Analog Devices Inc./Maxim Integrated MAX3394EETA+T

Overview

The MAX3394EETA+T from Maxim Integrated is a dual-channel bidirectional level translator IC designed for multivoltage system interfacing between low-voltage ASICs/PLDs (down to +1.2V VL) and higher-voltage logic domains (up to +5.5V VCC). It delivers 6Mbps guaranteed data rate with push-pull drivers, ±15kV HBM ESD protection on VCC-side I/Os, and internal slew-rate enhancement enabling fast transitions under high bus capacitance. It is widely deployed in SPI, I²C, and MICROWIRE interface translation within cell phones and telecom infrastructure.

For engineers reviewing the MAX3394EETA+T datasheet, MAX3394EETA+T pinout, MAX3394EETA+T application, or MAX3394EETA+T equivalent, key selection considerations include its dual-channel architecture, tri-state enable control, 10mA sink / 15mA source drive capability per I/O, thermal shutdown protection, and compatibility with both open-drain and push-pull drivers across wide supply ranges.

Technical Context

The MAX3394EETA+T employs a transmission-gate-based bidirectional architecture with gate-control logic that disables the pass-FET when both I/O sides are logic-high-providing capacitive isolation-and enables it during logic-low states to propagate signals bidirectionally. Its internal 10kΩ pullup resistors (typ) support direct connection to open-drain buses without external components.

Slew-rate enhancement uses dedicated MOSFETs (MP1/MP2 for sourcing, MN3/MN4 for sinking) triggered by voltage thresholds: 15mA source current accelerates low-to-high transitions, while 10mA sink current ensures fast high-to-low edges-even with large load capacitance or high-value external pullups. EN pin control provides hardware-selectable tri-state mode with <3µA VCC supply current.

Key Specifications

Pinout & Package

The MAX3394EETA+T is housed in an 8-pin 3mm × 3mm TDFN-EP package (PKG CODE T833-1) with exposed paddle thermally connected to GND.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXS0102DCUR and SN74AVC2T244RSWR, the MAX3394EETA+T uniquely combines bidirectional operation without direction control, ±15kV ESD protection, integrated slew-rate enhancement, and thermal shutdown-making it the only option qualified for high-reliability, open-drain–capable, and hot-plug–tolerant multivoltage interfaces.

Availability

MAX3394EETA+T is available at Aetrix Electronics and suitable for cell phone baseband design, telecom interface modules, and industrial embedded controllers requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for MAX3394EETA+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for industrial, communications, and consumer applications.

The MAX3394EETA+T belongs to Maxim's high-drive, ESD-hardened level translator product line, engineered specifically for reliable signal integrity in multivoltage digital systems with stringent ESD and thermal requirements.

FAQ

What is the maximum guaranteed data rate of the MAX3394EETA+T?

The MAX3394EETA+T guarantees 6Mbps operation with push-pull drivers and 1Mbps with open-drain drivers across its full operating temperature range (-40°C to +85°C). These rates are validated under worst-case conditions including 15pF load capacitance and minimum supply voltages (VCC = +1.65V, VL = +1.2V), ensuring robust timing margin in production systems.

Does the MAX3394EETA+T require external pullup resistors for I²C operation?

No, the MAX3394EETA+T includes internal ~10kΩ pullup resistors on both VL- and VCC-side I/Os, enabling direct I²C bus connection without external components. For higher-speed open-drain operation (e.g., 1Mbps with 400pF load), external pullups (e.g., 4.7kΩ) can be added alongside the internal ones to reduce rise time-verified in Maxim's typical operating characteristics.

How does the EN pin function on the MAX3394EETA+T?

The EN pin on the MAX3394EETA+T controls tri-state output mode: driving EN low forces all I/Os into high-impedance state, disables internal pullup resistors, and reduces supply current to 3µA (VCC) and 0.7µA (VL). EN must be driven to VL or VCC for normal bidirectional translation; floating EN is not recommended as it may cause undefined behavior.

What package type and dimensions does the MAX3394EETA+T use?

The MAX3394EETA+T uses an 8-pin TDFN-EP (Thin Dual Flat No-lead with Exposed Pad) package measuring 3.0mm × 3.0mm × 0.8mm (max height), with JEDEC MO-229 compliant footprint (PKG CODE T833-1). The exposed thermal pad must be soldered to a PCB ground plane for thermal and electrical integrity.

Is the MAX3394EETA+T compatible with mixed-voltage SPI buses?

Yes, the MAX3394EETA+T is explicitly designed for mixed-voltage SPI translation: its dual-channel architecture supports independent translation of MOSI/MISO or CLK/CS pairs between 1.2V–5.5V domains. With 50ns max propagation delay and matched channel-to-channel skew (<5ns), it preserves SPI timing margins at 6Mbps while eliminating direction-control complexity.