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Analog Devices Inc./Maxim Integrated MAX3002ETP+
- Part No.:
- MAX3002ETP+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3002ETP+.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 20TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:679
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Product details
Overview
MAX3002ETP+ from Maxim Integrated is an 8-channel bidirectional logic-level translator IC enabling voltage translation between VL = +1.2V to +5.5V and VCC = +1.65V to +5.5V domains without direction control pins. It guarantees 20Mbps data rate across full voltage range, features ±15kV HBM ESD protection on I/O VCC lines, and supports shutdown current < 0.1µA. It is used in SPI/MICROWIRE interfaces between low-voltage ASICs and 3.3V/5V systems.
For engineers reviewing the MAX3002ETP+ datasheet, MAX3002ETP+ pinout, MAX3002ETP+ application, or MAX3002ETP+ equivalent, key selection criteria include guaranteed 20Mbps operation at 1.8V–3.3V, bidirectional architecture with no direction pin, EN-controlled three-state outputs, ultra-low shutdown current, and TQFN-20 (5mm × 5mm) package compatibility with high-density portable designs.
Technical Context
The MAX3002ETP+ employs a passive-bidirectional MOSFET-based translation architecture that automatically senses signal direction on each channel, eliminating need for external direction control. Its internal level-shifting circuitry operates with VL ≤ VCC and tolerates VL ≥ VCC during power-up without latch-up or damage.
It integrates an enable input (EN) referenced to VL that places all eight I/O VCC pins in high-impedance state while applying 6kΩ pulldowns to I/O VL pins. Timing performance is load-dependent: propagation delay is 15ns (typ) at CL = 15pF, and rise/fall times are 8.5ns (typ) under +2.5V ≤ VL ≤ VCC ≤ +3.3V conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 20Mbps guaranteed over full operating voltage range; enables high-speed SPI and MICROWIRE translation. |
| VL Supply Range | +1.2V to +5.5V; supports direct interface with 1.2V, 1.8V, and 2.5V logic families. |
| VCC Supply Range | +1.65V to +5.5V; compatible with 1.8V, 2.5V, 3.3V, and 5V system rails. |
| ESD Protection | ±15kV HBM on I/O VCC pins; eliminates need for external TVS diodes in handheld and exposed-interface applications. |
| Shutdown Current | < 0.1µA from both VL and VCC supplies when EN = 0; critical for battery-powered sleep modes. |
| Propagation Delay | 15ns (typ) driving I/O VL → I/O VCC at +2.5V ≤ VL ≤ VCC ≤ +3.3V; ensures timing closure in 20MHz clock domains. |
| Channel-to-Channel Skew | 5ns (max) under matched loading; maintains signal integrity across parallel bus translation (e.g., 8-bit data paths). |
Pinout & Package
MAX3002ETP+ is housed in a 20-pin TQFN package (5mm × 5mm, 0.5mm pitch) with exposed pad (EP) connected to GND for thermal and EMI performance. Pin numbering follows standard TQFN layout with GND at pin 11 and EP internally tied to pin 11.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O VL1–I/O VL8 | Bidirectional I/O referenced to VL | Accept 1.2V–5.5V logic inputs; drive same voltage domain; auto-sense direction per channel. |
| I/O VCC1–I/O VCC8 | Bidirectional I/O referenced to VCC | Translate signals to 1.65V–5.5V domain; tolerate VCC ≥ VL; no level-shifter biasing required. |
| VL | Low-side supply rail | Must be bypassed with 0.1µF capacitor to GND; sets logic thresholds for VL-side I/Os. |
| VCC | High-side supply rail | Must be bypassed with 0.1µF capacitor to GND; defines output swing and input thresholds for VCC-side I/Os. |
| EN | Enable control input | Pull low to place I/O VCCx in three-state and activate 6kΩ pulldowns on I/O VLx; referenced to VL. |
| GND | Common reference | Return path for both supply domains; EP must be soldered to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation | No direction pin needed - automatic signal flow detection per channel reduces PCB routing complexity and firmware overhead. |
| Wide VL range down to +1.2V | Direct interface with advanced sub-1.8V ASICs and PLDs without intermediate buffers or regulators. |
| ±15kV HBM ESD on I/O VCC | Robustness against handling and system-level ESD events eliminates external protection components in consumer handhelds. |
| 0.1µA shutdown current | Enables multi-week battery life in always-on sensor nodes using periodic wake-up via EN control. |
| 20-pin TQFN (5mm × 5mm) | Compact footprint with thermal EP supports high-density layouts in space-constrained portable electronics. |
Applications
| Smart Card Readers | SPI Level Translation |
|---|---|
Use Scenario: Translating contact interface signals between 1.8V smart card ICs and 3.3V host microcontrollers in POS terminals. IC Role / Device Role / Timing Role: Bidirectional level shifter handling ISO/IEC 7816-3 clock, I/O, and RST lines with precise timing alignment. Use Value: Eliminates need for discrete MOSFET translators and saves >30% board area while maintaining 20Mbps burst transfer capability. | Use Scenario: Interfacing 1.8V FPGA SPI master with 3.3V ADC or DAC peripherals in portable instrumentation. IC Role / Device Role / Timing Role: Simultaneous translation of SCLK, MOSI, MISO, and CS across eight channels with <5ns skew. Use Value: Enables full-duplex 20MHz SPI operation without direction-control logic or timing margin penalties. |
| Cellphone Cradles | Low-Voltage ASIC Communication |
