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Analog Devices Inc./Maxim Integrated MAX32660GTG+T
- Part No.:
- MAX32660GTG+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Microcontrollers
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
MAX32660GTG+T.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 24TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:7,315
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Product details
Overview
MAX32660GTG+T from Analog Devices is an ultra-low-power, 32-bit Arm® Cortex®-M4 microcontroller with FPU, designed for battery-powered wearables and wireless sensors. It delivers 96MHz system clock speed, 256KB flash, 96KB SRAM (with optional retention in backup mode), and operates from a single 1.71V–3.63V supply. Its 4mm × 4mm 20-pin TQFN-EP package supports compact fitness monitors and medical patches requiring long runtime and sensor fusion.
For engineers reviewing the MAX32660GTG+T datasheet, MAX32660GTG+T pinout, MAX32660GTG+T application, or MAX32660GTG+T equivalent, this page provides verified technical context, power-mode current values (e.g., 2μA full memory retention), validated peripheral timing (I²C up to 1Mbps, SPI up to 48MHz), and real-world wearable use cases - all confirmed against Analog Devices' official MAX32660 datasheet Rev 9 (2022).
Technical Context
The MAX32660GTG+T implements a dual-supply-capable architecture with configurable VCORE regulation (0.855V–1.155V) and single-supply operation via internal LDO. Its clocking includes a 96MHz HFIO, 80kHz nanoring oscillator, and 32.768kHz RTC interface with crystal driver support.
Power management features four distinct modes: Active (85μA/MHz from flash), Sleep (30.3μA/MHz), Deep Sleep (4.2μA), and Backup (0.53μA with RTC active and 0KB SRAM retained). Memory protection (MPU), 16KB instruction cache, and optional bootloader over I²C/UART/SPI enable secure, scalable firmware deployment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4 with FPU - enables floating-point sensor fusion and real-time signal processing without external math coprocessor |
| Max Clock Speed | 96MHz - supports high-throughput sensor data acquisition and BLE protocol stack execution |
| Flash / RAM | 256KB flash + 96KB SRAM - accommodates complex firmware, OTA updates, and multi-sensor buffering in constrained footprint |
| Power Modes | Backup mode draws 0.53μA at VDD = 1.8V with RTC enabled and 0KB SRAM retained - extends coin-cell life beyond 5 years |
| I²C Support | Standard/Fast/Fast-Plus modes up to 1Mbps - interoperates with legacy and modern sensors without level-shifting |
| Package | 20-pin TQFN-EP (4mm × 4mm) - exposes thermal pad for efficient heat dissipation in sealed wearable enclosures |
| Operating Temp | -40°C to +105°C - qualified for industrial-grade wearable and portable medical device environments |
Pinout & Package
MAX32660GTG+T uses a 20-pin TQFN-EP (4mm × 4mm) package with exposed thermal pad (EP), compatible with standard reflow profiles (260°C peak). Pin 1 is marked by dot; EP must be soldered to VSS for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD (Pin 12) | Digital supply input | Accepts 1.71V–3.63V; bypassed with 1μF capacitor; powers entire digital domain including core logic and peripherals |
| VCORE (Pin 11) | Core voltage input | Configurable 0.855V–1.155V supply; left open for single-supply operation; requires 1μF bypass cap regardless of mode |
| VSS (Pins 6, 10, 19, 20) | Digital ground | Four dedicated ground pins minimize ground bounce and improve ADC/SPI noise immunity in mixed-signal layouts |
| RSTN (Pin 5) | Active-low reset input | Internally pulled up to VDD; asserts POR on falling edge; supports external reset coordination in multi-MCU systems |
| 32KIN / 32KOUT (Pins 9, 8) | RTC crystal interface | Drives 32.768kHz watch crystal (6pF, ESR < 90kΩ); enables sub-μA RTC timekeeping with 250ms wake-up latency |
| P0.0–P0.9 (Pins 1–4, 7, 13–18) | General-purpose I/O | 14 GPIO total; P0.2/P0.3/P0.8/P0.9 support I²C open-drain drive; all support Schmitt-trigger inputs (300mV hysteresis) |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power backup mode | 0.53μA with RTC active and zero SRAM retained - enables decade-scale timestamp logging in energy-harvesting sensors |
| Flexible memory retention | 96KB SRAM banks independently configurable for retention in backup mode - allows selective data preservation without full memory power penalty |
| Integrated power management unit | Supports both single-supply (VDD only) and dual-supply (VDD + VCORE) operation - simplifies PMIC selection for battery-powered designs |
| High-speed peripheral timing | SPI controller/target mode up to 48MHz; I²C Fast-Plus up to 1Mbps - eliminates need for external bus accelerators in sensor hub applications |
| Robust I/O voltage tolerance | GPIOs operate across full 1.71V–3.63V VDD range with 0.3×/0.7× VDD thresholds - ensures reliable interfacing with diverse analog and digital peripherals |
Applications
| Fitness Monitors | Wearable Medical Patches |
|---|---|
|
Use Scenario: Continuous heart rate and motion tracking in wrist-worn bands with 7-day battery life. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion algorithms, managing BLE connectivity, and maintaining RTC timebase. Use Value: 2μA full-memory-retention backup mode extends runtime between charges; 96KB SRAM buffers raw accelerometer/PPG data for offline analysis. |
Use Scenario: Disposable ECG patch transmitting diagnostic-quality waveforms every 2 hours over Bluetooth Low Energy. IC Role / Device Role / Timing Role: System-on-chip controller handling analog front-end sampling, digital filtering, secure firmware updates, and low-duty-cycle radio scheduling. Use Value: 4.2μA deep-sleep current enables >30-day operation on CR2032; integrated MPU prevents unauthorized code execution during OTA updates. |
| Industrial Wireless Sensors | Optical Modules (QSFP-DD) |
|
Use Scenario: Battery-powered temperature/humidity node deployed in HVAC ducts with 10-year maintenance interval. IC Role / Device Role / Timing Role: Sensor aggregator with local preprocessing, AES-128 encryption, and scheduled LoRaWAN transmission. Use Value: -40°C to +105°C rating ensures reliability in uncontrolled environments; 85μA/MHz active current minimizes energy per measurement cycle. |
