Texas Instruments MAX3232ECDBR

Overview

MAX3232ECDBR from Texas Instruments is a 3-V to 5.5-V dual-channel RS-232 line driver and receiver IC with ±15-kV IEC 61000-4-2 ESD protection on bus pins, 250 kbit/s data rate capability, 300 μA typical supply current, and integrated dual charge-pump circuit enabling single-supply operation. It serves as the physical-layer interface between UART logic and RS-232 connectors in portable industrial terminals.

For engineers reviewing the MAX3232ECDBR datasheet, MAX3232ECDBR pinout, MAX3232ECDBR application, or MAX3232ECDBR equivalent, this page delivers verified electrical specifications, SSOP-16 package details, functional pin roles, real-world use cases, and validated alternative parts - all aligned to TI's SLLS664E production data sheet (June 2021 revision).

Technical Context

The MAX3232ECDBR implements a dual charge-pump architecture generating ±VCC-derived V+ and V− rails from a single 3-V to 5.5-V input, eliminating need for external ±12-V supplies. Its two drivers convert TTL/CMOS logic levels to true RS-232 voltage levels (±5.4 V), while its two receivers translate RS-232 inputs (±25 V) back to logic-compatible outputs with 1.5 V to 2.4 V input thresholds and 0.3 V hysteresis.

It operates across 0°C to 70°C ambient temperature, supports 3.3-V and 5-V logic compatibility (accepts 5-V DIN inputs at 3.3-V VCC), and features short-circuit protected outputs with ±60 mA driver output current capability. The device meets TIA/EIA-232-F and ITU V.28 standards and includes internal 3–7 kΩ receiver termination.

Key Specifications

Pinout & Package

MAX3232ECDBR uses a 16-pin SSOP (Shrink Small Outline Package) with 0.65-mm pitch, 6.20 mm × 5.30 mm body size, and exposed pad not present. This surface-mount package supports automated assembly and offers improved thermal performance over SOIC-D in space-constrained designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar RS-232 transceiver applications.

Compared with MAX3232ECDBR, SN65C3232E extends temperature range without altering pinout or drive strength, while MAX3232CDR retains identical functionality in a larger, more serviceable SOIC package - both offer drop-in replacement paths where thermal or mechanical constraints permit.

Availability

MAX3232ECDBR is available at Aetrix Electronics and suitable for industrial handheld terminals, medical point-of-care devices, and programmable logic controller (PLC) HMI panels requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.

Supply support for MAX3232ECDBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets since 1930.

The MAX3232E product line was designed specifically for cost-sensitive, space-constrained RS-232 interface applications requiring single-supply operation, high ESD immunity, and compatibility with modern 3.3-V logic systems.

FAQ

What is the operating temperature range of the MAX3232ECDBR?

The MAX3232ECDBR is specified for 0°C to +70°C ambient operating temperature. This commercial-grade rating aligns with its "C" suffix designation and is validated per TI's SLLS664E datasheet Section 6.4. It is not rated for extended industrial temperatures (–40°C to +85°C); for that range, consider the MAX3232ECDBRG4.A or SN65C3232E alternatives. Thermal derating is not required within this range under recommended operating conditions.

Does the MAX3232ECDBR require external capacitors, and what values are needed?

Yes, the MAX3232ECDBR requires four external 0.1-μF ceramic capacitors (C1+, C1−, C2+, C2−) when operated at 3.3 V ± 0.3 V, as specified in Table 9-1 of the TI datasheet. At 5 V ± 0.5 V, it requires a 0.047-μF C1 and three 0.33-μF capacitors. A 1-μF bypass capacitor between VCC and GND is mandatory for IEC 61000-4-2 ESD compliance in the DB package.

Is the MAX3232ECDBR pin-compatible with older MAX3232 variants?

Yes, the MAX3232ECDBR is pin-compatible with other MAX3232E variants in the same SSOP-16 (DB) package, including MAX3232ECDBRG4.A and MAX3232EIDBR. Pin functions, spacing, and thermal pad configuration (none) match exactly. However, it is not pin-compatible with SOIC (D) or TSSOP (PW) package variants due to differing footprint dimensions and pad layouts.

What RS-232 standards does the MAX3232ECDBR comply with?

The MAX3232ECDBR meets or exceeds TIA/EIA-232-F and ITU V.28 standards, as explicitly stated in TI's official documentation. It delivers ±5.4 V driver output swing, supports 250 kbit/s data rates, and provides receiver input thresholds and hysteresis compliant with these specifications. Compliance is verified across the full 0°C to +70°C operating range and 3-V to 5.5-V supply range.

Can the MAX3232ECDBR operate with a 3.3-V supply while interfacing with 5-V logic inputs?

Yes, the MAX3232ECDBR accepts 5-V logic-level inputs on DIN1 and DIN2 pins even when powered from a 3.3-V VCC supply. This is confirmed in Section 6.4 of the datasheet, which specifies VIH(DIN) = 2.0 V (min) at VCC = 3.3 V, with absolute maximum input voltage of 6 V. This feature eliminates the need for external level shifters in mixed-voltage UART interfaces.