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Analog Devices Inc./Maxim Integrated MAX3395EETC+
- Part No.:
- MAX3395EETC+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3395EETC+.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 12TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,889
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Product details
Overview
MAX3395EETC+ from Maxim Integrated is a quad-channel bidirectional level translator IC designed for multivoltage system interconnects between low-voltage ASIC/PLDs (down to +1.2V VL) and higher-voltage logic (+1.65V to +5.5V VCC). It delivers 6Mbps guaranteed data rate with push-pull drivers, ±15kV HBM ESD protection on VCC-side I/Os, tri-state enable control, and internal 10kΩ pullups-enabling robust SPI, I²C, and MICROWIRE translation in telecom baseband modules.
For engineers reviewing the MAX3395EETC+ datasheet, MAX3395EETC+ pinout, MAX3395EETC+ application, or MAX3395EETC+ equivalent, key selection criteria include guaranteed 6Mbps push-pull timing, slew-rate enhancement for >100pF bus loads, thermal shutdown at +125°C, EN-controlled high-impedance mode (<3µA VCC supply current), and compatibility with both open-drain and push-pull drivers across dual supply domains.
Technical Context
The MAX3395EETC+ employs a transmission-gate architecture with gate-control logic and dedicated slew-rate enhancement MOSFETs (MP1/MP2 sourcing 15mA, MN3/MN4 sinking 10mA) to accelerate transitions without external components. Its bidirectional operation requires no direction pin and maintains isolation when both I/O sides are high.
Power sequencing is unrestricted: VL (1.2V–VCC) and VCC (1.65V–5.5V) may power up/down independently. Tri-state mode disables pass-FETs and internal pullups, reducing leakage to ±1µA per I/O and enabling multidrop bus arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Supply Range | +1.65V to +5.5V - supports interface to 1.8V, 2.5V, 3.3V, and 5V logic domains |
| VL Supply Range | +1.2V to VCC - enables translation down to ultra-low-voltage controllers and smart cards |
| Guaranteed Data Rate | 6Mbps (push-pull), 1Mbps (open-drain) - ensures timing compliance in high-speed serial buses |
| I/O Sink/Source Drive | 10mA sink / 15mA source - sustains fast edges into 100pF+ loads without external buffers |
| ESD Protection | ±15kV HBM on VCC-side I/Os - eliminates need for discrete TVS diodes in handheld and hot-plug interfaces |
| Tri-State Supply Current | 3µA typ (VCC), 0.7µA typ (VL) - minimizes standby power in battery-backed systems |
| Operating Temperature | -40°C to +85°C - qualified for industrial and telecom infrastructure environments |
Pinout & Package
MAX3395EETC+ is housed in a 12-pin 4mm × 4mm TQFN-EP package with exposed paddle (PKG CODE T1244-4). The thermally enhanced leadframe improves power dissipation and solder joint reliability in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 11 | VCC | Main supply input (1.65V–5.5V); bypass with 0.1µF + 1µF ceramics to ground for ESD immunity |
| 2, 6 | EN | Active-high enable; drives all I/Os to high-Z and disables internal pullups when low |
| 3, 4, 18, 19 | I/O VCC1–I/O VCC4 | VCC-referenced bidirectional I/Os; tolerate -0.3V to VCC+0.3V during tri-state or unpowered states |
| 5, 13, 14, 20 | I/O VL1–I/O VL4 | VL-referenced bidirectional I/Os; compatible with 1.2V–VCC logic thresholds and open-drain drivers |
| 7, 12 | GND | Analog/digital ground reference; must connect exposed pad to GND for thermal and ESD performance |
| 8, 10 | VL | Logic supply input (1.2V–VCC); bypass with ≥0.1µF ceramic capacitor to GND |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Eliminates control-line routing complexity and reduces FPGA I/O count in space-constrained designs |
| Slew-rate enhancement circuitry | Enables 6Mbps operation into 100pF bus capacitance using only internal drivers-no external speed-up resistors needed |
| ±15kV HBM ESD on VCC-side I/Os | Prevents latch-up and functional failure during board handling or field-level signal insertion events |
| Internal 10kΩ pullup resistors | Supports direct connection to open-drain buses (e.g., I²C) without external components, reducing BOM count |
| Thermal shutdown at +125°C | Automatically forces tri-state mode during sustained short-circuit faults, protecting downstream logic |
Applications
| Smart Card Interface | SPI Level Translation |
|---|---|
Use Scenario: Bidirectional data exchange between a 3.3V host controller and Class A/B/C smart cards operating at 1.8V or 3.0V. IC Role / Device Role / Timing Role: Translates CLK, I/O, RST, and VPP signals while maintaining strict ISO/IEC 7816 timing margins under dynamic voltage transitions. Use Value: Prevents latch-up during card insertion/removal and guarantees <600ns propagation delay even with 400pF bus load and 4.7kΩ external pullups. | Use Scenario: Interfacing a 1.8V FPGA SPI master to a 3.3V ADC or flash memory peripheral. IC Role / Device Role / Timing Role: Translates MISO, MOSI, SCLK, and CS lines with matched rise/fall times (50ns typical) to preserve setup/hold timing. Use Value: Enables full 6Mbps SPI throughput without skew-induced CRC errors, eliminating need for separate level-shifter ICs per line. |
| I²C Bus Expansion | Telecom Baseband Module |
