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Analog Devices Inc./Maxim Integrated MAX3001EEBP+
- Part No.:
- MAX3001EEBP+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3001EEBP+.pdf
- Description:
- PLUS 1.2V TO PLUS 5.5V, PLUS MIN
- Quantity:
- Payment:
- Shipping:
Inventory:7,786
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Product details
Overview
MAX3001EEBP+ from Maxim Integrated is an 8-channel bidirectional logic-level translator IC enabling voltage translation between +1.2V and +5.5V domains without direction control pins. It guarantees 4Mbps data rate, supports ±15kV HBM ESD protection on I/O VCC lines, operates from -40°C to +85°C, and consumes only 0.1µA in shutdown - ideal for SPI/MICROWIRE interface bridging in portable communication devices.
For engineers reviewing the MAX3001EEBP+ datasheet, MAX3001EEBP+ pinout, MAX3001EEBP+ application, or MAX3001EEBP+ equivalent, key selection criteria include guaranteed 4Mbps throughput at low VL (1.2V), ultra-low shutdown current (<2µA), bidirectional operation without direction pin, ±15kV ESD robustness on VCC-side I/Os, and compatibility with UCSP, TQFN, and TSSOP packages for space-constrained designs.
Technical Context
The MAX3001EEBP+ uses a dedicated bidirectional architecture that eliminates the need for external direction control signals, allowing seamless signal flow in either direction (VL ↔ VCC) across all eight channels. Its input thresholds are dynamically referenced to VL and VCC (VIHL = 2/3×VL, VIHC = 2/3×VCC), ensuring reliable switching across wide voltage combinations.
It features an active EN input that places I/O VCC lines in high-impedance three-state while applying 6kΩ pulldowns to I/O VL lines during shutdown, reducing both VCC and VL supply currents to <2µA. The device maintains functional integrity after ±15kV HBM ESD events on I/O VCC pins without latchup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Guaranteed 4Mbps - enables high-speed SPI and MICROWIRE level translation between low-voltage ASICs and 3.3V/5V systems. |
| VL Range | +1.2V to +5.5V - supports direct interfacing with modern sub-1.8V logic such as 1.2V FPGA I/O banks. |
| VCC Range | +1.65V to +5.5V - ensures compatibility with legacy 3.3V and 5V microcontrollers and peripherals. |
| ESD Protection | ±15kV HBM on I/O VCC lines - eliminates need for external TVS diodes in handheld and cradle applications. |
| Shutdown Current | <2µA from both VCC and VL supplies - extends battery life in always-on portable POS and GPS modules. |
| Operating Temp | -40°C to +85°C - qualified for industrial and automotive accessory environments without derating. |
| Propagation Delay | 50ns max (I/O VL → I/O VCC) - preserves timing margins in synchronous serial interfaces up to 4MHz clock rates. |
Pinout & Package
The MAX3001EEBP+ is packaged in a 20-bump UCSP (Ultra Compact Silicon Package) measuring 2.5mm × 2.5mm with 0.5mm pitch, optimized for ultra-portable designs. The exposed pad (EP) must be soldered to GND for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O VL1–I/O VL8 | Bidirectional I/O referenced to VL | Accept or drive signals at VL domain voltage; automatically adapt direction based on signal activity. |
| I/O VCC1–I/O VCC8 | Bidirectional I/O referenced to VCC | Translate and present corresponding logic levels at VCC domain; no external direction control required. |
| VL | Low-voltage supply rail | Defines logic thresholds for VL-side I/Os; must be bypassed with 0.1µF capacitor to GND. |
| VCC | High-voltage supply rail | Sets logic thresholds for VCC-side I/Os; requires 0.1µF decoupling to GND for noise immunity. |
| EN | Enable control input | Pull low to disable VCC-side outputs (three-state) and activate 6kΩ pulldowns on VL-side I/Os. |
| GND | Ground reference | Common return path for both supply domains; connects to exposed pad for thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation | Eliminates direction-control logic and PCB routing complexity in full-duplex interfaces like SPI. |
| ±15kV ESD protection | Enables direct connection to external connectors in cellphone cradles and smart card readers without added protection circuitry. |
| 1.2V VL minimum | Supports next-generation ultra-low-power processors and memory I/Os operating below 1.8V. |
| 0.1µA shutdown current | Reduces system standby power by >99% compared to standard translators, critical for battery-backed GPS units. |
| UCSP package | 2.5mm × 2.5mm footprint saves >60% board area versus TSSOP, enabling miniaturized wearable designs. |
Applications
| Cellphone Cradles | SPI Level Translation |
|---|---|
Use Scenario: Bidirectional data exchange between a 1.2V smartphone baseband processor and a 3.3V USB-to-serial bridge IC in docking stations. IC Role / Device Role / Timing Role: Translates logic levels across voltage domains while preserving full-duplex timing integrity for UART handshaking and firmware updates. Use Value: Enables direct integration without level-shifting resistors or direction-control GPIOs, reducing BOM count and layout area by 30%. | Use Scenario: Interfacing a 1.8V FPGA master to multiple 3.3V SPI peripherals (ADCs, sensors) in portable medical monitors. IC Role / Device Role / Timing Role: Provides simultaneous 8-channel bidirectional translation with 50ns max propagation delay to meet 4MHz SPI SCLK timing budgets. Use Value: Guarantees 4Mbps operation with no setup/hold violations, eliminating need for clock throttling or custom timing constraints. |
| Smart Card Readers | Portable POS Systems |
Use Scenario: Connecting a 1.2V secure element to a 5V contactless reader controller in EMV-compliant payment terminals. IC Role / Device Role / Timing Role: Handles ISO/IEC 7816-3 protocol signaling with ±15kV ESD tolerance on VCC-side I/Os exposed to card insertion events. Use Value: Prevents field failures due to electrostatic discharge during card hot-plug operations, improving MTBF by >5× over unprotected translators. | Use Scenario: Bridging a 1.8V ARM Cortex-M4 MCU to 3.3V display driver and 5V thermal printer interface in handheld retail terminals. IC Role / Device Role / Timing Role: Manages concurrent voltage translation across multiple buses (SPI, GPIO, UART) using single compact UCSP device. Use Value: Reduces component count from three discrete translators to one, cutting assembly cost and test time by 40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108PWR | 8-channel auto-directional translator with 1.2V–3.6V VL and 1.65V–5.5V VCC; 100Mbps max but requires ≥1.65V VL; no ±15kV ESD rating. | Best suited for high-speed digital isolator interfaces where ESD robustness is secondary to speed. | Select TXB0108PWR only when >10Mbps throughput is required and external ESD protection can be added. |
| SN74AVC8T245RHLR | 8-bit unidirectional translator with direction pin; 1.2V–3.6V and 1.65V–3.6V dual-supply; no ESD rating; 3.3V-only VCC support. | Appropriate for fixed-direction parallel buses (e.g., memory expansion) where direction control is available. | Choose SN74AVC8T245RHLR when bidirectionality is unnecessary and PCB space allows for direction-control trace routing. |
Compared with TXB0108PWR and SN74AVC8T245RHLR, the MAX3001EEBP+ uniquely delivers guaranteed 4Mbps bidirectional operation down to 1.2V VL *with integrated ±15kV ESD protection*, making it the only option requiring zero external protection components in handheld consumer interfaces.
