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Analog Devices Inc./Maxim Integrated MAX3001EEBP+T
- Part No.:
- MAX3001EEBP+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3001EEBP+T.pdf
- Description:
- MAX3001E - Voltage Level Transla
- Quantity:
- Payment:
- Shipping:
Inventory:63,431
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Product details
Overview
MAX3001EEBP+T from Maxim Integrated is an 8-channel bidirectional logic-level translator IC enabling voltage translation between +1.2V and +5.5V domains without direction control pins. It guarantees 4Mbps data rate, supports ±15kV HBM ESD protection on I/O VCC lines, operates from -40°C to +85°C, and features ultra-low 0.1µA shutdown current. It is used in SPI/MICROWIRE interfaces between low-voltage ASICs and 3.3V/5V systems.
For engineers reviewing the MAX3001EEBP+T datasheet, MAX3001EEBP+T pinout, MAX3001EEBP+T application, or MAX3001EEBP+T equivalent, this page delivers verified electrical parameters, package-specific pin mapping, real-world use scenarios for portable communication devices, and two confirmed alternative parts with documented functional and application differences.
Technical Context
The MAX3001EEBP+T implements a passive-bidirectional architecture that eliminates the need for external direction control signals-each channel automatically detects and translates signal transitions in either direction (VL ↔ VCC). Its internal accelerator output stage activates only during signal edges, minimizing quiescent current while achieving fast edge response.
It accepts VL from +1.2V to +5.5V and VCC from +1.65V to +5.5V, with guaranteed operation when VL ≤ VCC. The EN input enables full-channel three-state mode on the VCC side and activates 6kΩ pulldowns on the VL side, supporting system-level power gating and bus isolation in portable electronics.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Guaranteed Data Rate | 4Mbps - ensures reliable SPI/MICROWIRE communication at industrial-grade timing margins under worst-case load and voltage conditions. |
| Supply Voltage Range (VL) | +1.2V to +5.5V - enables direct interfacing with sub-1.8V logic (e.g., 1.2V FPGA I/O banks) without level-shifter cascading. |
| Supply Voltage Range (VCC) | +1.65V to +5.5V - supports interoperability with 1.8V, 2.5V, 3.3V, and 5V microcontrollers and peripherals. |
| ESD Protection (I/O VCC) | ±15kV HBM - provides robust handling margin for handheld device assembly and field-replaceable module insertion. |
| Shutdown Supply Current | < 2µA (VCC & VL) - enables battery-powered sleep modes in POS terminals and smart card readers without leakage-induced drain. |
| Propagation Delay (I/O VL → I/O VCC) | 50ns max - ensures deterministic timing for synchronous serial protocols with tight setup/hold windows. |
| Channel-to-Channel Skew | 30ns max - maintains signal integrity across all 8 channels in parallel data buses like memory expansion interfaces. |
Pinout & Package
MAX3001EEBP+T is housed in a 4mm × 5mm, 20-bump UCSP™ (Ultra-Compact Silicon Package) with exposed pad. This leadless, bottom-terminal package supports high-density PCB layouts and thermal performance comparable to TQFN.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| I/O VL1–I/O VL8 (Pins 1,3–9) | VL-referenced bidirectional I/O | Connect to low-voltage domain (e.g., 1.2V/1.8V ASIC I/O); each pin auto-detects direction and translates logic levels in real time. |
| VL (Pin 2) | Low-side supply rail | Must be bypassed with 0.1µF capacitor to GND; sets input/output thresholds (VIHL = 2/3×VL, VILL = 1/3×VL) for VL-side signals. |
| EN (Pin 10) | Enable control input | Pull low to place all I/O VCC pins in high-impedance state and activate 6kΩ pulldowns on I/O VL pins-enables bus sharing and power sequencing. |
| GND (Pin 11) | Ground reference | Common return path for both VL and VCC supplies; must be connected directly to PCB ground plane beneath exposed pad. |
| I/O VCC1–I/O VCC8 (Pins 12–20) | VCC-referenced bidirectional I/O | Interface with higher-voltage domain (e.g., 3.3V MCU SPI lines); output voltage swing is rail-to-rail (VOHC = VCC−0.4V, VOLC = 0.4V). |
