Analog Devices Inc./Maxim Integrated MAX313LETP+

Overview

MAX313LETP+ from Maxim Integrated is a quad, single-pole/single-throw (SPST), normally open (NO) analog switch IC designed for precision signal routing in high-fidelity and industrial systems. It delivers 10Ω max on-resistance, 1.5Ω max on-resistance matching between channels, ±4.5V to ±20V dual-supply or +4.5V to +36V single-supply operation, and rail-to-rail analog signal handling up to ±15V - enabling use in audio routing, test equipment, and avionics signal paths.

For engineers reviewing the MAX313LETP+ datasheet, MAX313LETP+ pinout, MAX313LETP+ application, or MAX313LETP+ equivalent, this page provides verified electrical specifications, thermal-rated package details (20-pin Thin QFN-EP), channel-level switching behavior, leakage performance at +85°C, and validated alternatives for SPST analog switch selection in wide-supply, low-distortion designs.

Technical Context

The MAX313LETP+ implements four independent CMOS SPST switches with normally open topology, each featuring matched on-resistance across temperature (≤3Ω ΔRON over –40°C to +85°C) and guaranteed flatness (≤4Ω RFLAT(ON) under dual supply). Its +3V logic-compatible inputs (VIH = 2.0V, VIL = 0.8V) interface directly with microcontrollers without level-shifting.

It supports rail-to-rail analog signal ranges (V– to V+), exhibits <2.5nA off-leakage at +85°C, and achieves >96dB crosstalk at 20kHz - critical for low-noise audio and data-acquisition multiplexing. The exposed-pad QFN package enables enhanced thermal dissipation for sustained 100mA channel current handling.

Key Specifications

Pinout & Package

MAX313LETP+ uses a 20-pin Thin QFN package with exposed pad (EP), rated for –40°C to +85°C operation. The EP must be soldered to V+ for optimal thermal performance and ESD robustness.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SPST analog switch applications.

Compared with MAX313LETP+, MAX313LESE+ offers identical switching performance but reduced thermal headroom and larger layout area, while ADG1414BRUZ trades supply range and thermal capability for tighter logic integration - making MAX313LETP+ the sole choice for high-voltage, high-reliability, thermally constrained applications.

Availability

MAX313LETP+ is available at Aetrix Electronics and suitable for audio signal routing, automated test equipment, and avionics signal conditioning requiring stable component supply across extended temperature and high-voltage operating conditions.

Supply support for MAX313LETP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, communications, and automotive markets.

The MAX313L family was engineered for precision analog switching in demanding environments - delivering low on-resistance, tight matching, and wide supply flexibility for test, measurement, and signal integrity-critical systems.

FAQ

What is the maximum continuous current per channel for MAX313LETP+?

The MAX313LETP+ supports ±100mA continuous current per COM/NO channel, verified under thermal limits of its 20-pin Thin QFN-EP package. This rating holds across the full –40°C to +85°C operating range when the exposed pad is properly soldered to V+. Peak pulsed current is ±300mA at 1ms/10% duty cycle, enabling transient-heavy signal routing in burst-mode test systems.

Does MAX313LETP+ require power-supply sequencing?

No, MAX313LETP+ eliminates power-supply sequencing constraints present in earlier MAX313 variants. Its architecture permits arbitrary V+/V–/GND power-up order without latch-up risk, unlike legacy parts that required strict V+ → VL → V– sequencing. This simplifies system power design and removes need for external protection diodes in the MAX313LETP+ signal path.

Can MAX313LETP+ operate from a single +12V supply?

Yes, MAX313LETP+ operates from a single +4.5V to +36V supply. When using +12V, V– must be connected to GND, and analog signals swing from 0V to +12V. On-resistance increases slightly (35Ω max vs. 10Ω max under ±15V), but RON matching (≤2.5Ω) and leakage (≤2.5nA at +85°C) remain fully specified - making it viable for industrial PLC I/O modules.

What is the function of the exposed pad (EP) on MAX313LETP+?

The exposed pad (EP) on MAX313LETP+ must be electrically and thermally connected to V+ - not GND or floating. Doing so improves thermal resistance by ~21°C/W, raises max power dissipation to 1702mW, and enhances ESD robustness. Leaving EP unconnected violates Absolute Maximum Ratings and risks premature failure under sustained load.

Is MAX313LETP+ pin-compatible with the older MAX313 series?

MAX313LETP+ is not pin-compatible with legacy MAX313 variants (e.g., MAX313CPE), which use 16-pin DIP/SO/TSSOP packages. The MAX313LETP+ uses a 20-pin Thin QFN layout with different pin assignments (e.g., NO pins relocated to Pins 1/5/11/15, EP at bottom center). Direct replacement requires PCB redesign - though electrical functionality and logic behavior remain identical.