Use Scenario: Bridging USB-UART bridge IC (3.3V) to baseband processor I/O (1.2V/1.8V) in docking station logic. IC Role / Device Role / Timing Role: Translating UART TX/RX, GPIO, and interrupt lines bidirectionally with sub-20ns propagation delay. Use Value: Supports hot-plug detection and fast link negotiation without level-shifter-induced latency or handshaking overhead. | Use Scenario: Connecting 1.2V AI accelerator ASIC to 2.5V system memory controller in edge inference modules. IC Role / Device Role / Timing Role: Translating parallel address/data/control bus signals with guaranteed 1.2V–2.5V interoperability. Use Value: Avoids voltage-domain mismatch errors and enables direct integration without custom power sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108RGER | Auto-direction sensing with 3.6V max VCC; 100Mbps rated but requires external pull-ups; no ±15kV ESD rating. | Targeted at 1.2V–3.3V systems only; lacks robustness for exposed I/O in consumer devices. | Select when higher speed (>20Mbps) is required and ESD protection is handled externally. |
| SN74AVC8T245RHLR | Unidirectional with direction pin; 3.6V max VCC; 24mA drive strength; no integrated ESD beyond standard HBM. | Requires MCU GPIO for DIR control; better suited for fixed-direction buses like parallel memory interfaces. | Select when deterministic unidirectional control and higher drive strength outweigh bidirectional convenience. |
Compared with TXB0108RGER and SN74AVC8T245RHLR, the MAX3002ETP+ uniquely combines true bidirectional operation without direction pins, ±15kV I/O VCC ESD protection, and guaranteed 20Mbps performance from 1.2V VL - making it optimal for compact, robust, and firmware-light portable designs.
Availability
MAX3002ETP+ is available at Aetrix Electronics and suitable for smart card readers, SPI/MICROWIRE interfaces, cellphone cradles, and low-voltage ASIC communication requiring stable component supply, long-term lifecycle support, and consistent parametric performance across temperature and voltage ranges.
Supply support for MAX3002ETP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, medical, and portable applications.
The MAX3000E/MAX3001E/MAX3002–MAX3012 family was engineered specifically for multivoltage system interconnect - delivering robust, pin-efficient, and ESD-hardened level translation where space, power, and reliability are critical.
FAQ
What is the maximum guaranteed data rate for MAX3002ETP+ across its full operating voltage range?
The MAX3002ETP+ guarantees 20Mbps operation across its entire specified VL (+1.2V to +5.5V) and VCC (+1.65V to +5.5V) range. At optimized conditions (+2.5V ≤ VL ≤ VCC ≤ +3.3V), it achieves up to 35Mbps. This performance is validated with 15pF load capacitance and confirmed in the official Maxim datasheet revision 5, page 5.
Does MAX3002ETP+ require a direction control pin for bidirectional operation?
No, the MAX3002ETP+ uses a passive-bidirectional MOSFET architecture that automatically detects signal direction on each of its eight channels - eliminating the need for any external direction control pin. This simplifies PCB layout and removes firmware overhead associated with direction management, unlike unidirectional translators such as SN74AVC8T245RHLR.
What is the ESD protection rating on the I/O VCC pins of MAX3002ETP+?
The MAX3002ETP+ provides ±15kV Human Body Model (HBM) ESD protection on all I/O VCC pins, as confirmed in the Absolute Maximum Ratings and Detailed Description sections of the datasheet (pages 3 and 14). This exceeds JEDEC standards and allows direct use in handheld and exposed-interface applications without external TVS diodes.
Can MAX3002ETP+ operate with VL greater than VCC during power-up?
Yes - the MAX3002ETP+ tolerates VL ≥ VCC during power-up sequencing without latch-up or damage, as explicitly stated in the Detailed Description (page 14). However, for normal operation, VL must be ≤ VCC. This robustness simplifies power sequencing in systems with independent rail ramp rates.
What package type and thermal characteristics does MAX3002ETP+ use?
The MAX3002ETP+ is supplied in a 20-pin TQFN package (5mm × 5mm, 0.5mm pitch) with an exposed pad (EP) that must be soldered to the PCB ground plane. Its thermal resistance θJA is 20.0°C/W, enabling 1667mW continuous power dissipation at +70°C ambient - verified in the Absolute Maximum Ratings table (page 2).
MAX3002ETP+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tube
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 35Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing, Power-Supply Decoupling
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WQFN Exposed Pad
MAX3002ETP+ FAQ
1.How can I place an order for MAX3002ETP+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3002ETP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3002ETP+ reliable?
The price and inventory of MAX3002ETP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3002ETP+ is usually 5 days.
3.What payment methods are accepted for MAX3002ETP+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3002ETP+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3002ETP+?
MAX3002ETP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3002ETP+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3002ETP+?
For technical support, including MAX3002ETP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3002ETP+ requirements.
6.How does Aetrix verify that MAX3002ETP+ is sourced from the original manufacturer or authorized distributors?
All MAX3002ETP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3002ETP+ meets industry standards.
7.What is the process for return or replacement of MAX3002ETP+?
All MAX3002ETP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3002ETP+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3002ETP+ part is unused and in its original packaging.
Return procedure for MAX3002ETP+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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