Analog Devices Inc./Maxim Integrated MAX3372EEBL+T

Overview

MAX3372EEBL+T from Maxim Integrated is a bidirectional, dual-channel voltage-level translator enabling seamless data exchange between +1.2V to +5.5V logic domains (VL) and +1.65V to +5.5V domains (VCC), with guaranteed 230kbps data rate, ±15kV HBM ESD protection on VCC-side I/Os, and ultra-low 1µA three-state supply current. It serves in low-voltage ASIC-to-microcontroller interfaces where rail-to-rail signal integrity and ESD-hardened routing are critical.

For engineers reviewing the MAX3372EEBL+T datasheet, MAX3372EEBL+T pinout, MAX3372EEBL+T application, or MAX3372EEBL+T equivalent, key selection criteria include bidirectional translation capability, 230kbps timing compliance under 50pF load, VL-side operation down to +1.2V, thermal short-circuit protection, and compatibility with UCSP-8 (3mm × 3mm) layout constraints.

Technical Context

The MAX3372EEBL+T employs a transmission-gate-based architecture enabling true bidirectional level shifting (VL ↔ VCC) on each of its two independent channels without direction-control pins. Its internal speed-up circuitry is disabled-unlike 8Mbps variants-making it optimized for robust, slew-rate-limited 230kbps operation that reduces EMI emissions.

It features separate VL and VCC supplies, three-state output control referenced to VL, and integrated thermal shutdown that forces three-state mode at +152°C junction temperature. All I/Os tolerate −0.3V to (supply + 0.3V), supporting safe power-sequence-insensitive operation.

Key Specifications

Pinout & Package

MAX3372EEBL+T is housed in an 8-pin Ultra-Compact Silicon Package (UCSP-8) with exposed pad (EP) for thermal and electrical grounding. Pin numbering follows top-view orientation with pin 1 at bottom-left corner.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0102DCUR and SN74AVC2T244RSWR, the MAX3372EEBL+T uniquely combines true bidirectionality without direction pins, ±15kV HBM protection on VCC I/Os, and thermal fault recovery-making it optimal for compact, ESD-exposed, low-power embedded interfaces where reliability trumps marginal speed gain.

Availability

MAX3372EEBL+T is available at Aetrix Electronics and suitable for SPI level translation, low-voltage ASIC interfacing, and smart card reader designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MAX3372EEBL+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for industrial, automotive, and communications applications.

The MAX3372E series belongs to Maxim's ESD-hardened level translation product line, engineered specifically for robust inter-domain communication in portable, battery-powered, and externally cabled systems where voltage mismatch and electrostatic stress coexist.

FAQ

What is the maximum capacitive load supported by MAX3372EEBL+T at its guaranteed 230kbps data rate?

The MAX3372EEBL+T is characterized for guaranteed 230kbps operation with up to 50pF load capacitance per channel, as confirmed in the Timing Characteristics table (t_RVCC, t_FVCC, t_RVL, t_FVL ≤ 1100ns). Exceeding 50pF increases propagation delay and may violate setup/hold margins in high-speed SPI or MICROWIRE implementations. For loads >50pF, derating the data rate or adding series termination is recommended.

Does MAX3372EEBL+T require external pull-up resistors on its I/O lines?

No, MAX3372EEBL+T does not require external pull-ups. Its internal 10kΩ pull-up resistors on I/O VCC and I/O VL lines are automatically disconnected when THREE-STATE is asserted low. During normal operation, these internal resistors provide defined logic states-eliminating external components in most SPI and MICROWIRE applications where open-drain behavior is not needed.

Can MAX3372EEBL+T operate with VL = +1.2V and VCC = +5.5V simultaneously?

Yes, MAX3372EEBL+T supports VL as low as +1.2V and VCC as high as +5.5V concurrently, provided VL ≤ (VCC + 0.3V)-a condition satisfied here. This configuration enables direct interfacing between ultra-low-power sensors and legacy 5V peripherals, with output voltages scaled to 0.67×VL (≈0.8V) and 0.67×VCC (≈3.7V), meeting standard TTL and CMOS threshold requirements.

How does the thermal shutdown feature behave in MAX3372EEBL+T during sustained overload?

When junction temperature reaches +152°C, MAX3372EEBL+T's thermal sensor forces entry into three-state mode, disabling all I/O drivers and reducing total supply current to <1µA. Operation resumes automatically once junction temperature falls to +142°C. This hysteresis prevents oscillation and protects downstream components during sustained short-circuit faults on I/O lines.

Is the exposed pad (EP) of MAX3372EEBL+T electrically connected internally?

Yes, the exposed pad (EP) of MAX3372EEBL+T is internally connected to GND and must be soldered to a PCB ground plane. It serves dual roles: lowering thermal resistance (critical for power dissipation in UCSP packages) and providing a low-inductance path for ESD current discharge-enhancing the effectiveness of the ±15kV HBM protection on VCC-side I/Os.