Availability
MAX3001EEBP+ is available at Aetrix Electronics and suitable for cellphone cradles, portable POS systems, smart card readers, and GPS modules requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for MAX3001EEBP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in precision analog, mixed-signal, and high-reliability ICs for industrial, communications, and consumer applications.
The MAX3000E/MAX3001E family was designed specifically for multivoltage system interoperability in space- and power-constrained portable electronics, emphasizing ESD resilience, ultra-low quiescent current, and pin-efficient bidirectional translation.
FAQ
What is the guaranteed maximum data rate for the MAX3001EEBP+?
The MAX3001EEBP+ guarantees a 4Mbps data rate across its full operating voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V) and temperature range (-40°C to +85°C). This specification is validated under standard test conditions (RS = 50Ω, CVCC = 50pF, CVL = 50pF) and ensures reliable SPI and MICROWIRE interface operation without timing margin violations. The MAX3001EEBP+ achieves this while maintaining bidirectional functionality and ±15kV ESD protection.
Does the MAX3001EEBP+ require a direction-control signal?
No, the MAX3001EEBP+ does not require a direction-control signal. It uses a proprietary bidirectional architecture that automatically detects signal transitions on either side (VL or VCC) and adapts translation direction accordingly. This eliminates the need for external GPIOs, simplifies PCB routing, and prevents bus contention in full-duplex protocols like SPI. The MAX3001EEBP+ is functionally distinct from unidirectional translators such as the SN74AVC8T245RHLR, which mandate explicit direction pin management.
What package type is used for the MAX3001EEBP+?
The MAX3001EEBP+ is supplied in a 20-bump UCSP (Ultra Compact Silicon Package) measuring 2.5mm × 2.5mm with 0.5mm pitch. This wafer-level chip-scale package includes an exposed pad (EP) that must be soldered to GND for optimal thermal performance and electrical stability. The UCSP variant provides the smallest footprint among the MAX3001E family options, making it ideal for ultra-thin mobile devices where board area is at a premium.
How does the EN pin function on the MAX3001EEBP+?
On the MAX3001EEBP+, the EN pin controls shutdown mode: pulling EN low places all eight I/O VCC lines in high-impedance three-state while activating internal 6kΩ pulldown resistors on all eight I/O VL lines. This reduces both VCC and VL supply currents to <2µA, enabling ultra-low-power standby. Driving EN high (to VL) restores full bidirectional translation. Unlike the MAX3003 variant, the MAX3001EEBP+ uses a single EN pin - not EN A/B - and does not support channel-selective enable functionality.
Is ±15kV ESD protection available on both sides of the MAX3001EEBP+?
±15kV HBM ESD protection is specified *only on the I/O VCC lines* of the MAX3001EEBP+, per Maxim's datasheet Absolute Maximum Ratings and Detailed Description sections. The I/O VL lines do not carry this rating. This design reflects typical use cases where VCC-side I/Os connect to external connectors (e.g., USB ports, card slots) more prone to human-handling ESD, while VL-side signals remain internal to the PCB. External protection for VL-side traces is not required by the MAX3001EEBP+ specification.
MAX3001EEBP+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 4Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WFBGA, CSPBGA
MAX3001EEBP+ FAQ
1.How can I place an order for MAX3001EEBP+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3001EEBP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3001EEBP+ reliable?
The price and inventory of MAX3001EEBP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3001EEBP+ is usually 5 days.
3.What payment methods are accepted for MAX3001EEBP+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3001EEBP+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3001EEBP+?
MAX3001EEBP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3001EEBP+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3001EEBP+?
For technical support, including MAX3001EEBP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3001EEBP+ requirements.
6.How does Aetrix verify that MAX3001EEBP+ is sourced from the original manufacturer or authorized distributors?
All MAX3001EEBP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3001EEBP+ meets industry standards.
7.What is the process for return or replacement of MAX3001EEBP+?
All MAX3001EEBP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3001EEBP+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3001EEBP+ part is unused and in its original packaging.
Return procedure for MAX3001EEBP+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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