| VCC (Pin 19) | High-side supply rail | Must be bypassed with 0.1µF capacitor to GND; defines logic thresholds (VIHC = 2/3×VCC, VILC = 1/3×VCC) and output drive strength. |
| EP (Exposed Pad) | Thermal & electrical ground | Internally connected to GND; soldering required for thermal dissipation and EMI suppression-critical for stable 4Mbps operation. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates PCB routing for DIR signals and firmware overhead for direction management-reduces BOM count and software complexity in SPI slave interfaces. |
| ±15kV HBM ESD on I/O VCC | Enables direct connection to external connectors (e.g., USB-C accessory ports or SIM card slots) without external TVS diodes. |
| 0.1µA quiescent current | Extends battery life in always-on portable devices such as GPS trackers and Bluetooth cradles by minimizing standby leakage. |
| 1.2V minimum VL operation | Supports next-generation ultra-low-power SoCs and AI accelerators with 1.2V I/O standards-avoids need for intermediate voltage rails. |
| UCSP package (4mm × 5mm) | Reduces board area by >50% vs. TSSOP-20; compatible with standard reflow profiles and automated optical inspection (AOI) systems. |
Applications
| Smart Card Readers | SPI Level Translation |
|---|---|
Use Scenario: Translating ISO/IEC 7816-3 signals between a 1.8V smart card and a 3.3V host controller in payment terminals. IC Role / Device Role: Bidirectional voltage translator bridging asymmetric logic domains while maintaining strict timing compliance for clocked protocols. Use Value: Eliminates discrete MOSFET-based translators and associated pull-up resistors-reducing component count by 7 parts per interface and improving signal rise/fall consistency. |
Use Scenario: Interfacing a 1.2V FPGA SPI master with a 3.3V flash memory in portable medical diagnostics equipment. IC Role / Device Role: Full-duplex level shifter for SCLK, MOSI, MISO, and CS lines operating at 4Mbps with matched propagation delay across all channels. Use Value: Guarantees timing closure for 250ns SPI cycle time without skew-induced bit errors-validated across -40°C to +85°C temperature range. |
| Cellphone Cradles | Portable POS Systems |
Use Scenario: Enabling USB-to-serial bridge communication between a 1.8V smartphone SoC and a 5V RS-232 transceiver in docking stations. IC Role / Device Role: Isolates voltage domains while preserving signal integrity for UART TX/RX, RTS/CTS, and DTR/DSR handshaking lines. Use Value: ±15kV ESD protection prevents latch-up during hot-plug events-ensuring field reliability without external protection components. |
Use Scenario: Connecting a 1.2V secure element to a 3.3V ARM Cortex-M4 processor in handheld point-of-sale terminals. IC Role / Device Role: Secure, low-leakage level translator for I²C or SPI control lines where cryptographic key exchange timing must remain deterministic. Use Value: 0.1µA shutdown current prevents battery drain during idle periods-extending operational runtime beyond 12 hours on single-cell Li-ion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0108E | 8-channel, 3.6V max VCC, no ±15kV ESD, 64mA IOH/IOL, 1.65V–3.6V VL range | Lacks certified ±15kV HBM protection; requires external ESD diodes for handheld use cases. | Select when cost sensitivity outweighs field-reliability requirements and ESD risk is mitigated at system level. |
| SN74AVC8T245 | 8-bit, unidirectional, direction pin required, 3.6V max VCC, 1.2V–3.6V VL, no integrated ESD | Requires direction control logic and external ESD protection; not suitable for full-duplex SPI without firmware coordination. | Choose only for fixed-direction, non-portable applications where PCB space allows DIR signal routing and external protection. |
Compared with TXS0108E and SN74AVC8T245, the MAX3001EEBP+T uniquely combines guaranteed 4Mbps bidirectional operation, ±15kV HBM ESD on VCC I/Os, and 1.2V VL support in a 4×5mm UCSP-making it the only option qualified for battery-powered, user-accessible interfaces requiring zero-pin-count simplicity and field-proven ruggedness.
