Analog Devices Inc./Maxim Integrated MAX3394EEBL+TG45

Overview

The MAX3394EEBL+TG45 from Maxim Integrated is a dual-channel bidirectional level translator IC designed for multivoltage system interfacing between low-voltage ASICs/PLDs (down to +1.2V VL) and higher-voltage logic domains (up to +5.5V VCC). It delivers 6Mbps guaranteed data rate with push-pull drivers, ±15kV HBM ESD protection on VCC-side I/Os, and internal slew-rate enhancement enabling fast transitions under high capacitive bus loads-used in SPI/I²C signal bridging between 1.8V microcontrollers and 3.3V peripherals.

For engineers reviewing the MAX3394EEBL+TG45 datasheet, MAX3394EEBL+TG45 pinout, MAX3394EEBL+TG45 application, or MAX3394EEBL+TG45 equivalent, key selection criteria include its dual-channel architecture, 9-bump UCSP package, tri-state enable control, thermal shutdown, and compatibility with both open-drain and push-pull drivers across wide supply ranges.

Technical Context

The MAX3394EEBL+TG45 employs a transmission-gate-based bidirectional level-shifting architecture with gate-control logic that disables the pass-FET when both I/O sides are logic-high, providing capacitive isolation. When either side is logic-low, the pass-FET activates to propagate the low state bidirectionally.

Its internal slew-rate enhancement circuitry uses dedicated 15mA source and 10mA sink drivers during logic transitions-MP1/MP2 for low-to-high, MN3/MN4 for high-to-low-enabling robust operation with external pullup resistors up to 10kΩ and bus capacitance ≥100pF while maintaining 1Mbps open-drain performance.

Key Specifications

Pinout & Package

The MAX3394EEBL+TG45 is housed in a 9-bump wafer-level chip-scale package (UCSP), footprint code B9-5, with exposed pad connected to GND for thermal and EMI performance. Dimensions: 1.5mm × 1.5mm × 0.6mm (max).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0102DCUR and PCA9306DCUR, the MAX3394EEBL+TG45 uniquely combines 6Mbps push-pull speed, ±15kV ESD hardening, thermal shutdown, and tri-state enable in a 1.5mm² UCSP-making it optimal for space-constrained, mission-critical industrial and telecom interfaces requiring zero external components.

Availability

The MAX3394EEBL+TG45 is available at Aetrix Electronics and suitable for smartphone baseband interfacing, I²C bus translation, SPI flash memory access, and RAID controller signal buffering requiring stable component supply across extended temperature and high-reliability production cycles.

Supply support for MAX3394EEBL+TG45 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability semiconductor solutions for industrial, communications, and computing markets.

The MAX3394E series was engineered specifically for robust, low-component-count bidirectional level translation in multivoltage digital systems-targeting portable electronics, telecom infrastructure, and industrial automation where ESD resilience and thermal safety are non-negotiable.

FAQ

What is the maximum capacitive load the MAX3394EEBL+TG45 can drive at 1Mbps open-drain operation?

The MAX3394EEBL+TG45 maintains guaranteed 1Mbps operation with up to 400pF bus capacitance when used with external 4.7kΩ pullup resistors, as validated in Figure 17 of the datasheet. Its internal slew-rate enhancement circuitry actively sources 15mA during low-to-high transitions, reducing rise time dependence on RC time constants and enabling reliable timing margins in high-density PCB layouts.

Does the MAX3394EEBL+TG45 require external pullup resistors for I²C operation?

No-the MAX3394EEBL+TG45 includes internal 10kΩ (typ) pullup resistors on all four I/O lines (I/O VL1, I/O VL2, I/O VCC1, I/O VCC2), allowing direct connection to standard I²C buses without external components. These internal pullups are automatically disabled during tri-state mode when EN is driven low, preventing contention on shared buses.

Can the MAX3394EEBL+TG45 operate with VL = 1.2V and VCC = 5.0V simultaneously?

Yes-the MAX3394EEBL+TG45 is fully specified for VL from +1.2V to VCC and VCC from +1.65V to +5.5V, making simultaneous 1.2V/5.0V operation valid and production-tested. This configuration is commonly used to interface ultra-low-power sensor nodes (1.2V) with legacy 5V industrial controllers while maintaining 6Mbps push-pull throughput.

How does thermal shutdown function in the MAX3394EEBL+TG45 during an I/O short-circuit event?

When junction temperature reaches +125°C due to sustained I/O short-circuit current, the MAX3394EEBL+TG45's internal thermal sensor forces all I/Os into high-impedance tri-state mode and disables internal pullups-halting current flow and allowing safe cooldown. Operation resumes automatically once junction temperature falls below +115°C, eliminating need for system-level reset intervention.

Is the exposed pad on the MAX3394EEBL+TG45's UCSP package electrically connected or thermal-only?

The exposed pad on the MAX3394EEBL+TG45 is electrically connected to GND and must be soldered to a PCB ground plane. It serves dual purposes: lowering thermal resistance (critical for 379mW max power dissipation at +70°C) and improving ESD current shunting path for the ±15kV HBM protection structure-failure to connect it compromises both thermal performance and ESD robustness.