Case:
Packaging:
Bulk
Product Status:
Active
Translator Type:
Voltage Level
Channel Type:
Bidirectional
Number of Circuits:
1
Channels per Circuit:
8
Voltage - VCCA:
1.2 V ~ 5.5 V
Voltage - VCCB:
1.65 V ~ 5.5 V
Input Signal:
-
Output Signal:
-
Output Type:
Tri-State, Non-Inverted
Data Rate:
230kbps
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-WFBGA, CSPBGA

MAX3000EEBP FAQ

1.How can I place an order for MAX3000EEBP through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX3000EEBP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX3000EEBP reliable?

The price and inventory of MAX3000EEBP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3000EEBP is usually 5 days.

3.What payment methods are accepted for MAX3000EEBP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3000EEBP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX3000EEBP?

MAX3000EEBP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX3000EEBP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX3000EEBP?

For technical support, including MAX3000EEBP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3000EEBP requirements.

6.How does Aetrix verify that MAX3000EEBP is sourced from the original manufacturer or authorized distributors?

All MAX3000EEBP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3000EEBP meets industry standards.

7.What is the process for return or replacement of MAX3000EEBP?

All MAX3000EEBP units undergo pre-shipment inspection (PSI). If there is an issue with MAX3000EEBP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX3000EEBP part is unused and in its original packaging.

Return procedure for MAX3000EEBP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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