Analog Devices Inc./Maxim Integrated MAX313LETP

Overview

MAX313LETP from Maxim Integrated is a quad, single-pole/single-throw (SPST), normally open (NO) analog switch IC designed for precision signal routing in high-reliability industrial and test systems. It delivers 10Ω max on-resistance, 1.5Ω max on-resistance matching between channels, ±4.5V to ±20V dual-supply or +4.5V to +36V single-supply operation, and rail-to-rail analog signal handling up to ±15V - enabling low-distortion audio switching and sample-and-hold circuitry.

For engineers reviewing the MAX313LETP datasheet, MAX313LETP pinout, MAX313LETP application, or MAX313LETP equivalent, key selection criteria include guaranteed R_ON flatness (≤4Ω), sub-2.5nA off-leakage at +85°C, +3V logic compatibility (VIH = 2.0V, VIL = 0.8V), crosstalk >96dB at 20kHz, and 20-pin Thin QFN-EP package with exposed pad tied to V+.

Technical Context

The MAX313LETP implements four independent SPST NO switches using CMOS process technology with 92 transistors. Each channel features symmetrical conduction, bidirectional signal flow, and internal ESD protection. Its logic inputs accept +3V-compatible thresholds across full supply ranges, eliminating need for level-shifting circuitry.

It supports power-supply sequencing-free operation - unlike legacy MAX313 - by removing the VL pin and simplifying biasing. The device maintains stable R_ON vs. temperature (±40°C to +85°C) and signal voltage (–15V to +15V), with guaranteed R_ON match ≤3Ω over temperature and signal range.

Key Specifications

Pinout & Package

MAX313LETP uses a 20-pin Thin QFN-EP package (5mm × 5mm, 0.5mm pitch) with exposed thermal pad connected to V+. The package supports high-density PCB layouts and enhanced thermal performance (1702.1mW max power dissipation at +70°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with MAX313LESE, MAX313LETP offers superior thermal performance and space savings; compared with ADG1414BRUZ, it provides native +3V logic compatibility and wider supply flexibility at the cost of slightly higher R_ON, making it optimal for mixed-voltage industrial and test systems.

Availability

MAX313LETP is available at Aetrix Electronics and suitable for test equipment, industrial data-acquisition systems, and avionics signal conditioning requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MAX313LETP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, communications, and computing markets.

The MAX312L/MAX313L/MAX314L family was designed specifically for precision analog switching in demanding environments - emphasizing low R_ON, tight matching, wide supply range, and robust logic interface without external support components.

FAQ

What is the maximum analog signal voltage range supported by the MAX313LETP?

The MAX313LETP supports analog signals from V− to V+ across its full specified supply range. With ±15V dual supplies, it handles ±15V signals rail-to-rail. In single-supply mode (+12V), it supports 0V to +12V. Absolute maximum ratings allow VCOM, VNO, or VNC to reach ±44V relative to GND, but operational range remains bounded by V− and V+.

Does the MAX313LETP require specific power-supply sequencing during startup?

No, the MAX313LETP does not require controlled power-supply sequencing. Unlike earlier MAX313 devices, it eliminates the VL pin and incorporates internal design changes that prevent latch-up regardless of V+, V−, or GND power-up order - simplifying system power architecture and reducing BOM count.

How does the exposed pad (EP) on the MAX313LETP package function electrically and thermally?

The exposed pad on the MAX313LETP must be soldered to a PCB copper area connected to V+. It serves both thermal and electrical functions: it lowers junction-to-board thermal resistance (enabling 1702.1mW dissipation at +70°C) and provides a low-inductance return path for internal substrate bias, improving noise immunity and switching stability.

Can the MAX313LETP be used in audio applications requiring low total harmonic distortion (THD)?

Yes, the MAX313LETP is validated for low-distortion audio use. Its 10Ω R_ON, ≤4Ω R_ON flatness, and <30pC charge injection yield THD <0.01% at 1kHz with 100kΩ load - confirmed in Maxim's Typical Operating Characteristics. Performance improves with higher source/load impedances, though off-isolation decreases above 5MHz.

What is the guaranteed on-resistance matching specification for the MAX313LETP across temperature?

The MAX313LETP guarantees ΔR_ON ≤3Ω between any two channels over the full –40°C to +85°C operating range, measured at IC_COM = 10mA and V_NO/V_NC = ±10V. At +25°C, typical matching is ≤1.5Ω - critical for maintaining amplitude consistency in multi-channel instrumentation and balanced signal paths.