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Analog Devices Inc./Maxim Integrated MAX3003EBP
- Part No.:
- MAX3003EBP
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3003EBP.pdf
- Description:
- 8-CH LEVEL TRANSLATOR
- Quantity:
- Payment:
- Shipping:
Inventory:1,836
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Product details
Overview
The MAX3003EBP from Maxim Integrated is an 8-channel bidirectional logic-level translator IC enabling voltage translation between VL = +1.2V to +5.5V and VCC = +1.65V to +5.5V domains without direction control pins. It supports guaranteed 20Mbps data rate, features ±15kV HBM ESD protection on I/O VCC lines, and delivers ultra-low 0.1µA shutdown supply current. It is used in SPI/MICROWIRE interfaces between low-voltage ASICs and 3.3V/5V systems.
For engineers reviewing the MAX3003EBP datasheet, MAX3003EBP pinout, MAX3003EBP application, or MAX3003EBP equivalent, this page provides verified electrical specifications, bidirectional timing behavior, EN A/B-controlled channel partitioning, package-specific terminal mapping for UCSP, and real-world use cases in portable communication and smart card readers.
Technical Context
The MAX3003EBP implements a dual-rail, auto-sensing bidirectional architecture that detects signal transitions on either VL- or VCC-referenced I/Os and activates both sides' output stages simultaneously via one-shot accelerator circuitry. This eliminates need for external direction control while maintaining sub-20ns propagation delay (I/OVL→I/OVCC or vice versa) at 20Mbps under 15pF load.
Its EN A/B input enables selective activation of two independent 4-channel banks: when EN A/B = 0, channels 1B–4B are active and 1A–4A are three-stated; when EN A/B = VL, channels 1A–4A are active and 1B–4B are three-stated - supporting bus multiplexing and dynamic signal routing in compact portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Data Rate | 20Mbps guaranteed over full voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V), enabling high-speed SPI and MICROWIRE translation. |
| Supply Voltage Range | VL: +1.2V to +5.5V; VCC: +1.65V to +5.5V - supports direct interfacing between 1.2V/1.8V ASICs and 3.3V/5V peripherals. |
| ESD Protection | ±15kV HBM on I/O VCC pins - protects against electrostatic discharge in handheld and externally routed signal paths. |
| Shutdown Current | <2µA per supply (VCC/VL) when EN A/B = 0 - critical for battery-powered devices requiring zero-leakage sleep modes. |
| Propagation Delay | 15ns max (I/OVL↔I/OVCC, CL = 15pF) - ensures timing compliance in 20MHz clock domains with margin. |
| Channel-to-Channel Skew | 5ns max - maintains signal integrity across all 8 channels during parallel data transfer. |
| Input Thresholds | VIHL/VILL = 2/3×VL / 1/3×VL; VIHC/VILC = 2/3×VCC / 1/3×VCC - compatible with standard CMOS logic families across voltage domains. |
Pinout & Package
The MAX3003EBP is packaged in a 4mm × 5mm, 20-bump UCSP™ (Ultra Compact Silicon Package) with exposed pad. Pin numbering follows UCSP layout (B1 = Pin 1, D1 = Pin 20); the exposed pad (EP) must be connected to GND for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O VL1A–I/O VL4A | VL-referenced bidirectional I/O (Bank A) | Accept or drive signals at VL voltage; automatically translate to corresponding I/O VCCxA pins. |
| I/O VL1B–I/O VL4B | VL-referenced bidirectional I/O (Bank B) | Same as Bank A; isolated from Bank A except through shared VL rail. |
| I/O VCC1A–I/O VCC4A | VCC-referenced bidirectional I/O (Bank A) | Translate signals from I/O VLxA; output logic levels referenced to VCC. |
| I/O VCC1B–I/O VCC4B | VCC-referenced bidirectional I/O (Bank B) | Corresponds to Bank B VL-side pins; independently controlled by EN A/B. |
| EN A/B | Bank-select enable input | Logic 0 activates Bank B (1B–4B); logic VL activates Bank A (1A–4A) - enables time-multiplexed bus sharing. |
| VL | Low-voltage domain supply | +1.2V to +5.5V reference; bypass to GND with 0.1µF capacitor for noise immunity. |
| VCC | High-voltage domain supply | +1.65V to +5.5V reference; bypass to GND with 0.1µF capacitor. |
| GND | Common ground reference | Return path for both domains; connects to exposed pad (EP) for thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Enables seamless full-duplex data flow on each channel - eliminates PCB routing complexity and GPIO overhead. |
| Independent 4-channel bank control via EN A/B | Supports dynamic bus arbitration and multiplexing in space-constrained portable systems without external switches. |
| ±15kV HBM ESD protection on I/O VCC | Eliminates need for discrete TVS diodes on high-side signal lines - reduces BOM count and board area. |
| 0.1µA typical quiescent current | Extends battery life in always-on or intermittently active portable devices such as GPS receivers and smart card readers. |
| UCSP package (4mm × 5mm) | Reduces footprint by >60% vs. TSSOP-20 - ideal for ultra-thin mobile and wearable form factors. |
Applications
| Smart Card Readers | SPI Level Translation |
|---|---|
Use Scenario: Translating command/response traffic between a 1.8V smart card controller and a 3.3V host microcontroller. IC Role / Device Role / Timing Role: Bidirectional level shifter handling ISO/IEC 7816-3 T=0 protocol signals with strict setup/hold timing. Use Value: Eliminates external direction control logic and meets 20Mbps burst transfer requirements during APDU exchange. | Use Scenario: Interfacing a 1.2V FPGA SPI master with a 3.3V flash memory or sensor. IC Role / Device Role / Timing Role: Translating MOSI, MISO, SCLK, and CS signals across voltage domains while preserving edge alignment. Use Value: Maintains 15ns max channel skew to prevent SPI frame corruption at 20MHz clock rates. |
