Analog Devices Inc./Maxim Integrated MAX3395EEBC+T

Overview

MAX3395EEBC+T from Maxim Integrated is a quad-channel bidirectional level translator IC designed for multivoltage system interconnects between low-voltage ASICs/PLDs (down to +1.2V VL) and higher-voltage logic (+1.65V to +5.5V VCC). It delivers 6Mbps push-pull and 1Mbps open-drain data rates, features ±15kV HBM ESD protection on VCC-side I/Os, and operates across –40°C to +85°C in portable telecom and industrial interface applications.

For engineers reviewing the MAX3395EEBC+T datasheet, MAX3395EEBC+T pinout, MAX3395EEBC+T application, or MAX3395EEBC+T equivalent, key selection criteria include guaranteed bidirectional translation without direction control, internal 10kΩ pullups, slew-rate enhancement enabling fast transitions under 400pF bus load, and UCSP package compatibility with space-constrained PCB layouts.

Technical Context

The MAX3395EEBC+T employs transmission-gate architecture with gate-control logic and dedicated slew-rate enhancement MOSFETs (15mA source / 10mA sink) to isolate capacitive loads during logic transitions. Its dual-supply operation allows independent VL (+1.2V to VCC) and VCC (+1.65V to +5.5V) rails, supporting voltage-domain bridging in SPI, I²C, and MICROWIRE interfaces.

Tri-state output mode is activated via the EN pin, disabling pass-FETs and internal pullups while reducing supply current to 3µA (VCC) and 0.7µA (VL). Thermal shutdown engages at +125°C junction temperature and recovers at +115°C, ensuring robustness during short-circuit faults.

Key Specifications

Pinout & Package

The MAX3395EEBC+T is housed in a 12-bump wafer-level chip-scale package (UCSP), footprint-compatible with JEDEC MO-229 WEEC standard, with exposed pad connected to GND for thermal and EMI performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional level translation applications.

Compared with TXB0104RUTR and SN74AVC4T245PW, the MAX3395EEBC+T provides guaranteed 1Mbps open-drain performance under 400pF load, integrated ±15kV ESD protection eliminating external TVS diodes, and autonomous thermal shutdown-critical for unattended telecom and industrial deployments.

Availability

MAX3395EEBC+T is available at Aetrix Electronics and suitable for telecom infrastructure, industrial IoT gateways, and portable medical devices requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MAX3395EEBC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated, now part of Analog Devices, designs precision analog, mixed-signal, and high-reliability semiconductor solutions for industrial, automotive, communications, and computing markets.

The MAX3395E product line targets multivoltage digital interface bridging in space-constrained, ESD-prone environments-specifically engineered for robust bidirectional level translation in portable and infrastructure equipment where supply sequencing flexibility and fault resilience are mandatory.

FAQ

What is the maximum capacitive load the MAX3395EEBC+T can drive at 1Mbps in open-drain mode?

The MAX3395EEBC+T guarantees 1Mbps operation with up to 400pF bus capacitance when used with internal pullups and slew-rate enhancement. Test data (Figure 17) confirms clean 1Mbps waveforms at 400pF with 4.7kΩ external pullups and +5.0V VCC/+3.3V VL. Performance remains stable across –40°C to +85°C, making MAX3395EEBC+T suitable for high-density PCB routing in telecom modules.

Does the MAX3395EEBC+T require specific power-supply sequencing between VL and VCC?

No, the MAX3395EEBC+T has no power-supply sequencing requirements. It tolerates VL or VCC floating during power-up/down while the other rail is applied, preventing latch-up. This design allows flexible integration into systems with staggered rail activation-such as battery-backed smart card readers-where MAX3395EEBC+T maintains functional integrity without external sequencing circuitry.

How does the slew-rate enhancement circuitry in the MAX3395EEBC+T improve timing performance?

The MAX3395EEBC+T uses dedicated MOSFETs (MP1/MP2 for sourcing, MN3/MN4 for sinking) that activate during logic transitions to deliver 15mA source or 10mA sink current. This overrides RC-limited rise/fall times caused by bus capacitance, reducing t_R/t_F from >500ns to ≤50ns in push-pull mode. As a result, MAX3395EEBC+T sustains 6Mbps data rates even with 100pF loads, directly improving signal integrity in high-speed SPI links.

Can the MAX3395EEBC+T be used in I²C applications without external pullup resistors?

Yes, the MAX3395EEBC+T integrates 10kΩ (typ) internal pullup resistors on all I/O VL_ and I/O VCC_ lines, enabling direct I²C bus connection without external components. These pullups meet standard-mode (100kHz) and fast-mode (400kHz) I²C specifications when paired with compliant bus capacitance (<400pF), simplifying design and reducing BOM count-key for compact MAX3395EEBC+T implementations in wearables and sensor nodes.

What is the thermal shutdown behavior of the MAX3395EEBC+T during sustained overload?

The MAX3395EEBC+T enters tri-state mode at +125°C junction temperature and automatically resumes normal operation when temperature falls below +115°C. During shutdown, all I/Os go high-impedance and internal pullups disable, limiting power dissipation. This hysteresis prevents oscillation near trip point and ensures safe recovery-critical for MAX3395EEBC+T deployment in sealed enclosures or high-ambient industrial settings without forced cooling.