Use Scenario: Digital diagnostics monitoring in 400G optical transceivers requiring real-time DOM (Digital Optical Monitoring) compliance. IC Role / Device Role / Timing Role: Embedded controller reading EEPROM, calibrating DACs, managing thermal throttling, and reporting via I²C SMBus interface. Use Value: I²C Fast-Plus (1Mbps) support meets QSFP-DD MSA timing requirements; 16KB instruction cache reduces latency during DOM register polling bursts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-power Arm Cortex-M4 microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | Integrated BLE 5.0 radio; 1MB flash / 256KB RAM; no RTC crystal driver; higher active current (3.5mA @ 64MHz) | Better suited for BLE-centric designs requiring embedded radio; less optimal for pure sensor-aggregation with minimal RF duty cycle | Select when wireless connectivity is primary requirement and board space permits larger 7mm × 7mm QFN |
| TI MSP432E401Y | ARM Cortex-M4F @ 120MHz; 1MB flash / 256KB RAM; 12-bit ADC; higher power (120μA/MHz active); no integrated VCORE regulator | Targets industrial HMI and motor control; lacks ultra-low-power backup mode (<1μA) and compact 4mm × 4mm footprint | Choose for high-precision analog acquisition or deterministic real-time control where power budget exceeds 10μA average |
Compared with Nordic nRF52840-QIAA and TI MSP432E401Y, the MAX32660GTG+T uniquely balances sub-μA backup operation, 4mm × 4mm size, and integrated power management - making it optimal for space-constrained, long-life sensor nodes where radio is external or secondary.
Availability
MAX32660GTG+T is available at Aetrix Electronics and suitable for fitness monitors, wearable medical patches, and industrial wireless sensors requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MAX32660GTG+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing technologies, serving industrial, automotive, communications, and healthcare markets with precision, power efficiency, and reliability.
The MAX32660GTG+T belongs to the DARWIN family of ultra-low-power MCUs, engineered specifically for battery-operated wearables and wireless sensor nodes where energy per computation cycle and physical footprint are critical design constraints.
FAQ
What is the maximum operating frequency of the MAX32660GTG+T?
The MAX32660GTG+T achieves a maximum system clock frequency of 96MHz using its high-frequency internal oscillator (HFIO). This is confirmed in the Electrical Characteristics table (page 7 of Rev 9 datasheet) under "System Clock Frequency" with typical value 96MHz and max 98.5MHz. The MAX32660GTG+T maintains full peripheral functionality-including SPI up to 48MHz and I²C Fast-Plus-at this clock rate.
Does the MAX32660GTG+T support single-supply operation?
Yes, the MAX32660GTG+T supports true single-supply operation from VDD alone (1.71V–3.63V). Its internal VCORE regulator automatically engages when VCORE pin is left open, generating the required 0.855V–1.155V core voltage. This eliminates external regulators in compact wearable designs - explicitly documented in Figure 1 (page 8) and Pin Description (page 15) of the datasheet.
What is the lowest power consumption mode of the MAX32660GTG+T with RTC enabled?
The lowest power mode with RTC enabled is Backup Mode, drawing 0.53μA at VDD = 1.8V when zero KB of SRAM is retained. This value is specified in the Electrical Characteristics table (page 5) under "VDD Fixed Current, Backup Mode". The RTC remains fully functional with 32.768kHz crystal or external clock source, and wake-up latency is 150μs.
Which package variant does MAX32660GTG+T correspond to?
The suffix "GTG+T" denotes the 20-pin TQFN-EP (4mm × 4mm) package with exposed thermal pad, per Analog Devices' ordering information (package code T2044+5C, outline number 21-0139). This is distinct from the 16-bump WLP (W161K1+1) and 24-pin TQFN-EP (T2433+2C) variants - confirmed in the Package Information section (page 2) of the datasheet.
Does the MAX32660GTG+T include hardware security features?
The MAX32660GTG+T integrates a Memory Protection Unit (MPU) supporting region-based access control for flash, SRAM, and peripherals - listed under "Benefits and Features" (page 1) and detailed in the Detailed Description (page 16). It does not include cryptographic accelerators, secure boot ROM, or tamper detection; those features appear in higher-tier DARWIN devices like MAX32670.
MAX32660GTG+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 24-WFQFN Exposed Pad
- Series:
- DARWIN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 96MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.63V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MAX32660GTG+T FAQ
1.How can I place an order for MAX32660GTG+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX32660GTG+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX32660GTG+T reliable?
The price and inventory of MAX32660GTG+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX32660GTG+T is usually 5 days.
3.What payment methods are accepted for MAX32660GTG+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX32660GTG+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX32660GTG+T?
MAX32660GTG+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX32660GTG+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX32660GTG+T?
For technical support, including MAX32660GTG+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX32660GTG+T requirements.
6.How does Aetrix verify that MAX32660GTG+T is sourced from the original manufacturer or authorized distributors?
All MAX32660GTG+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX32660GTG+T meets industry standards.
7.What is the process for return or replacement of MAX32660GTG+T?
All MAX32660GTG+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX32660GTG+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX32660GTG+T part is unused and in its original packaging.
Return procedure for MAX32660GTG+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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