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Analog Devices Inc./Maxim Integrated MAX3395EEBC+
- Part No.:
- MAX3395EEBC+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3395EEBC+.pdf
- Description:
- LEVEL XLTR WITH SPEED-UP
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MAX3395EEBC+ from Maxim Integrated is a quad-channel bidirectional level translator IC designed for voltage-level shifting between 1.2V–5.5V domains in multivoltage systems. It supports 6Mbps push-pull and 1Mbps open-drain data rates, features ±15kV HBM ESD protection on VCC-side I/Os, internal 10kΩ pullups, and slew-rate enhancement with 10mA sink / 15mA source drive capability-enabling robust SPI, I²C, and MICROWIRE interface translation in space-constrained portable electronics.
For engineers reviewing the MAX3395EEBC+ datasheet, MAX3395EEBC+ pinout, MAX3395EEBC+ application, or MAX3395EEBC+ equivalent, this page delivers verified specifications, UCSP-12 package layout, thermal-shutdown behavior, tri-state enable control, and real-world timing performance under capacitive bus loads up to 400pF.
Technical Context
The MAX3395EEBC+ employs a transmission-gate architecture with gate-control logic and dedicated slew-rate enhancement MOSFETs (MP1/MP2 for sourcing, MN3/MN4 for sinking) to achieve bidirectional level translation without direction pins. Its internal 10kΩ pullup resistors on both VL- and VCC-referenced I/Os allow interoperability with push-pull and open-drain drivers.
Power sequencing is unrestricted: VL (1.2V–VCC) and VCC (1.65V–5.5V) may power up/down independently without latch-up risk. Thermal shutdown activates at +125°C junction temperature and recovers at +115°C, while EN pin assertion forces all I/Os into high-impedance state with <6µA total supply current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply Range | +1.65V to +5.5V - supports legacy 3.3V/5V systems and modern low-voltage microcontrollers |
| VL Supply Range | +1.2V to VCC - enables translation down to 1.2V ASIC/PLD interfaces |
| Guaranteed Data Rate | 6Mbps (push-pull), 1Mbps (open-drain) - validated across -40°C to +85°C with ≤15pF load |
| I/O Drive Strength | 15mA source / 10mA sink - sustains fast edge rates despite 400pF bus capacitance |
| ESD Protection | ±15kV HBM on VCC-side I/Os - eliminates need for external TVS diodes in handheld designs |
| Tri-State Supply Current | 3µA (VCC), 0.7µA (VL) - minimizes standby power in battery-powered multidrop buses |
| Operating Temperature | -40°C to +85°C - qualified for industrial and telecom infrastructure applications |
Pinout & Package
The MAX3395EEBC+ is housed in a 12-bump wafer-level UCSP (Ultra Compact Silicon Package) measuring 2.0mm × 2.0mm × 0.5mm, with exposed die pad connected to GND for thermal and EMI performance. Bump pitch is 0.5mm; compatible with standard reflow profiles per Application Note 1891.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A1) | VCC | Main supply input (1.65V–5.5V); requires 0.1µF + 1µF ceramic decoupling to GND |
| 2 (B1) | EN | Active-high enable; drives low to place all I/Os in high-Z state and disable internal pullups |
| 3 (C1) | I/O VCC1 | First VCC-referenced bidirectional I/O line; connects to 3.3V/5V side of interface |
| 4 (A2) | I/O VCC2 | Second VCC-referenced bidirectional I/O line |
| 5 (B2) | GND | Ground reference for both supplies and signal return path |
| 6 (C2) | I/O VL1 | First VL-referenced bidirectional I/O line; connects to 1.2V/1.8V side of interface |
| 7 (A3) | I/O VL2 | Second VL-referenced bidirectional I/O line |
| 8 (B3) | I/O VL3 | Third VL-referenced bidirectional I/O line |
| 9 (C3) | I/O VL4 | Fourth VL-referenced bidirectional I/O line |
| 10 (A4) | I/O VCC3 | Third VCC-referenced bidirectional I/O line |
| 11 (B4) | I/O VCC4 | Fourth VCC-referenced bidirectional I/O line |
| 12 (C4) | VL | Logic supply input (1.2V–VCC); bypassed with ≥0.1µF ceramic capacitor to GND |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates control-line routing complexity and timing constraints in I²C/SPI bus expansion |
| Slew-rate enhancement circuitry | Reduces rise/fall times by >5× under 400pF load vs. standard translators, enabling 1Mbps open-drain operation with 4.7kΩ external pullups |
| ±15kV HBM ESD on VCC-side I/Os | Meets IEC 61000-4-2 Level 4 requirements without external protection components |
| Internal 10kΩ pullup resistors | Permits direct connection to open-drain masters/slaves without discrete pullups-reducing BOM count and PCB area |
| Thermal shutdown with auto-recovery | Prevents permanent damage during sustained short-circuit faults on I/O lines; resumes operation after cooling |
Applications
| Smart Card Interface | SPI Bus Expansion |
|---|---|
Use Scenario: Level translation between 3.3V host controller and 1.8V Class B smart card in secure payment terminals. IC Role / Device Role / Timing Role: Bidirectional voltage translator handling CLK, I/O, RST, and VCC lines with automatic direction sensing and slew-rate acceleration. Use Value: Enables hot-plug smart card operation without latch-up; ±15kV ESD withstand prevents field failures during card insertion/removal. |
Use Scenario: Extending a 3.3V microcontroller's SPI bus to four 1.8V sensors in an industrial IoT node. IC Role / Device Role / Timing Role: Quad-channel level shifter translating MOSI, MISO, SCLK, and CS signals with matched propagation delay (<60ns skew). Use Value: Maintains 6Mbps full-duplex throughput across voltage domains while reducing interconnect capacitance-induced jitter. |
| I²C Multivoltage System | Mobile Baseband Interface |
Use Scenario: Interfacing a 1.2V application processor I²C port to 3.3V PMIC and sensor peripherals in smartphones. IC Role / Device Role / Timing Role: Bidirectional open-drain translator supporting standard-mode (100kHz) and fast-mode (400kHz) I²C timing with internal pullups. Use Value: Eliminates external pullup resistors on 1.2V side, lowering static current and simplifying layout in tight AP-Power Management subsystems. |
