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Analog Devices Inc./Maxim Integrated MAX3379EEBC-T
- Part No.:
- MAX3379EEBC-T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3379EEBC-T.pdf
- Description:
- QUAD LOW-VOLT LEVEL TRANSLATOR
- Quantity:
- Payment:
- Shipping:
Inventory:5,000
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Product details
Overview
The MAX3379EEBC-T from Maxim Integrated is a quad unidirectional voltage-level translator IC designed for bidirectional signal isolation between low-voltage (VL = +1.2V to +5.5V) and higher-voltage (VCC = +1.65V to +5.5V) domains. It supports guaranteed 8Mbps data rate across full voltage range, provides ±15kV HBM ESD protection on VCC-side I/Os, consumes only 130µA typical quiescent current, and features three-state output mode with <1µA supply current - enabling use in portable POS systems and smart card readers.
For engineers reviewing the MAX3379EEBC-T datasheet, MAX3379EEBC-T pinout, MAX3379EEBC-T application, or MAX3379EEBC-T equivalent, key selection criteria include its 4-channel unidirectional translation architecture, TDFN-14 (3mm × 3mm) package with exposed pad, thermal short-circuit protection, slew-rate-limited 8Mbps timing, and compatibility with SPI/MICROWIRE/I²C bus voltage bridging in battery-powered embedded systems.
Technical Context
The MAX3379EEBC-T implements unidirectional level shifting per channel (VL → VCC only), using MOSFET-based pass-gate logic without internal direction control lines. Each channel accepts input referenced to VL and delivers rail-to-rail output referenced to VCC, with input thresholds of VL − 0.2V (VIHL) and 0.15V (VILL), and output drive capability up to 1mA sink at VOLC = 0.4V.
It incorporates speed-up circuitry (one-shot triggered rise-time accelerators) enabling 16Mbps operation under specific voltage conditions (+1.8V ≤ VL ≤ VCC ≤ +2.5V or +2.5V ≤ VL ≤ VCC ≤ +3.3V), while maintaining 8Mbps guaranteed performance across full VL/VCC operating ranges. Thermal shutdown activates at TJ = +152°C and recovers at +142°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Channel Count | 4 independent unidirectional level-shifting channels |
| Max Data Rate | 8Mbps guaranteed over full VL/VCC range; up to 16Mbps at +1.8V–+2.5V or +2.5V–+3.3V |
| Supply Range VL | +1.2V to +5.5V - enables interface with 1.2V/1.8V/2.5V/3.3V/5V logic |
| Supply Range VCC | +1.65V to +5.5V - supports legacy 3.3V/5V systems and modern low-VCC rails |
| ESD Protection | ±15kV HBM on VCC-side I/Os - eliminates need for external TVS diodes in handheld interfaces |
| Quiescent Current | 130µA typical IQVCC - extends battery life in portable communication devices |
| Three-State Current | <1µA supply current - allows safe multidrop bus sharing without loading |
Pinout & Package
MAX3379EEBC-T is housed in a 14-pin TDFN-EP (3mm × 3mm) package with exposed thermal pad. Pin 1 is located at top-left corner adjacent to marking dot; EP must be soldered to PCB ground plane for thermal and EMI performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pin 14) | High-side supply input | Power reference for all VCC-referenced I/Os; must be ≥1.65V and ≤5.5V |
| VL (Pin 7) | Low-side supply input | Power reference for all VL-referenced I/Os; must be ≥1.2V and ≤(VCC + 0.3V) |
| THREE-STATE (Pin 6) | Enable control input | Pull low to place all I/Os in high-impedance state; logic referenced to VL |
| GND (Pin 10) | Ground reference | Common return path for both supply domains; connects to PCB ground plane |
| I/O VL1–VL4 (Pins 2,3,5,11) | Low-voltage side data terminals | Accept 1.2V–5.5V logic inputs; drive outputs only when enabled by VCC-side activity |
| I/O VCC1–VCC4 (Pins 1,4,8,12) | High-voltage side data terminals | Deliver rail-to-rail outputs referenced to VCC; sink up to 1mA at 0.4V VOLC |
