Analog Devices Inc./Maxim Integrated MAX3003EBP-T

Overview

MAX3003EBP-T from Maxim Integrated is an 8-channel bidirectional logic-level translator enabling voltage translation between VL = +1.2V to +5.5V and VCC = +1.65V to +5.5V domains without direction control pins. It supports guaranteed 20Mbps data rate, features EN A/B for channel-selective enable/disable, provides ±15kV HBM ESD protection on I/O VCC lines, and operates across –40°C to +85°C - used in SPI/MICROWIRE bus interfacing between low-voltage ASICs and 3.3V/5V systems.

For engineers reviewing the MAX3003EBP-T datasheet, MAX3003EBP-T pinout, MAX3003EBP-T application, or MAX3003EBP-T equivalent, key selection criteria include its dual-bank 4-channel enable architecture (EN A/B), 20Mbps timing performance under 15pF load, ultra-low 0.1µA shutdown current, bidirectional operation without direction pin, and UCSP-20 package compatibility with space-constrained portable communication devices.

Technical Context

The MAX3003EBP-T implements a true bidirectional level-shifting architecture where each of its eight channels operates independently in either direction (VL ↔ VCC) using internal pass-gate logic, eliminating need for external direction control. Its EN A/B input selects between two independent 4-channel banks (1A–4A vs. 1B–4B), enabling dynamic bus multiplexing or signal routing in shared-data-path systems.

It uses a one-shot accelerator output stage that activates only during signal transitions, minimizing quiescent current (<10µA) while delivering 15ns rise/fall times at 20Mbps with 15pF load. The device maintains rail-to-rail output swing (VOHL = VL – 0.4V, VOHC = VCC – 0.4V) and guarantees propagation delay ≤15ns (I/O VL → I/O VCC or vice versa) across its full operating voltage range.

Key Specifications

Pinout & Package

MAX3003EBP-T is packaged in a 4mm × 5mm, 20-bump UCSP™ (Ultra Compact Silicon Package) with exposed pad for thermal management. Pin mapping follows standard UCSP layout with VL, VCC, GND, EN A/B, and dual-bank I/O VL / I/O VCC terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX3002EUB+, MAX3003EBP-T adds hardware-selectable dual-bank operation for bus multiplexing; compared with TXB0108RKL, it offers deterministic EN-controlled channel activation instead of edge-triggered auto-direction, ensuring predictable timing in SPI and MICROWIRE.

Availability

MAX3003EBP-T is available at Aetrix Electronics and suitable for portable communication devices, smart-card readers, and cellphone cradles requiring stable component supply with guaranteed long-term availability and traceable sourcing.

Supply support for MAX3003EBP-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog and mixed-signal ICs for industrial, communications, and consumer applications.

The MAX3000E–MAX3012 family targets multivoltage system interoperability, specifically addressing bidirectional and unidirectional logic-level translation challenges in portable, battery-powered, and ESD-prone environments.

FAQ

What is the maximum data rate supported by the MAX3003EBP-T under typical conditions?

The MAX3003EBP-T guarantees 20Mbps operation across its full operating voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V) with 15pF capacitive load. At optimized conditions (e.g., VL = +1.8V, VCC = +3.3V, C_L = 15pF), it achieves up to 30Mbps. Performance depends on driver strength, trace capacitance, and supply voltage - refer to the Timing Characteristics table in the MAX3003EBP-T datasheet for load-dependent limits.

How does the EN A/B pin function in the MAX3003EBP-T?

The EN A/B pin on the MAX3003EBP-T controls bank selection: when driven high to VL, channels 1A–4A (I/O VL1A–I/O VL4A and I/O VCC1A–I/O VCC4A) are active and bidirectional, while 1B–4B are in three-state; when pulled low, channels 1B–4B activate and 1A–4A go to three-state. This enables hardware-multiplexed access to two independent low-voltage peripherals sharing one high-voltage bus - no software polling or timing delays required.

Does the MAX3003EBP-T provide ESD protection, and on which pins?

Yes, the MAX3003EBP-T provides ±15kV Human Body Model (HBM) ESD protection on all I/O VCC pins (I/O VCC1A–I/O VCC4A and I/O VCC1B–I/O VCC4B), as confirmed in the Absolute Maximum Ratings and Detailed Description sections of the MAX3003EBP-T datasheet. I/O VL pins have standard ESD structures but are not rated to ±15kV. This protection remains effective in normal operation, three-state mode, and shutdown.

What are the supply voltage requirements for VL and VCC on the MAX3003EBP-T?

The MAX3003EBP-T requires VL between +1.2V and +5.5V, and VCC between +1.65V and +5.5V, with VL ≤ VCC for reliable operation. During power-up, VL > VCC is nondestructive but must be avoided in steady-state. Both supplies must be bypassed with 0.1µF ceramic capacitors close to the respective pins. The MAX3003EBP-T draws <10µA quiescent current when enabled and only 0.1µA in shutdown mode.

Can the MAX3003EBP-T translate signals from VCC to VL as well as VL to VCC?

Yes, the MAX3003EBP-T is fully bidirectional on all eight channels - signals propagate from VL domain to VCC domain (e.g., I/O VL1A → I/O VCC1A) and from VCC domain to VL domain (e.g., I/O VCC1A → I/O VL1A) without direction control. This is achieved through its internal pass-gate architecture, distinct from unidirectional translators like MAX3004–MAX3012. Each bank (A or B) operates independently in both directions when enabled.