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Analog Devices Inc./Maxim Integrated MAX32670GTL+
- Part No.:
- MAX32670GTL+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Microcontrollers
- Package:
- 40-WFQFN Exposed Pad
- Datasheet:
-
MAX32670GTL+.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 40TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:368
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Product details
Overview
MAX32670GTL+ from Analog Devices is an ultra-low-power, high-reliability 32-bit Arm® Cortex®-M4 microcontroller with FPU, designed for battery-constrained industrial and IoT sensor processing. It delivers 100MHz CPU operation, 384KB flash with SEC-DED ECC, 160KB SRAM (128KB with ECC), and operates from 0.9V–1.1V VCORE supply. It enables smart sensor controllers and secure radio modem controllers requiring deterministic real-time response and long-term data integrity.
For engineers reviewing the MAX32670GTL+ datasheet, MAX32670GTL+ pinout, MAX32670GTL+ application, or MAX32670GTL+ equivalent, this page provides verified technical context, power-mode current values, peripheral timing limits (50MHz SPI, 3.4Mbps I²C), low-power timer wakeup capability, and validated alternative MCUs for upgrade paths from legacy 8/16-bit designs.
Technical Context
The MAX32670GTL+ integrates a dual-supply power management unit supporting independent VCORE (0.9V–1.1V) and VDD (1.71V–3.63V) rails, enabling fine-grained voltage scaling across ACTIVE, SLEEP, DEEPSLEEP, BACKUP, and STORAGE modes. Its clocking architecture includes three internal oscillators (100MHz IPO, 7.3728MHz IBRO, 80kHz INRO) plus external crystal support (16–32MHz HFX, 32.768kHz RTC).
Memory subsystem features SEC-DED ECC across 384KB flash, 160KB SRAM (128KB ECC-enabled), and 16KB unified cache - all hardened for industrial temperature range (−40°C to +105°C). Security includes AES-128/192/256 hardware acceleration, TRNG, CRC engine, and optional secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-M4 with FPU, up to 100MHz - enables floating-point sensor fusion and real-time control without external coprocessor. |
| Flash Memory | 384KB with SEC-DED ECC - ensures single-bit error correction and double-bit error detection for mission-critical firmware execution. |
| SRAM | 160KB total; 128KB with ECC enabled - supports large algorithm buffers while maintaining data integrity in volatile memory. |
| Power Efficiency | 44μA/MHz at 0.9V/12MHz; 2.6μA in BACKUP mode with full memory retention - extends battery life in always-on edge nodes. |
| Peripherals | 3× SPI (up to 50MHz), 3× I²C (3.4Mbps), 4× UART (including LPUART), 2× LPTMR, 2× WWDT - provides scalable connectivity and robust system supervision. |
| Operating Temp | −40°C to +105°C - qualified for industrial-grade deployment in harsh environments without derating. |
| Supply Range | Dual-supply: VCORE = 0.855–1.155V, VDD = 1.71–3.63V - allows ultra-low-voltage core operation while interfacing with standard 1.8V/3.3V peripherals. |
Pinout & Package
MAX32670GTL+ is housed in a 5mm × 5mm, 40-pin TQFN-EP package (package code T4055+1, outline 21-0140) with exposed thermal pad for enhanced heat dissipation in compact industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | Main power supply | 1.71V–3.63V input for I/O, analog, and peripheral domains; powers internal LDO for VCORE generation in single-supply mode. |
| VCORE | Core voltage supply | 0.855V–1.155V regulated input; enables ultra-low-power CPU operation independent of I/O rail. |
| RSTN | Active-low reset input | Asynchronous reset assertion; monitored by POR/Brown-out circuitry for reliable power-up sequencing. |
| HFXIN / HFXOUT | High-frequency crystal oscillator interface | Supports 16–32MHz external crystal for precise system clock generation; requires external load capacitors. |
| 32KIN / 32KOUT | Real-time clock oscillator interface | Drives 32.768kHz crystal for RTC and low-power timer operation during BACKUP/DEEPSLEEP modes. |
| LPUART_TX / LPUART_RX | Low-power UART interface | Operates in DEEPSLEEP/BACKUP modes; enables wake-on-activity communication without exiting low-power state. |