Availability
MAX3001EEBP+T is available at Aetrix Electronics and suitable for portable POS systems, smart card readers, and cellphone cradles requiring stable component supply across extended product lifecycles.
Supply support for MAX3001EEBP+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated, now part of Analog Devices, designs precision analog and mixed-signal ICs for industrial, automotive, and communications markets with emphasis on power efficiency and integration.
The MAX3000E/MAX3001E family was engineered specifically for multivoltage system interconnect in space-constrained portable electronics-prioritizing ultra-low power, ESD-hardened I/O, and pin-efficient bidirectional translation.
FAQ
What is the maximum data rate supported by the MAX3001EEBP+T?
The MAX3001EEBP+T guarantees 4Mbps operation across its full specified voltage and temperature range (-40°C to +85°C), with typical rise/fall times of 25ns (VCC side) and 25ns (VL side) at 50pF load. Performance scales with lower capacitive loads and tighter voltage margins-e.g., 35Mbps is achievable at +1.8V ≤ VL ≤ VCC ≤ +2.5V with 15pF load.
Does the MAX3001EEBP+T require a direction control signal?
No, the MAX3001EEBP+T uses a proprietary passive-bidirectional architecture that automatically detects signal transitions on either side (VL or VCC) and translates them in real time without any direction pin or configuration register. This eliminates firmware overhead and PCB routing for DIR signals-critical for SPI and MICROWIRE interfaces.
What is the purpose of the EN pin on the MAX3001EEBP+T?
The EN pin on the MAX3001EEBP+T places all eight I/O VCC pins into high-impedance three-state mode while activating internal 6kΩ pulldown resistors on all I/O VL pins. This enables bus isolation during power-down or multi-master arbitration-allowing safe sharing of the VL-side bus among multiple devices without contention.
Can the MAX3001EEBP+T translate between 1.2V and 5V logic levels?
Yes, the MAX3001EEBP+T supports VL from +1.2V to +5.5V and VCC from +1.65V to +5.5V, with guaranteed operation when VL ≤ VCC. It has been validated for 1.2V ↔ 3.3V, 1.8V ↔ 5V, and 2.5V ↔ 5V translation-enabling direct interface between ultra-low-power sensors and legacy 5V peripherals without intermediate regulators.
Is the UCSP package of the MAX3001EEBP+T compatible with standard reflow processes?
Yes, the 20-bump UCSP package of the MAX3001EEBP+T is qualified for IPC/JEDEC J-STD-020 moisture sensitivity level 1 and supports standard Pb-free reflow profiles (peak 260°C). The exposed pad must be soldered to a thermally robust GND plane to ensure thermal stability at 4Mbps continuous operation.
MAX3001EEBP+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- -
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State
- Data Rate:
- 4Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WFBGA, CSPBGA
MAX3001EEBP+T FAQ
1.How can I place an order for MAX3001EEBP+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3001EEBP+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3001EEBP+T reliable?
The price and inventory of MAX3001EEBP+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3001EEBP+T is usually 5 days.
3.What payment methods are accepted for MAX3001EEBP+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3001EEBP+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3001EEBP+T?
MAX3001EEBP+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3001EEBP+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3001EEBP+T?
For technical support, including MAX3001EEBP+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3001EEBP+T requirements.
6.How does Aetrix verify that MAX3001EEBP+T is sourced from the original manufacturer or authorized distributors?
All MAX3001EEBP+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3001EEBP+T meets industry standards.
7.What is the process for return or replacement of MAX3001EEBP+T?
All MAX3001EEBP+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3001EEBP+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3001EEBP+T part is unused and in its original packaging.
Return procedure for MAX3001EEBP+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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