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Analog Devices Inc./Maxim Integrated MAX3001EETP+
- Part No.:
- MAX3001EETP+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3001EETP+.pdf
- Description:
- PLUS 1.2V TO PLUS 5.5V, PLUS MIN
- Quantity:
- Payment:
- Shipping:
Inventory:9,733
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Product details
Overview
MAX3001EETP+ from Maxim Integrated is an 8-channel bidirectional logic-level translator IC enabling voltage translation between +1.2V and +5.5V domains without direction control pins. It guarantees 4Mbps data rate, supports ±15kV HBM ESD protection on I/O VCC lines, draws only 0.1µA supply current in shutdown, and operates across –40°C to +85°C for portable communication and smart card reader interfaces.
For engineers reviewing the MAX3001EETP+ datasheet, MAX3001EETP+ pinout, MAX3001EETP+ application, or MAX3001EETP+ equivalent, this page delivers verified electrical specs, package mapping to 20-pin TQFN (5mm × 5mm), bidirectional timing behavior, EN-controlled three-state operation, and real-world use cases in SPI/MICROWIRE level shifting and low-voltage ASIC interfacing.
Technical Context
The MAX3001EETP+ uses a passive-bidirectional architecture with no direction pin-signal flow adapts automatically between VL and VCC sides based on driving source. Its internal accelerator output stage activates only during signal transitions, minimizing quiescent current while achieving sub-50ns propagation delay (I/O VL → I/O VCC) at 4Mbps with 50pF load.
Voltage thresholds are rail-proportional: VIHL = 2/3 × VL, VILL = 1/3 × VL, VIHC = 2/3 × VCC, and VILC = 1/3 × VCC. The EN input enables full-channel shutdown, reducing both VCC and VL supply currents to <2µA, with internal 6kΩ pulldowns on I/O VL pins during disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | Guaranteed 4Mbps-enables high-speed SPI and MICROWIRE interface bridging between 1.8V/3.3V domains. |
| Supply Voltage Range | VL: +1.2V to +5.5V; VCC: +1.65V to +5.5V-supports translation from ultra-low-voltage ASICs to legacy 5V systems. |
| ESD Protection | ±15kV HBM on I/O VCC pins-eliminates need for external TVS diodes in handheld and cradle applications. |
| Shutdown Current | <2µA total (VCC + VL)-critical for battery-powered devices requiring zero-leakage sleep modes. |
| Propagation Delay | 50ns max (I/O VL → I/O VCC, 50pF load)-ensures timing compliance in 4Mbps synchronous serial links. |
| Channel Count | 8 independent bidirectional channels-replaces multiple discrete translators in compact PCB layouts. |
| Operating Temperature | –40°C to +85°C-qualified for industrial and consumer portable equipment environments. |
Pinout & Package
MAX3001EETP+ is packaged in a 20-pin TQFN (5mm × 5mm, 0.5mm pitch) with exposed thermal pad (EP) connected to GND. Pin numbering follows standard TQFN layout; EP must be soldered for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–9, 12–20 | I/O VL1–I/O VL8, I/O VCC1–I/O VCC8 | Bidirectional data terminals: VL-side pins reference VL supply; VCC-side pins reference VCC supply-no direction pin required. |
| 10 | EN | Active-high enable: drives high (VL) for normal operation; pulls low to place all I/O VCC pins in three-state and activate 6kΩ pulldowns on I/O VL pins. |
| 11 | GND | System ground reference-must be low-impedance connection shared with bypass capacitors. |
| 19 | VCC | Primary power supply (1.65V–5.5V)-requires local 0.1µF ceramic bypass capacitor to GND. |
| 2 | VL | Logic-reference supply (1.2V–5.5V)-bypassed with 0.1µF ceramic capacitor; sets input/output thresholds proportionally. |
| EP | Exposed Pad | Thermal and electrical ground-must be soldered to PCB ground plane for thermal dissipation and noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation | No direction pin needed-automatic signal flow detection enables seamless VL ↔ VCC data exchange on each channel. |
| ±15kV ESD protection | On all I/O VCC pins-meets IEC 61000-4-2 Level 4 without external protection components in exposed interfaces. |
| Ultra-low shutdown current | <2µA total supply draw-extends battery life in portable POS and GPS receivers during idle periods. |
| Rail-proportional thresholds | VIHL/VILL = 2/3×VL & 1/3×VL; VIHC/VILC = 2/3×VCC & 1/3×VCC-ensures robust noise margin across full VL/VCC operating ranges. |
| Accelerator output stage | Transient activation only during signal edges-reduces average power vs. always-on drivers while maintaining 4Mbps timing. |
Applications
| Smart Card Readers | SPI Level Translation |
|---|---|
|
Use Scenario: Interfacing 1.8V smart card ICs with 3.3V host microcontrollers in secure payment terminals. IC Role / Device Role / Timing Role: Bidirectional level shifter translating command/response traffic on I/O, RST, and CLK lines. Use Value: Eliminates risk of overvoltage damage to low-voltage card ICs while maintaining 4Mbps throughput for fast APDU exchange. |
Use Scenario: Connecting 1.8V FPGA SPI master to 3.3V sensor array in portable medical devices. IC Role / Device Role / Timing Role: Translating MOSI, MISO, SCLK, and CS signals between mismatched voltage domains. Use Value: Enables full-duplex 4Mbps SPI operation without timing skew or added gate delay-preserves sampling accuracy. |
| Cellphone Cradles | Low-Voltage ASIC Interfaces |
|
Use Scenario: Docking station synchronizing 1.2V baseband processor with 5V USB PHY and charging circuitry. IC Role / Device Role / Timing Role: Level-shifting UART, I²C, and GPIO control lines between baseband and peripheral subsystems. Use Value: ±15kV ESD protection prevents field failures from cable hot-plug events; 0.1µA shutdown current minimizes standby drain. |
