Analog Devices Inc./Maxim Integrated MAX3373EEBL

Overview

The MAX3373EEBL from Maxim Integrated is a bidirectional, dual-channel voltage-level translator IC designed for interfacing between low-voltage logic (VL = +1.2V to +5.5V) and higher-voltage domains (VCC = +1.65V to +5.5V). It supports guaranteed 8Mbps data rate across full voltage range, delivers ±15kV HBM ESD protection on VCC-side I/Os, and features ultra-low 1µA three-state supply current. It is used in portable communication devices requiring robust, low-power level shifting between ASICs and legacy peripherals.

For engineers reviewing the MAX3373EEBL datasheet, MAX3373EEBL pinout, MAX3373EEBL application, or MAX3373EEBL equivalent, this page provides verified electrical specifications, bidirectional timing behavior under open-drain and rail-to-rail driving, thermal short-circuit protection details, and real-world use cases in SPI/I²C signal translation and smart card interfaces.

Technical Context

The MAX3373EEBL employs a transmission-gate-based architecture enabling true bidirectional level translation (VL ↔ VCC) on each of its two independent channels without direction control pins. Its speed-up circuitry - comprising one-shot-triggered pull-up MOSFETs (PU1/PU2) - accelerates rise times to ≤40ns at 1.8V–3.3V operation, supporting up to 16Mbps in optimized voltage domains (+1.8V ≤ VL ≤ VCC ≤ +2.5V or +2.5V ≤ VL ≤ VCC ≤ +3.3V).

It integrates thermal shutdown that forces three-state mode when junction temperature reaches +152°C and resumes normal operation at +142°C. The device maintains functional integrity after ±15kV HBM ESD events on VCC-side I/Os, with no latch-up observed - a key differentiator versus non-E-grade competitors.

Key Specifications

Pinout & Package

MAX3373EEBL is housed in an 8-pin TDFN package (3mm × 3mm, 0.5mm pitch) with exposed pad (EP) connected to GND for thermal performance. Pin 1 is marked by a dot; EP must be soldered to PCB ground plane.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0102DCUR and SN74AVC2T245RSWR, the MAX3373EEBL uniquely combines ±15kV HBM ESD hardening, thermal fault recovery, and 1.2V VL support - making it the sole choice for portable, user-accessible interfaces requiring field reliability without external protection components.

Availability

MAX3373EEBL is available at Aetrix Electronics and suitable for portable POS systems, smart card readers, and cell phone cradles requiring stable component supply with guaranteed long-term availability and traceable sourcing.

Supply support for MAX3373EEBL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for industrial, medical, and communications applications.

The MAX3372E–MAX3379E family was engineered specifically for robust, low-power bidirectional level translation in battery-operated portable electronics - prioritizing ESD resilience, wide voltage interoperability, and thermal safety over raw speed alone.

FAQ

What is the maximum data rate supported by the MAX3373EEBL under standard operating conditions?

The MAX3373EEBL guarantees 8Mbps operation across its full specified voltage range (+1.2V ≤ VL ≤ VCC ≤ +5.5V) with C_L = 15pF and open-drain driving. In optimized voltage domains - specifically +1.8V ≤ VL ≤ VCC ≤ +2.5V or +2.5V ≤ VL ≤ VCC ≤ +3.3V - it achieves up to 16Mbps. These higher rates require careful layout to minimize trace capacitance and maintain signal integrity. The MAX3373EEBL datasheet's Timing Characteristics table confirms these values with test conditions.

Does the MAX3373EEBL require external ESD protection components?

No, the MAX3373EEBL does not require external ESD protection components on its VCC-side I/O pins. It integrates ±15kV Human Body Model (HBM) ESD protection on all I/O VCC lines - validated per JEDEC JS-001. This eliminates the need for discrete TVS diodes in most handheld and portable applications. However, I/O VL pins are rated to ±8kV HBM, so external protection may be advisable if VL-side signals are exposed to frequent human contact in high-risk environments.

How does the three-state output mode function on the MAX3373EEBL?

The MAX3373EEBL enters three-state output mode when the THREE-STATE pin is pulled low (logic 0 referenced to VL). In this state, both I/O VL and I/O VCC lines become high-impedance, and total supply current drops below 1µA. This allows safe multidrop bus configurations and dynamic power gating. For normal operation, THREE-STATE must be tied to VL (logic high). The MAX3373EEBL's internal 10kΩ pull-up resistors on I/O lines are disconnected in three-state mode to prevent contention.

Can the MAX3373EEBL translate between 1.2V and 5.5V logic levels?

Yes, the MAX3373EEBL supports VL as low as +1.2V and VCC as high as +5.5V, satisfying the condition VL ≤ (VCC + 0.3V). It has been characterized for proper logic threshold operation across this full range - for example, VIHL = VL − 0.2V and VIHC = VCC − 0.4V ensure clean switching even at the extremes. However, propagation delay and rise/fall times increase at wider voltage gaps; design validation at the intended VL/VCC pair (e.g., 1.2V/3.3V) is recommended using the MAX3373EEBL's Typical Operating Characteristics graphs.

What thermal protection mechanism does the MAX3373EEBL implement?

The MAX3373EEBL implements thermal short-circuit protection via an on-die temperature sensor. When junction temperature reaches +152°C - typically during sustained I/O short-circuit events - the device automatically forces itself into three-state output mode to halt power dissipation. Once the junction cools to +142°C, normal operation resumes without requiring a power cycle. This auto-recovering behavior prevents permanent damage and ensures reliability in unattended portable equipment such as smart card readers and POS terminals.