| GPIO_0–GPIO_30 | General-purpose I/O | Up to 31 pins with configurable alternate functions (SPI/I²C/UART/TMR); supports 25mA sink/source per pin. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low active power | 44μA/MHz at 0.9V/12MHz - reduces average current in duty-cycled sensor applications, extending coin-cell lifetime beyond 5 years. |
| Full-memory retention in BACKUP mode | 2.6μA at VDD = 1.8V - preserves all SRAM contents and register states during extended sleep, enabling instant resume without reinitialization. |
| Hardware security acceleration | AES-128/192/256 + 32-bit CRC + TRNG - offloads cryptographic operations from CPU, reducing latency and power overhead in secure firmware updates. |
| Dual windowed watchdog timers | Fully independent clocking (IPO/IBRO/INRO) - prevents lockup from clock domain faults or software hangs in safety-critical housekeeping tasks. |
| Flexible low-power timer wakeup | Two 32-bit LPTMRs with external event capture - allows pulse counting, timestamping, and periodic wake from DEEPSLEEP using sub-μA clocks (80kHz/32.768kHz). |
Applications
| Smart Sensor Controller | Industrial Sensor Node |
|---|---|
Use Scenario: Compact environmental monitoring node measuring temperature, humidity, and gas concentration in factory settings. IC Role / Device Role / Timing Role: Primary sensor fusion MCU executing Kalman filtering and local anomaly detection before wireless transmission. Use Value: 100MHz Cortex-M4+FPU processes multi-sensor data in real time; 384KB flash stores calibration tables and firmware; ECC ensures reliability over 10+ year deployments. |
Use Scenario: Wireless vibration sensor on rotating machinery with predictive maintenance analytics. IC Role / Device Role / Timing Role: Edge coprocessor acquiring and preprocessing accelerometer data via DMA, then triggering BLE transmission upon threshold breach. Use Value: Low-power UART and LPTMR enable wake-on-vibration; 2.6μA BACKUP mode retains context between measurements; −40°C to +105°C rating suits motor-adjacent placement. |
| Optical Communication Module | Battery-Powered Medical Device |
Use Scenario: Small-form-factor fiber-optic transceiver module requiring precise timing and protocol translation. IC Role / Device Role / Timing Role: Protocol bridge between optical PHY layer and host controller, managing I²C configuration and SPI-based DSP register access. Use Value: 3.4Mbps I²C and 50MHz SPI meet high-speed control bandwidth needs; dual WWDT ensures fail-safe recovery during optical link retraining. |
Use Scenario: Portable ECG monitor powered by CR2032 battery with >7-day runtime and clinical-grade data integrity. IC Role / Device Role / Timing Role: System housekeeper managing ADC sampling, SD card logging, Bluetooth LE telemetry, and battery gauge. Use Value: SEC-DED ECC protects stored patient waveforms; 350nA RTC maintains accurate timestamps; secure boot prevents unauthorized firmware injection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX32672GTL+ | Same Darwin family; adds integrated 12-bit ADC (1MSPS), DAC, and more GPIO - no change to core architecture or power profile. | Preferred when analog sensor front-end integration is required; eliminates external signal conditioning components. | Select MAX32672GTL+ if on-chip ADC/DAC reduces BOM cost and layout area; otherwise MAX32670GTL+ offers optimal cost/power balance for digital-only sensor hubs. |
| STM32L4A6VGT6 | Arm Cortex-M4 @ 80MHz; 1MB flash, 320KB SRAM; no SEC-DED ECC on RAM; higher active current (116μA/MHz @ 1.2V). | Better suited for applications needing larger memory footprint but less stringent reliability requirements (e.g., consumer wearables). | Choose STM32L4A6VGT6 only if flash/SRAM capacity outweighs ECC and ultra-low-power needs; MAX32670GTL+ remains superior for industrial longevity and fault resilience. |
Compared with MAX32672GTL+, the MAX32670GTL+ trades integrated analog peripherals for lower cost and identical ultra-low-power performance; versus STM32L4A6VGT6, it delivers 2.6× lower BACKUP current and hardware-enforced memory integrity - critical for unattended industrial deployments.
