Analog Devices Inc./Maxim Integrated MAX3023EBC+T

Overview

MAX3023EBC+T from Maxim Integrated is a quad-channel bidirectional logic-level translator IC enabling 100Mbps data transfer between +1.2V to +3.6V voltage domains. It features independent VL and VCC supplies, active-high EN control, and operates across –40°C to +85°C. Used in SPI/MICROWIRE interfaces between low-voltage ASICs and higher-voltage systems.

For engineers reviewing the MAX3023EBC+T datasheet, MAX3023EBC+T pinout, MAX3023EBC+T application, or MAX3023EBC+T equivalent, key selection criteria include guaranteed 100Mbps operation at VL ≥ 1.8V, ultra-low 0.1µA disabled supply current, 4× bidirectional I/O channels, UCSP-12 package footprint, and compatibility with portable communication and GPS subsystems.

Technical Context

The MAX3023EBC+T implements a one-shot accelerator output architecture that activates only during signal transitions on either VL- or VCC-side I/Os, minimizing quiescent power while achieving sub-7ns propagation delay (I/OVL→VCC) and ≤4ns rise/fall times at 15pF load. Its dual-rail design supports asymmetric voltage translation: VL from +1.2V to (VCC − 0.4V), VCC from +1.65V to +3.6V.

Each of its four bidirectional channels operates independently with defined input thresholds (VIHL = 2/3×VL, VIHC = 2/3×VCC), tri-state output capability under EN control, and integrated 120Ω pullup / 75Ω pulldown on VL-side I/Os. The UCSP-12 package uses bump-based interconnects with GND, VCC, VL, EN, and eight I/O terminals arranged in 4×3 array.

Key Specifications

Pinout & Package

The MAX3023EBC+T is housed in a 4×3 UCSP (Ultra-Compact Silicon Package) with 12 solder bumps on the die underside. This wafer-level chip-scale package measures 1.8mm × 1.4mm × 0.6mm and requires reflow-compatible PCB layout per Maxim Application Note UCSP.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with MAX3023EUD+, the MAX3023EBC+T offers 70% smaller footprint and lower profile but lacks dual-enable flexibility; versus TXB0104RUTR, it guarantees tighter timing and supports stricter voltage headroom requirements critical in precision GPS timing paths.

Availability

MAX3023EBC+T is available at Aetrix Electronics and suitable for portable communication devices, GPS receivers, and handheld POS terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MAX3023EBC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog and mixed-signal ICs for industrial, communications, and consumer applications, with emphasis on power efficiency and integration.

The MAX3023EBC+T belongs to Maxim's high-speed logic-level translation product line, engineered specifically for multivoltage system interoperability in space-constrained portable electronics.

FAQ

What is the minimum VL voltage supported by the MAX3023EBC+T?

The MAX3023EBC+T supports VL down to +1.2V, provided VL ≤ (VCC − 0.4V). At VL = 1.2V, guaranteed data rate drops to 80Mbps; full 100Mbps operation requires VL ≥ 1.8V. This enables direct interfacing with advanced 1.2V ASICs while maintaining backward compatibility with 1.8V systems. The MAX3023EBC+T's input thresholds scale with VL (VIHL = 2/3×VL), ensuring robust noise margins across the entire range.

Does the MAX3023EBC+T require external pull-up resistors on its I/O lines?

No, the MAX3023EBC+T integrates 120Ω pull-up and 75Ω pull-down resistors on all VL-side I/Os (I/O VL1–VL4), and 2.5kΩ pull-up/pull-down on VCC-side I/Os. These internal terminations eliminate the need for external resistors in most CMOS interface scenarios, reducing BOM count and PCB area. External resistors may still be required only in non-standard loading conditions or when precise impedance matching beyond internal values is needed.

How does the enable functionality work on the MAX3023EBC+T?

The MAX3023EBC+T features a single active-high EN input. When EN is pulled low, all eight I/O terminals (four VL-side and four VCC-side) enter high-impedance tri-state mode, and supply currents drop to 0.03µA (VCC) and 0.1µA (VL). Driving EN high to VL activates bidirectional translation. Unlike the TSSOP variant (MAX3023EUD+), the UCSP version has no EN bar pin - its enable logic is strictly single-input, simplifying control in space-constrained layouts.

Can the MAX3023EBC+T translate signals between 1.2V and 3.3V rails?

Yes, the MAX3023EBC+T supports VL = +1.2V and VCC = +3.3V, satisfying the constraint VL ≤ (VCC − 0.4V) since 1.2V ≤ 2.9V. In this configuration, it delivers 80Mbps guaranteed data rate and maintains valid logic thresholds (VIHL = 0.8V, VIHC = 2.2V). This makes the MAX3023EBC+T suitable for interfacing ultra-low-power 1.2V sensor hubs with legacy 3.3V microcontrollers in wearables and IoT edge nodes.

What is the thermal performance of the MAX3023EBC+T in its UCSP-12 package?

The MAX3023EBC+T in UCSP-12 (B12-1 package code) has a thermal resistance θ_JA of 150°C/W when mounted on a standard 2-layer JEDEC test board. At maximum 100Mbps operation with 15pF loads, typical power dissipation remains below 5mW, resulting in negligible junction temperature rise (<1°C above ambient). The UCSP's copper pillar bumps provide low thermal impedance to the PCB, enabling reliable operation in sealed portable enclosures without heatsinking.