Analog Devices Inc./Maxim Integrated MAX313LETP+T

Overview

MAX313LETP+T from Maxim Integrated is a quad, single-pole/single-throw (SPST), normally open (NO) analog switch IC designed for precision signal routing in industrial and test equipment. It delivers ≤10Ω on-resistance, ≤1.5Ω on-resistance matching between channels, and ±4.5V to ±20V dual-supply or +4.5V to +36V single-supply operation, enabling rail-to-rail analog signal handling in audio and data-acquisition systems.

For engineers reviewing the MAX313LETP+T datasheet, MAX313LETP+T pinout, MAX313LETP+T application, or MAX313LETP+T equivalent, key selection criteria include guaranteed R_ON flatness (≤4Ω), low 2.5nA off-leakage at +85°C, +3V logic compatibility (VIH = 2.0V, VIL = 0.8V), and 20-pin Thin QFN-EP package with exposed pad tied to V+.

Technical Context

The MAX313LETP+T implements four independent NO analog switches using CMOS process technology, supporting bidirectional signal conduction with symmetric on-resistance across full analog voltage range (V− to V+). Its logic interface accepts +3V-compatible inputs without level-shifting, even when powered from ±15V supplies.

It features guaranteed break-before-make timing (1ns to 10ns) only in the MAX314L variant - not applicable to MAX313LETP+T - and achieves >96dB crosstalk at 20kHz. The device operates over −40°C to +85°C and supports power-supply sequencing-free startup, eliminating latch-up risk during V+/V− ramp-up.

Key Specifications

Pinout & Package

MAX313LETP+T is housed in a 20-pin Thin QFN-EP package (5mm × 5mm, 0.5mm pitch) with exposed thermal pad connected to V+. The package supports high-density PCB layouts and efficient heat dissipation in compact test and avionics modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog switch applications.

Compared with MAX313LESE and ADG1414BRUZ, the MAX313LETP+T uniquely combines 20-pin QFN thermal efficiency, full ±20V dual-supply support, and guaranteed R_ON matching - making it the preferred choice for high-reliability, wide-voltage industrial and aerospace signal routing where board area and thermal headroom are constrained.

Availability

MAX313LETP+T is available at Aetrix Electronics and suitable for test equipment, avionics signal conditioning, and data-acquisition systems requiring stable component supply across extended temperature ranges and high-voltage analog operation.

Supply support for MAX313LETP+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a U.S.-based semiconductor company specializing in high-performance analog, mixed-signal, and power management ICs for industrial, communications, and computing markets.

The MAX312L/MAX313L/MAX314L family was engineered for precision analog switching in demanding environments - delivering low R_ON, tight matching, and robust supply flexibility for test, measurement, and signal integrity-critical applications.

FAQ

What is the maximum supply voltage rating for MAX313LETP+T?

The MAX313LETP+T supports a single-supply range of +4.5V to +36V and a dual-supply range of ±4.5V to ±20V. Absolute maximum ratings specify V+ up to +44V and V− down to −44V, but operation beyond ±20V is not characterized or guaranteed. For reliable long-term use, stay within the specified ±4.5V to ±20V dual-supply window. The MAX313LETP+T must never exceed these limits even transiently.

Does MAX313LETP+T support rail-to-rail analog signal operation?

Yes, the MAX313LETP+T supports rail-to-rail analog signal handling - its analog terminals (COM, NO) operate from V− to V+ without clipping or degradation. This is confirmed in the Electrical Characteristics table under "Analog Signal Range" (VCOM_, VNO_, VNC_ = V− to V+). The feature enables full utilization of ±15V op-amp stages and high-dynamic-range data converters when used with the MAX313LETP+T.

Is the exposed pad on MAX313LETP+T electrically connected, and how should it be handled?

Yes, the exposed pad (EP) on the MAX313LETP+T is internally connected to V+ and must be soldered to a V+ copper pour on the PCB for both thermal management and electrical integrity. Per Maxim's Pin Descriptions, EP is not isolated - leaving it floating or grounding it will compromise performance and reliability. Thermal design guidelines recommend ≥70% solder coverage and thermal vias to inner-layer V+ planes.

Can MAX313LETP+T replace older MAX313 devices in existing designs?

The MAX313LETP+T is pin-compatible with the legacy MAX313 series per datasheet Feature list, but differs in process and internal architecture - notably eliminating the VL pin and enabling power-supply sequencing freedom. While footprint and logic behavior match, verify R_ON, leakage, and timing against legacy requirements. The MAX313LETP+T is not a drop-in replacement for MAX313 variants in circuits relying on VL biasing or specific latch-up protection schemes.

What is the guaranteed on-resistance matching specification for MAX313LETP+T?

The MAX313LETP+T guarantees ΔRON ≤ 1.5Ω maximum between any two channels under dual-supply conditions (ICOM_ = 10mA, VNO_ or VNC_ = ±10V, TMIN to TMAX). This value is explicitly listed in the "On-Resistance Match Between Channels" row of the Electrical Characteristics table. At +25°C, typical matching is 0.3Ω, ensuring highly uniform gain and phase response across all four switches in the MAX313LETP+T.