My Inquiry
My Account
Analog Devices Inc./Maxim Integrated MAX32660GTP+
- Part No.:
- MAX32660GTP+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Microcontrollers
- Package:
- 20-WFQFN Exposed Pad
- Datasheet:
-
MAX32660GTP+.pdf
- Description:
- IC MCU 32BIT 256KB FLASH 20TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:386
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MAX32660GTP+ from Analog Devices is an ultra-low-power Arm® Cortex®-M4 microcontroller with FPU, designed for battery-powered wearables and wireless sensors. It delivers 96MHz operation, 256KB flash, 96KB SRAM (with optional retention in backup mode), 1.1V VCORE supply, and operates across –40°C to +105°C - enabling complex sensor processing in sports watches and medical patches.
For engineers reviewing the MAX32660GTP+ datasheet, MAX32660GTP+ pinout, MAX32660GTP+ application, or MAX32660GTP+ equivalent, this page provides verified technical context, validated pin functions, real-world power-mode tradeoffs, and confirmed alternative MCUs for wearable and IoT edge designs requiring sub-2μA deep-sleep current and single-supply 1.71–3.63V operation.
Technical Context
The MAX32660GTP+ integrates a dual-supply-capable power management unit supporting both single-VDD (1.71–3.63V) and split-rail (VDD + VCORE) operation, with internal LDO enabling direct battery connection. Its clock system combines a 96MHz HFIO, 80kHz nanoring oscillator, and 32.768kHz RTC crystal interface - all configurable per power mode.
It implements four hierarchical low-power states: Active (85μA/MHz from flash), Sleep (30.3μA/MHz), Deep Sleep (4.2μA fixed), and Backup (0.53μA with RTC active and zero SRAM retained). Peripheral flexibility includes two I²C ports (up to 3.4Mbps), two UARTs, two SPI controllers/targets (48MHz), I²S, DMA, and three 32-bit timers - all accessible via up to 14 GPIO pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Arm Cortex-M4 with hardware FPU - enables floating-point sensor fusion and real-time DSP without external coprocessor |
| Max System Clock | 96MHz HFIO - supports high-throughput sensor data acquisition and BLE protocol stack execution |
| Memory | 256KB flash + 96KB SRAM - accommodates full RTOS, BLE stack, and application firmware in monolithic footprint |
| Lowest Power Mode | 0.53μA @ VDD=1.8V with RTC enabled and 0KB SRAM retained - extends coin-cell life beyond 5 years in periodic wake-up sensing |
| I/O Voltage Range | 3.6V-tolerant GPIO - interfaces directly with legacy 3.3V peripherals without level shifters |
| Operating Temp | –40°C to +105°C - qualified for industrial-grade wearable and portable medical use cases |
| Package | 20-pin TQFN-EP (4mm × 4mm) - compact, thermally enhanced layout for space-constrained PCBs |
Pinout & Package
MAX32660GTP+ is supplied in a 20-pin TQFN-EP package (outline 21-0139, code T2044+5C) with exposed thermal pad. Pin pitch is 0.5mm; recommended land pattern is 90-0429. The package supports JEDEC-standard reflow and achieves θJA = 33°C/W on four-layer boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Digital supply input | Single 1.71–3.63V rail powers entire device; bypassed with 1μF capacitor - eliminates need for external VCORE regulator in most battery designs |
| VCORE | Core voltage input | Optional 0.855–1.155V supply for PMIC-based systems; left open for single-supply operation |
| VSS | Digital ground | Reference for all digital I/O and internal logic; must connect to exposed pad (EP) |
| RSTN | Active-low reset input | Internally pulled up to VDD; asserts POR on falling edge - enables system-level reset coordination |
| 32KIN / 32KOUT | RTC crystal interface | Drives 32.768kHz watch crystal (6pF, ESR < 90kΩ); required for RTC accuracy and low-power timekeeping |
| P0.0–P0.9 | Configurable GPIO | Up to 14 general-purpose pins with alternate functions (SPI/I²C/UART/I²S); P0.2/P0.3/P0.8/P0.9 support I²C open-drain drive |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low-power architecture | 2μA full memory retention in Backup mode at VDD=1.8V - preserves firmware state during multi-week battery disconnect |
| Flexible power modes | Four distinct states (Active/Sleep/Deep Sleep/Backup) with sub-μs wake-up latency - enables precise energy budgeting per sensor event |
| Integrated memory protection | MPU with configurable regions - prevents accidental overwrites in RTOS environments and isolates secure boot code |
| High-speed peripheral mix | Two I²C ports (3.4Mbps Fast-Plus), two UARTs, two SPI (48MHz), I²S, and DMA - supports concurrent sensor streaming and wireless coexistence |
| Single-supply simplicity | Internal LDO generates VCORE from VDD - reduces BOM count and PCB area vs. dual-LDO solutions |
Applications
| Sports Watches | Fitness Monitors |
|---|---|
Use Scenario: Continuous heart-rate and motion tracking with BLE telemetry and multi-day battery life. IC Role / Device Role / Timing Role: Primary MCU executing sensor fusion algorithms, managing BLE radio timing, and maintaining RTC-synchronized sampling intervals. Use Value: 96KB SRAM retains raw accelerometer/PPG buffers between BLE transmissions; 0.53μA backup current ensures accurate timekeeping during sleep cycles. |
Use Scenario: Compact wrist-worn device measuring step count, calories, and sleep stages using inertial and optical sensors. IC Role / Device Role / Timing Role: Central controller coordinating I²C-connected sensors, UART-linked BLE module, and I²S audio feedback - all under strict 20μA average current budget. Use Value: 85μA/MHz active current allows 96MHz burst processing of sensor data without exceeding battery capacity; 16KB instruction cache minimizes flash accesses. |
| Wearable Medical Patches | Industrial Sensors |
Use Scenario: Disposable ECG patch transmitting diagnostic-quality waveforms every 2 hours via NB-IoT or LTE-M. IC Role / Device Role / Timing Role: Safety-certifiable host processor managing analog front-end timing, cryptographic signing, and cellular modem handshaking. Use Value: –40°C to +105°C rating ensures reliability during skin-contact thermal cycling; MPU enforces separation between sensor firmware and secure bootloader. |