| N.C. (Pins 9,13) | No-connect terminals | Not internally bonded; must remain unconnected or grounded per layout guidelines |
| EP | Exposed thermal pad | Internally connected to GND; requires solid solder connection to PCB ground for thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional 4-channel architecture | Eliminates direction-control pins and simplifies PCB routing for fixed-path interfaces like SPI clock/data lines |
| Rise-time acceleration circuitry | Reduces tRVL/tRVCC to ≤15ns under +2.5V/+3.3V conditions - meets 16Mbps timing in compact layouts |
| Thermal short-circuit protection | Automatically forces three-state mode at +152°C junction temperature - prevents latch-up during field faults |
| ±15kV HBM ESD on VCC I/Os | Enables direct connection to external connectors in cell-phone cradles without discrete ESD components |
| 1µA three-state supply current | Supports hot-plug and bus arbitration in multi-device I²C/SPI systems without signal contention |
Applications
| Smart Card Readers | Portable POS Terminals |
|---|---|
Use Scenario: Interface between 1.8V smart card IC and 3.3V host microcontroller via ISO/IEC 7816-3 compliant UART signals. IC Role / Device Role / Timing Role: Translates TX/RX/CLK/CRT signals unidirectionally with <20ns propagation delay at +1.8V/+3.3V. Use Value: Eliminates discrete level-shifter arrays and reduces BOM count by 4× while maintaining 16Mbps headroom for future firmware upgrades. | Use Scenario: Voltage bridging between 1.2V FPGA I/O banks and 5V display driver or printer interface in handheld payment terminals. IC Role / Device Role / Timing Role: Provides four isolated translation paths for parallel data bus, control strobes, and status flags. Use Value: Enables single-chip solution for mixed-voltage peripheral interfacing with <1µA standby current to meet EN 62368-1 battery runtime requirements. |
| Cell Phone Cradles | GPS Module Interfaces |
Use Scenario: Signal conditioning between 1.8V baseband processor and 5V USB PHY or analog audio codec in docking station designs. IC Role / Device Role / Timing Role: Translates UART, I²C, and GPIO control lines with ±15kV ESD robustness on exposed VCC-side pins. Use Value: Survives repeated hot-plug cycles and electrostatic discharge events common in consumer docking environments. | Use Scenario: Level matching between 2.5V GPS receiver IC (e.g., u-blox M8) and 3.3V host MCU's SPI interface in automotive telematics units. IC Role / Device Role / Timing Role: Delivers 8Mbps guaranteed SPI clock/data translation with <10ns channel-to-channel skew. Use Value: Ensures deterministic timing for NMEA sentence streaming and PPS synchronization without added jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar unidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0104E | 4-channel auto-direction sensing; no THREE-STATE pin; 100Mbps max; 1.65V–5.5V dual supply | Requires no direction control but lacks thermal shutdown and has lower ESD rating (±8kV HBM) | Select for high-speed bidirectional buses where automatic direction detection is preferred over explicit control |
| SN74AVC4T245 | 4-bit configurable bus transceiver; 3.6V max VCC; no integrated ESD protection; 3.3V–1.2V translation only | Needs external ESD diodes; limited to 3.3V/2.5V/1.8V/1.2V rails; no thermal protection | Select when cost sensitivity outweighs robustness requirements and external protection is acceptable |
Compared with TXS0104E and SN74AVC4T245, the MAX3379EEBC-T offers superior system-level reliability through integrated ±15kV HBM ESD, thermal shutdown, and explicit three-state control - critical for industrial handhelds and medical peripherals where field failure modes must be mitigated at the component level.