Use Scenario: Bridging 1.2V AI accelerator ASIC outputs to 3.3V system memory and display controllers. IC Role / Device Role / Timing Role: Translating parallel data bus and control signals with matched channel-to-channel skew ≤10ns. Use Value: 8-channel integration reduces board area vs. discrete solutions; rail-proportional thresholds ensure reliable logic recognition at 1.2V VL. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108RGER | 8-channel auto-directional translator; 1.2V–3.6V I/O range; no ±15kV ESD rating; 100Mbps max data rate. | Targeted at high-speed digital buses (e.g., SDIO, eMMC); lacks ESD hardening for exposed connectors. | Select TXB0108RGER only when >4Mbps speed is required and ESD exposure is controlled by system-level shielding. |
| SN74AVC8T245RHLR | 8-bit unidirectional translator; requires separate direction control; 1.2V–3.6V; no integrated ESD protection beyond standard HBM. | Suitable for fixed-direction data paths (e.g., memory address/data buses); adds PCB routing complexity for DIR signal. | Choose SN74AVC8T245RHLR when cost sensitivity outweighs design simplicity and ESD robustness requirements. |
Compared with TXB0108RGER and SN74AVC8T245RHLR, MAX3001EETP+ uniquely combines guaranteed 4Mbps bidirectional operation, ±15kV I/O VCC ESD protection, and sub-2µA shutdown current-making it optimal for space-constrained, externally cabled, battery-operated systems where reliability and low power are co-priorities.
Availability
MAX3001EETP+ is available at Aetrix Electronics and suitable for smart card readers, cellphone cradles, portable POS systems, and GPS receivers requiring stable component supply with guaranteed long-term availability.
Supply support for MAX3001EETP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog and mixed-signal ICs for power, sensing, connectivity, and security applications.
The MAX3000E/MAX3001E family targets multivoltage system interoperability-specifically enabling robust, low-power level translation in portable, battery-powered, and ESD-prone consumer and industrial interfaces.
FAQ
What is the maximum guaranteed data rate for MAX3001EETP+?
The MAX3001EETP+ guarantees 4Mbps operation across its full specified voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V) and temperature range (–40°C to +85°C). This is confirmed in the Timing Characteristics table under "Maximum Data Rate" for MAX3001E. Performance may improve at narrower voltage windows (e.g., 35Mbps at +1.8V ≤ VL ≤ VCC ≤ +2.5V), but 4Mbps is the minimum guaranteed rate under all conditions.
Does MAX3001EETP+ require a direction control signal?
No, MAX3001EETP+ does not require a direction control signal. It uses a passive-bidirectional architecture that automatically detects signal source and routes translation from VL ↔ VCC on each channel. This eliminates PCB routing for DIR lines and simplifies firmware-unlike unidirectional translators such as SN74AVC8T245RHLR which mandate external direction control.
What is the purpose of the EN pin on MAX3001EETP+?
The EN pin on MAX3001EETP+ enables hardware-controlled shutdown: pulling EN low places all eight I/O VCC pins in high-impedance three-state while activating 6kΩ pulldown resistors on all I/O VL pins. This reduces total supply current to <2µA-critical for battery conservation in portable devices. Drive EN high (to VL) for normal bidirectional operation.
Can MAX3001EETP+ translate between 1.2V and 5V logic levels?
Yes, MAX3001EETP+ supports VL as low as +1.2V and VCC as high as +5.5V, enabling direct 1.2V-to-5V translation. However, per the datasheet's Detailed Description, VL must be ≤ VCC for proper operation. So 1.2V VL with 5V VCC is valid; 5V VL with 1.2V VCC is not supported and violates the VL ≤ VCC constraint.
Is the exposed pad (EP) on MAX3001EETP+ electrically connected?
Yes, the exposed pad (EP) on MAX3001EETP+ is internally connected to GND. It must be soldered to a PCB ground plane for thermal dissipation and electrical stability. Leaving EP floating or unconnected degrades thermal performance and may cause erratic behavior due to increased junction temperature and ground bounce.
MAX3001EETP+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 4Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WQFN Exposed Pad
MAX3001EETP+ FAQ
1.How can I place an order for MAX3001EETP+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3001EETP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3001EETP+ reliable?
The price and inventory of MAX3001EETP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3001EETP+ is usually 5 days.
3.What payment methods are accepted for MAX3001EETP+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3001EETP+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3001EETP+?
MAX3001EETP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3001EETP+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3001EETP+?
For technical support, including MAX3001EETP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3001EETP+ requirements.
6.How does Aetrix verify that MAX3001EETP+ is sourced from the original manufacturer or authorized distributors?
All MAX3001EETP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3001EETP+ meets industry standards.
7.What is the process for return or replacement of MAX3001EETP+?
All MAX3001EETP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3001EETP+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3001EETP+ part is unused and in its original packaging.
Return procedure for MAX3001EETP+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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