Analog Devices Inc./Maxim Integrated MAX323C/D

Overview

MAX323C/D from Analog Devices is a precision dual normally open (NO) single-pole single-throw (SPST) analog switch IC designed for signal routing in low-power, single-supply systems. It operates from +2.7V to +16V, delivers ≤60Ω on-resistance at 5V, ≤2Ω channel-to-channel R_ON matching, and guarantees <5pC charge injection - enabling high-fidelity switching in battery-powered instrumentation and precision data acquisition.

For engineers reviewing the MAX323C/D datasheet, MAX323C/D pinout, MAX323C/D application, or MAX323C/D equivalent, key selection criteria include its dice form factor, guaranteed break-before-make absence (vs. MAX325), dual NO topology, low leakage (<100pA @ +25°C), and compatibility with +3V/+5V DAC/ADC interfaces requiring minimal signal distortion.

Technical Context

The MAX323C/D implements two independent CMOS transmission-gate SPST switches with TTL/CMOS-compatible logic inputs and rail-to-rail analog signal handling (0V to V+). Its architecture ensures bidirectional signal flow, no power-supply sequencing dependency beyond absolute max ratings, and intrinsic overvoltage protection via internal clamping diodes.

All channels exhibit matched on-resistance flatness (<6Ω over 0–V+ range at 5V), fast switching (t_ON ≤150ns, t_OFF ≤100ns), and ESD robustness (>2000V per Method 3015.7), making it suitable for reconfigurable analog front-ends where channel consistency and transient integrity are critical.

Key Specifications

Pinout & Package

Dice form factor: bare die, unpassivated, substrate tied to V+. Not packaged in plastic, SO, µMAX, or CERDIP - intended for hybrid assembly or custom module integration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual SPST analog switch applications.

Compared with MAX323CSA, the MAX323C/D offers direct die bonding for space-constrained modules but requires wire bonding or flip-chip expertise; versus ADG1419BRUZ, it trades lower R_ON and wider voltage range for minimal footprint and legacy design continuity in military/aerospace hybrids.

Availability

MAX323C/D is available at Aetrix Electronics and suitable for battery-operated instrumentation, military radio front-ends, and precision data acquisition systems requiring stable component supply across extended lifecycle programs.

Supply support for MAX323C/D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and defense markets.

The MAX323 series belongs to Analog Devices' precision analog switch product line, engineered for low-distortion, low-leakage signal routing in mission-critical measurement and control systems where reliability and parameter consistency are non-negotiable.

FAQ

What is the maximum analog signal voltage range supported by the MAX323C/D?

The MAX323C/D supports analog signals from 0V to V+, where V+ is the positive supply voltage. With V+ set to +5V, the full signal range is 0V to +5V; at +12V supply, it extends to 0V to +12V. This rail-to-rail capability allows direct interfacing with sensors, DACs, and ADCs without external level-shifting circuitry, and is explicitly guaranteed across the entire operating temperature range.

Does the MAX323C/D support break-before-make switching?

No, the MAX323C/D does not implement break-before-make functionality. That feature is exclusive to the MAX325 variant, which integrates one NO and one NC switch per package. The MAX323C/D contains two independent normally open switches with no timing interlock between them - each channel switches autonomously based on its respective INx input, and simultaneous conduction is possible if both inputs are asserted.

What is the thermal performance of the MAX323C/D in dice form?

As a bare die, the MAX323C/D relies entirely on the host substrate for thermal dissipation. Its maximum junction temperature is +125°C (for M-grade variants) or +85°C (for E-grade), but the C/D suffix denotes the commercial 0°C to +70°C grade. Thermal resistance (θ_JA) is undefined for dice; effective cooling depends on die attach material, heatspreader integration, and PCB copper mass - system-level thermal validation is required for continuous 5μW operation in enclosed environments.

Can the MAX323C/D be used with a 3.3V logic interface?

Yes, the MAX323C/D logic inputs are compatible with 3.3V CMOS levels when V+ = 3.3V: VINH = 2.4V and VINL = 0.6V meet standard thresholds. However, if V+ is higher (e.g., +5V or +12V), driving IN1/IN2 with only 3.3V logic violates the minimum high-level input requirement (VINH ≥ 2.4V is insufficient relative to V+); in such cases, rail-to-rail logic drive (0V to V+) or level translation is mandatory to ensure reliable switching and minimize supply current.

How does the MAX323C/D's leakage current behave over temperature?

The MAX323C/D guarantees ≤100pA NO/NC off-leakage at +25°C, rising to ≤5nA over the full 0°C to +70°C commercial range. COM off-leakage remains ≤5nA, and COM on-leakage stays ≤10nA. These values are 100% tested at hot temperature and correlated at room temperature - critical for high-impedance applications like pH probes or piezoelectric sensor interfaces where leakage-induced offset must remain below 1μV in 1MΩ source impedances.