Use Scenario: Battery-powered wireless node monitoring temperature, humidity, and vibration in factory machinery. IC Role / Device Role / Timing Role: Edge intelligence hub performing FFT-based anomaly detection and adaptive sampling before forwarding alerts via LoRaWAN. Use Value: 256KB flash stores firmware updates and calibration tables; 4.2μA deep-sleep current enables 10-year deployment on primary lithium thionyl chloride cells. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nordic nRF52840-QIAA | Integrated BLE 5.0 radio; no RTC crystal pins; 256KB flash/64KB RAM; higher active current (≈3.5mA @ 64MHz) | Better suited for BLE-centric designs needing integrated radio; less optimal for pure sensor-processing with external comms | Select when BLE connectivity is mandatory and RF certification overhead must be avoided |
| TI MSP432E401Y | Arm Cortex-M4F at 120MHz; 1MB flash/256KB RAM; no sub-μA backup mode; requires external RTC crystal | Higher performance for motor control or Ethernet edge gateways; lacks ultra-low-power precision for multi-year coin-cell operation | Select when computational throughput outweighs battery life - e.g., industrial HMI with local display rendering |
Compared with nRF52840-QIAA and MSP432E401Y, MAX32660GTP+ uniquely balances sub-μA RTC-backed backup current, 96MHz deterministic processing, and 256KB/96KB memory in a 4mm × 4mm package - making it optimal for cost-sensitive, long-life wearable and medical edge nodes where external radios and minimal BOM are design priorities.
Availability
MAX32660GTP+ is available at Aetrix Electronics and suitable for sports watches, fitness monitors, and wearable medical patches requiring stable component supply across extended production lifecycles.
Supply support for MAX32660GTP+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices is a global leader in high-performance analog, mixed-signal, and digital signal processing technologies, serving industrial, automotive, communications, and healthcare markets.
The MAX32660GTP+ belongs to the DARWIN family of ultra-low-power MCUs, engineered specifically for battery-constrained edge devices demanding robust sensor processing, long-term RTC accuracy, and minimal system-level power management complexity.
FAQ
What is the maximum operating frequency of the MAX32660GTP+?
The MAX32660GTP+ features a high-frequency internal oscillator (HFIO) rated up to 96MHz, which serves as the primary system clock source. This frequency is fully supported across the full operating temperature range (–40°C to +105°C) and supply voltage range (1.71V to 3.63V), enabling deterministic real-time execution of sensor fusion and communication stacks without external clock components.
Does the MAX32660GTP+ support single-supply operation?
Yes, the MAX32660GTP+ supports true single-supply operation from VDD alone (1.71V to 3.63V). Its internal LDO automatically generates the required VCORE voltage (1.1V default), eliminating the need for an external core regulator. The VCORE pin may be left unconnected in this configuration - simplifying power design for coin-cell and Li-ion battery applications.
What is the lowest power consumption mode of the MAX32660GTP+ with RTC active?
In Backup mode with RTC enabled and zero KB of SRAM retained, the MAX32660GTP+ draws just 0.53μA at VDD = 1.8V. This mode maintains accurate timekeeping while preserving only essential RTC registers - extending battery life to over five years in intermittent-sensing applications such as wearable health trackers and environmental loggers.
Which communication interfaces does the MAX32660GTP+ support?
The MAX32660GTP+ integrates two I²C ports (supporting Standard, Fast, Fast-Plus, and High-Speed modes up to 3.4Mbps), two UARTs, two SPI controllers/targets (48MHz max), and one I²S interface. All are accessible through shared GPIO pins and support DMA-driven operation - enabling simultaneous sensor data acquisition, wireless telemetry, and audio feedback without CPU intervention.
Is the MAX32660GTP+ pin-compatible with other devices in the MAX326xx family?
No, the MAX32660GTP+ is not pin-compatible with other MAX326xx variants such as the MAX32664 or MAX32670. Its 20-pin TQFN-EP package has unique pin assignments for VDD, VCORE, 32KIN/32KOUT, and GPIO mapping. Board designs must be validated per specific MAX32660GTP+ footprint and thermal pad layout (land pattern 90-0429).
MAX32660GTP+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 20-WFQFN Exposed Pad
- Series:
- DARWIN
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 96MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O:
- 14
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 96K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.63V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MAX32660GTP+ FAQ
1.How can I place an order for MAX32660GTP+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX32660GTP+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX32660GTP+ reliable?
The price and inventory of MAX32660GTP+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX32660GTP+ is usually 5 days.
3.What payment methods are accepted for MAX32660GTP+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX32660GTP+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX32660GTP+?
MAX32660GTP+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX32660GTP+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX32660GTP+?
For technical support, including MAX32660GTP+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX32660GTP+ requirements.
6.How does Aetrix verify that MAX32660GTP+ is sourced from the original manufacturer or authorized distributors?
All MAX32660GTP+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX32660GTP+ meets industry standards.
7.What is the process for return or replacement of MAX32660GTP+?
All MAX32660GTP+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX32660GTP+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX32660GTP+ part is unused and in its original packaging.
Return procedure for MAX32660GTP+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MAX32660GTP+ Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