Use Scenario: Extending a 3.3V microcontroller I²C bus to multiple 1.2V sensor nodes in an industrial IoT gateway. IC Role / Device Role / Timing Role: Acts as bidirectional open-drain translator with internal pullups, supporting standard-mode (100kHz) and fast-mode (400kHz) signaling. Use Value: Maintains bus integrity with 1Mbps slew-enhanced rise time even with 150pF total capacitance-exceeding I²C spec limits by 5×. | Use Scenario: Signal conditioning between a 2.5V baseband processor and 5V RF front-end ICs in 4G/LTE small cell equipment. IC Role / Device Role / Timing Role: Translates control/status lines (TX_EN, RX_READY, RESET) across voltage domains while surviving hot-swap events. Use Value: ±15kV ESD rating eliminates external protection components, reducing layout area and improving MTBF in field-deployed units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXS0104QPWRQ1 | 4-channel, automotive-grade (–40°C to +125°C), 10Mbps max, no integrated ESD protection | Requires external ±8kV ESD diodes; suited for AEC-Q100-compliant vehicle networks | Select when automotive qualification and higher speed outweigh ESD integration needs |
| SN74AVC4T245PWR | 4-channel, direction-controlled (DIR pin), 3.6V max VCCA/VCCB, no slew enhancement | Lacks automatic bidirectionality and slew-rate acceleration-requires careful timing margin analysis | Choose only if direction control is preferred and bus capacitance remains <30pF |
Compared with TXS0104QPWRQ1 and SN74AVC4T245PWR, the MAX3395EETC+ uniquely combines pinless bidirectionality, ±15kV on-chip ESD, and slew-rate enhancement-making it optimal for compact, high-reliability consumer and telecom interfaces where layout space and field robustness are critical.
Availability
MAX3395EETC+ is available at Aetrix Electronics and suitable for telecom infrastructure, smart-card readers, and industrial IoT gateways requiring stable component supply, RoHS-compliant packaging, and extended temperature support.
Supply support for MAX3395EETC+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for demanding industrial, communications, and computing applications.
The MAX3395EETC+ belongs to Maxim's high-drive, ESD-hardened level translator family-engineered specifically for reliable multivoltage interoperability in portable, hot-pluggable, and high-noise environments.
FAQ
What is the maximum capacitive load the MAX3395EETC+ can drive at 6Mbps?
The MAX3395EETC+ maintains guaranteed 6Mbps operation with push-pull drivers into ≤100pF total bus capacitance, as verified in Figures 1 and 14 of the datasheet. At 100pF, propagation delay remains ≤20ns and rise/fall times stay within 50ns-ensuring timing compliance for SPI and parallel control buses without external buffering.
Does the MAX3395EETC+ require external pullup resistors for I²C operation?
No, the MAX3395EETC+ includes internal 10kΩ pullup resistors on all I/O VL_ and I/O VCC_ lines, enabling direct I²C connection without external components. These pullups support standard-mode (100kHz) and fast-mode (400kHz) signaling; external resistors may be added only to extend rise time for high-capacitance buses beyond 150pF.
How does the EN pin affect power consumption in the MAX3395EETC+?
When EN is driven low, the MAX3395EETC+ enters tri-state mode: all I/Os go high-impedance, internal pullups disable, and supply currents drop to 3µA (VCC) and 0.7µA (VL) typical. This ultra-low quiescent state is ideal for power-gated subsystems in battery-powered smart-card readers and portable test equipment.
Can the MAX3395EETC+ translate between 1.2V and 5.5V logic levels?
Yes-the MAX3395EETC+ supports VL as low as +1.2V and VCC as high as +5.5V simultaneously. Its transmission-gate architecture and independent threshold detection (VIHL = 0.7×VL, VIHC = 0.7×VCC) ensure correct logic interpretation across this full range, validated for 1.2V↔3.3V and 1.8V↔5.5V use cases in telecom and industrial control.
Is thermal shutdown recovery automatic in the MAX3395EETC+?
Yes-when junction temperature reaches +125°C, the MAX3395EETC+ automatically enters tri-state mode. Recovery is fully autonomous: normal operation resumes once TJ falls below +115°C, with no reset or external intervention required. This behavior is tested and guaranteed over the full –40°C to +85°C ambient range.
MAX3395EETC+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tube
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull, Tri-State
- Data Rate:
- 6Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing, Power Supply Decoupling, Thermal-Shutdown Protection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-WQFN Exposed Pad
MAX3395EETC+ FAQ
1.How can I place an order for MAX3395EETC+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3395EETC+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3395EETC+ reliable?
The price and inventory of MAX3395EETC+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3395EETC+ is usually 5 days.
3.What payment methods are accepted for MAX3395EETC+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3395EETC+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3395EETC+?
MAX3395EETC+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3395EETC+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3395EETC+?
For technical support, including MAX3395EETC+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3395EETC+ requirements.
6.How does Aetrix verify that MAX3395EETC+ is sourced from the original manufacturer or authorized distributors?
All MAX3395EETC+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3395EETC+ meets industry standards.
7.What is the process for return or replacement of MAX3395EETC+?
All MAX3395EETC+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX3395EETC+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3395EETC+ part is unused and in its original packaging.
Return procedure for MAX3395EETC+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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