| Portable POS Terminals | Cellphone Cradles |
Use Scenario: Connecting a low-power 1.8V application processor to 5V peripheral interfaces (LCD, keypad, magstripe reader). IC Role / Device Role / Timing Role: Voltage translation hub managing multiple concurrent I/O streams with independent bank enable control. Use Value: EN A/B allows time-sliced access to shared 5V peripherals, reducing component count versus discrete solutions. | Use Scenario: Synchronizing data transfer between a 1.2V cellphone baseband and a 3.3V cradle USB bridge or charging controller. IC Role / Device Role / Timing Role: Bidirectional translator for UART, I²C, or debug interface lines with fast power-up sequencing tolerance. Use Value: Supports VL ≥ VCC during hot-plug events without latch-up or damage - critical for user-inserted accessories. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0108PWR | 8-channel, 1.2V–3.6V VL, 1.65V–5.5V VCC, 100Mbps max, no EN A/B - single enable for all channels. | Requires external direction control for full-duplex protocols; lacks bank-select capability for multiplexing. | Select when higher speed (100Mbps) is required and bank isolation is unnecessary. |
| SN74AVC8T245RHLR | 8-channel, unidirectional, 1.2V–3.6V to 1.65V–3.6V, direction pin required, 24mA drive strength. | Cannot support true bidirectional protocols like I²C without external logic; higher drive but fixed directionality. | Select when driving heavy capacitive loads (>30pF) and direction is statically defined. |
Compared with TXB0108PWR and SN74AVC8T245RHLR, the MAX3003EBP uniquely combines 20Mbps bidirectional operation, EN A/B bank selection, and ±15kV ESD protection in a 4mm × 5mm UCSP - making it optimal for compact, hot-pluggable, and ESD-prone portable interfaces where dynamic bus sharing is required.
Availability
The MAX3003EBP is available at Aetrix Electronics and suitable for portable POS systems, smart card readers, cellphone cradles, and GPS receivers requiring stable component supply with long-term lifecycle support.
Supply support for MAX3003EBP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, medical, automotive, and communications applications.
The MAX3000E/MAX3001E/MAX3002–MAX3012 family was engineered specifically for multivoltage system interoperability - delivering robust, low-power, high-speed level translation in space- and power-constrained portable electronics.
FAQ
What is the maximum data rate supported by the MAX3003EBP?
The MAX3003EBP guarantees 20Mbps operation across its full specified voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V) with 15pF load. At optimized conditions (+1.8V ≤ VL ≤ VCC ≤ +2.5V), it achieves up to 30Mbps, and at +2.5V ≤ VL ≤ VCC ≤ +3.3V, up to 35Mbps - confirmed in the Timing Characteristics table of the official datasheet.
Does the MAX3003EBP require a direction control pin?
No, the MAX3003EBP does not require a direction control pin. It uses an auto-sensing bidirectional architecture that detects transitions on either VL- or VCC-referenced I/Os and activates both sides simultaneously - enabling true bidirectional data flow on each of its eight channels without external direction logic.
How does the EN A/B pin function on the MAX3003EBP?
The EN A/B pin on the MAX3003EBP selects between two independent 4-channel banks: when EN A/B = 0, Bank B (I/O VL1B–I/O VL4B and I/O VCC1B–I/O VCC4B) is active and Bank A is three-stated; when EN A/B = VL, Bank A is active and Bank B is three-stated - enabling time-multiplexed bus sharing in compact portable designs.
What package type is used for the MAX3003EBP?
The MAX3003EBP is supplied in a 4mm × 5mm, 20-bump UCSP™ (Ultra Compact Silicon Package) with exposed thermal pad. This package offers superior space efficiency compared to TSSOP-20 or TQFN-20, making it ideal for ultra-thin mobile and wearable applications where board area is constrained.
Is the MAX3003EBP compatible with 1.2V logic systems?
Yes, the MAX3003EBP fully supports VL down to +1.2V while maintaining 20Mbps operation and guaranteed logic thresholds (VIHL = 2/3×VL, VILL = 1/3×VL). This enables direct interfacing with modern ultra-low-voltage ASICs and PLDs without level-shifting pre-stages or voltage translators.
MAX3003EBP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 8
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 20Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-WFBGA, CSPBGA
MAX3003EBP FAQ
1.How can I place an order for MAX3003EBP through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3003EBP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3003EBP reliable?
The price and inventory of MAX3003EBP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3003EBP is usually 5 days.
3.What payment methods are accepted for MAX3003EBP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3003EBP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3003EBP?
MAX3003EBP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3003EBP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3003EBP?
For technical support, including MAX3003EBP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3003EBP requirements.
6.How does Aetrix verify that MAX3003EBP is sourced from the original manufacturer or authorized distributors?
All MAX3003EBP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3003EBP meets industry standards.
7.What is the process for return or replacement of MAX3003EBP?
All MAX3003EBP units undergo pre-shipment inspection (PSI). If there is an issue with MAX3003EBP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3003EBP part is unused and in its original packaging.
Return procedure for MAX3003EBP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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