Availability
MAX32670GTL+ is available at Aetrix Electronics and suitable for smart sensor controllers, industrial sensor nodes, and battery-powered medical devices requiring stable component supply, long-lifecycle assurance, and guaranteed RoHS-compliant sourcing.
Supply support for MAX32670GTL+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, serving industrial, automotive, communications, and healthcare markets.
The MAX32670GTL+ belongs to the Darwin family of ultra-low-power microcontrollers, engineered specifically for battery-operated industrial IoT endpoints demanding high reliability, cryptographic security, and deterministic low-power operation across extreme temperatures.
FAQ
What is the maximum operating frequency of the MAX32670GTL+?
The MAX32670GTL+ features an Arm Cortex-M4 processor with FPU capable of running at up to 100MHz. This maximum frequency is achievable under dual-supply conditions with VCORE set to 1.1V (OVR = [10]) and VDD ≥ 2.7V. At lower VCORE voltages (e.g., 0.9V), the maximum supported frequency is reduced to 12MHz to maintain stability and power efficiency.
Does the MAX32670GTL+ support secure boot functionality?
Yes, the MAX32670GTL+ supports optional secure boot, which verifies digital signatures of firmware images before execution. This feature leverages the integrated AES engine and TRNG to establish a root of trust, preventing unauthorized or corrupted code from loading - a key requirement for certified medical and industrial deployments where MAX32670GTL+ is deployed.
How much SRAM is available with ECC enabled on the MAX32670GTL+?
When ECC is enabled on the MAX32670GTL+, 128KB of the total 160KB SRAM is protected with SEC-DED error correction. The remaining 32KB operates without ECC and may be used for non-critical buffers or stack space. ECC activation is configurable at boot and impacts memory mapping, but does not affect the physical SRAM size or access latency.
What are the lowest power consumption modes supported by the MAX32670GTL+?
The MAX32670GTL+ supports five power modes: ACTIVE, SLEEP, DEEPSLEEP, BACKUP, and STORAGE. The lowest power state is BACKUP mode, drawing just 2.6μA at VDD = 1.8V while retaining full SRAM and register contents. In STORAGE mode, current drops further to 1.2μA but loses SRAM retention - making BACKUP the preferred mode for fast wake-and-resume scenarios in MAX32670GTL+ designs.
Can the MAX32670GTL+ operate from a single supply voltage?
Yes, the MAX32670GTL+ supports single-supply operation using only VDD (1.71V–3.63V), with its internal LDO generating the required VCORE voltage. In this configuration, the VCORE pin is left unconnected, and the OVR bits configure the LDO output (0.9V, 1.0V, or 1.1V). Single-supply simplifies PCB design for cost-sensitive MAX32670GTL+ applications like optical modules and portable sensors.
MAX32670GTL+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package/Case:
- 40-WFQFN Exposed Pad
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 100MHz
- Connectivity:
- 4-Wire, I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 31
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 160K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 3.6V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
MAX32670GTL+ FAQ
1.How can I place an order for MAX32670GTL+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX32670GTL+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX32670GTL+ reliable?
The price and inventory of MAX32670GTL+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX32670GTL+ is usually 5 days.
3.What payment methods are accepted for MAX32670GTL+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX32670GTL+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX32670GTL+?
MAX32670GTL+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX32670GTL+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX32670GTL+?
For technical support, including MAX32670GTL+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX32670GTL+ requirements.
6.How does Aetrix verify that MAX32670GTL+ is sourced from the original manufacturer or authorized distributors?
All MAX32670GTL+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX32670GTL+ meets industry standards.
7.What is the process for return or replacement of MAX32670GTL+?
All MAX32670GTL+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX32670GTL+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX32670GTL+ part is unused and in its original packaging.
Return procedure for MAX32670GTL+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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