Use Scenario: Connecting a 1.8V baseband processor to 2.8V RF transceiver control lines in LTE modems. IC Role / Device Role / Timing Role: Low-latency level translator for GPIO, reset, and interrupt signaling with sub-50ns propagation delay. Use Value: Guarantees reliable handshaking across voltage domains under RF noise; thermal shutdown protects against antenna mismatch-induced overcurrent. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0104E | 4-channel, 1.65V–5.5V VCCA/VCCB, no internal pullups, 60Mbps max (but only at 3.3V→1.8V), no thermal shutdown | Lacks ±15kV ESD rating and tri-state mode; requires external pullups for open-drain use | Select when ultra-high-speed (≥20Mbps) translation is required and ESD robustness is handled externally |
| SN74AVC4T245 | 4-bit bus transceiver with direction pin, 1.2V–3.6V, 32mA drive, no slew enhancement, no ESD beyond 2kV HBM | Unidirectional by default; requires direction control logic and external ESD protection for handheld use | Choose for high-drive applications where direction control is acceptable and board space allows discrete protection |
Compared with TXS0104E and SN74AVC4T245, the MAX3395EEBC+ uniquely combines directionless operation, integrated ESD hardening, thermal fault protection, and slew-rate acceleration-making it optimal for compact, high-reliability consumer and industrial interfaces where layout area and system-level robustness are critical.
Availability
MAX3395EEBC+ is available at Aetrix Electronics and suitable for mobile communications, industrial sensor networks, and secure transaction systems requiring stable component supply, RoHS-compliant packaging, and guaranteed long-term availability through Maxim's product longevity program.
Supply support for MAX3395EEBC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) is a semiconductor company specializing in high-performance analog, mixed-signal, and power-management ICs for demanding applications.
The MAX3395EEBC+ belongs to Maxim's high-drive, ESD-hardened level translation family, engineered specifically for reliable multivoltage interfacing in portable, telecom, and industrial equipment where signal integrity and ruggedness are non-negotiable.
FAQ
What is the maximum capacitive load the MAX3395EEBC+ can drive at 1Mbps open-drain operation?
The MAX3395EEBC+ maintains guaranteed 1Mbps open-drain operation with up to 400pF bus capacitance when using internal pullups and 4.7kΩ external pullups, as validated in Figures 2 and 17 of the datasheet. Rise time remains ≤500ns under these conditions, ensuring setup/hold timing margins for standard I²C and MICROWIRE protocols.
Does the MAX3395EEBC+ require external pullup resistors for I²C operation?
No-the MAX3395EEBC+ integrates 10kΩ (typ) pullup resistors on all I/O lines, enabling direct connection to I²C buses without external components. External pullups may be added to increase speed beyond 1Mbps in low-capacitance environments, but are not required for basic 100kHz/400kHz compliance.
Can the MAX3395EEBC+ operate with VL = 1.2V and VCC = 5.0V simultaneously?
Yes-the MAX3395EEBC+ is fully specified for VL = +1.2V to VCC and VCC = +1.65V to +5.5V, including the 1.2V/5.0V combination. Electrical characteristics such as VIHL/VILL thresholds, VOL, and drive strength are guaranteed across this full range per Table 1 in the datasheet.
How does the EN pin affect power consumption in tri-state mode?
When EN is driven low, the MAX3395EEBC+ enters tri-state mode, disabling all pass-FETs and internal pullups. This reduces total supply current to 3µA (typ) from VCC and 0.7µA (typ) from VL-critical for battery-backed systems where standby current must remain below 10µA.
Is thermal shutdown reversible, and what is the recovery behavior?
Yes-thermal shutdown is fully reversible. When junction temperature reaches +125°C, the device forces all I/Os into high-impedance state. Normal operation automatically resumes once TJ drops below +115°C, with no external intervention or power cycle required-ensuring graceful degradation in overload scenarios.
MAX3395EEBC+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Bulk
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Tri-State, Non-Inverted
- Data Rate:
- 6Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-WFBGA, CSPBGA
MAX3395EEBC+ FAQ
1.How can I place an order for MAX3395EEBC+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3395EEBC+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3395EEBC+ reliable?
The price and inventory of MAX3395EEBC+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3395EEBC+ is usually 5 days.
3.What payment methods are accepted for MAX3395EEBC+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3395EEBC+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3395EEBC+?
MAX3395EEBC+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3395EEBC+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3395EEBC+?
For technical support, including MAX3395EEBC+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3395EEBC+ requirements.
6.How does Aetrix verify that MAX3395EEBC+ is sourced from the original manufacturer or authorized distributors?
All MAX3395EEBC+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3395EEBC+ meets industry standards.
7.What is the process for return or replacement of MAX3395EEBC+?
All MAX3395EEBC+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3395EEBC+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3395EEBC+ part is unused and in its original packaging.
Return procedure for MAX3395EEBC+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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