Availability
MAX3379EEBC-T is available at Aetrix Electronics and suitable for portable POS systems, smart card readers, and cell-phone cradles requiring stable component supply, long-term lifecycle support, and guaranteed RoHS-compliant packaging.
Supply support for MAX3379EEBC-T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and power management ICs for industrial, communications, and consumer applications.
The MAX3372E–MAX3379E family was engineered specifically for robust, low-power voltage translation in space-constrained portable electronics - emphasizing ESD resilience, ultra-low standby current, and flexible dual-supply operation across sub-1.8V to 5V logic domains.
FAQ
What is the maximum guaranteed data rate for MAX3379EEBC-T across its full operating voltage range?
The MAX3379EEBC-T guarantees 8Mbps operation for all combinations of VL from +1.2V to +5.5V and VCC from +1.65V to +5.5V. Higher rates - up to 16Mbps - are achievable only within narrower voltage windows: +1.8V ≤ VL ≤ VCC ≤ +2.5V or +2.5V ≤ VL ≤ VCC ≤ +3.3V, as confirmed in the Timing Characteristics table of the official MAX3372E–MAX3379E datasheet.
Does MAX3379EEBC-T support bidirectional level translation?
No, the MAX3379EEBC-T is a unidirectional level translator: signals flow only from VL-side inputs to VCC-side outputs. It belongs to the MAX3374E/MAX3375E/MAX3376E/MAX3379E subgroup, distinct from bidirectional variants like MAX3377E/MAX3378E. Its pinout and functional diagram confirm dedicated I/O VL_ and I/O VCC_ terminals with no internal feedback path for reverse translation.
How does the THREE-STATE pin function on MAX3379EEBC-T?
The THREE-STATE pin (Pin 6) is VL-referenced: pulling it low places all eight I/O terminals (I/O VL1–VL4 and I/O VCC1–VCC4) into high-impedance state, reducing total supply current to <1µA. In normal operation, connect THREE-STATE to VL (logic-high). This feature enables safe multidrop bus configurations and hot-swap capability without signal contention on shared lines.
What package type and thermal considerations apply to MAX3379EEBC-T?
The MAX3379EEBC-T uses a 14-pin TDFN-EP package (3mm × 3mm) with exposed thermal pad (EP). The EP must be soldered to a PCB ground plane to ensure proper thermal dissipation and EMI suppression. Thermal shutdown activates at +152°C junction temperature and recovers at +142°C, providing fault protection during sustained overload or poor heatsinking conditions.
Is external ESD protection required when using MAX3379EEBC-T in handheld applications?
No external ESD protection is required on the VCC-side I/Os (I/O VCC1–VCC4) due to integrated ±15kV Human Body Model protection - validated per JEDEC JS-001. However, VL-side I/Os are rated to ±8kV HBM; for systems with exposed VL-side connectors, additional protection may be prudent. The device maintains functionality post-ESD event without latch-up, unlike many competing translators.
MAX3379EEBC-T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Unidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.65 V ~ 5.5 V
- Voltage - VCCB:
- 1.2 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 8Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-WFBGA, CSPBGA
MAX3379EEBC-T FAQ
1.How can I place an order for MAX3379EEBC-T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3379EEBC-T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3379EEBC-T reliable?
The price and inventory of MAX3379EEBC-T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3379EEBC-T is usually 5 days.
3.What payment methods are accepted for MAX3379EEBC-T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3379EEBC-T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3379EEBC-T?
MAX3379EEBC-T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3379EEBC-T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3379EEBC-T?
For technical support, including MAX3379EEBC-T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3379EEBC-T requirements.
6.How does Aetrix verify that MAX3379EEBC-T is sourced from the original manufacturer or authorized distributors?
All MAX3379EEBC-T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3379EEBC-T meets industry standards.
7.What is the process for return or replacement of MAX3379EEBC-T?
All MAX3379EEBC-T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3379EEBC-T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3379EEBC-T part is unused and in its original packaging.
Return procedure for MAX3379EEBC-T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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