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Analog Devices Inc./Maxim Integrated MAX3395EETC+T
- Part No.:
- MAX3395EETC+T
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Category:
- Translators, Level Shifters
- Package:
- Datasheet:
-
MAX3395EETC+T.pdf
- Description:
- IC TRANSLTR BIDIRECTIONAL 12TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,935
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Product details
Overview
MAX3395EETC+T from Maxim Integrated is a quad-channel bidirectional level translator IC designed for multivoltage system interconnects between low-voltage ASICs/PLDs (down to +1.2V VL) and higher-voltage logic (+1.65V to +5.5V VCC). It delivers 6Mbps push-pull and 1Mbps open-drain guaranteed data rates, features ±15kV HBM ESD protection on VCC-side I/Os, and integrates slew-rate enhancement with 15mA source / 10mA sink drive capability-enabling robust SPI, I²C, and MICROWIRE translation in telecom and mobile applications.
For engineers reviewing the MAX3395EETC+T datasheet, MAX3395EETC+T pinout, MAX3395EETC+T application, or MAX3395EETC+T equivalent, key selection criteria include its quad-channel bidirectional architecture without direction pin, tri-state enable control, internal 10kΩ pullups, thermal shutdown, and compatibility with both push-pull and open-drain drivers across wide supply ranges.
Technical Context
The MAX3395EETC+T employs a transmission-gate-based bidirectional level-shifting architecture with gate-control logic and dedicated slew-rate enhancement MOSFETs (MP1/MP2 for 15mA sourcing, MN3/MN4 for 10mA sinking). This isolates capacitive bus loads from core drivers while accelerating transitions during logic state changes.
It supports independent dual-supply operation: VL (1.2V to VCC) sets low-voltage I/O thresholds and bias, while VCC (1.65V to 5.5V) powers high-voltage I/Os and enables ±15kV ESD protection on VCC-side pins. EN pin controls full tri-state mode, disabling pass-FETs and internal pullups to achieve 3μA VCC supply current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Number of Channels | 4 independent bidirectional I/O pairs - enables full quad-line serial interface translation (e.g., I²C SDA/SCL + two auxiliary lines). |
| Data Rate (Push-Pull) | 6Mbps guaranteed - supports high-speed SPI clocking up to ~3MHz with margin, suitable for fast microcontroller-to-peripheral communication. |
| Data Rate (Open-Drain) | 1Mbps guaranteed - maintains reliable I²C Fast-mode timing even with 400pF bus capacitance and external 4.7kΩ pullups. |
| VCC Supply Range | +1.65V to +5.5V - interoperates with 1.8V, 2.5V, 3.3V, and 5V systems without level-shifter cascading. |
| VL Supply Range | +1.2V to VCC - allows direct interfacing with ultra-low-voltage logic (e.g., 1.2V FPGA I/O banks) while referencing higher VCC. |
| ESD Protection | ±15kV HBM on VCC-side I/Os - eliminates need for external TVS diodes in handheld and board-edge signal routing. |
| Tri-State Current (VCC) | 3μA typical - reduces standby power in multidrop buses where devices are dynamically enabled/disabled. |
Pinout & Package
MAX3395EETC+T is housed in a 12-pin 4mm × 4mm TQFN-EP package with exposed pad connected to GND. Pin functions are validated per Maxim's official datasheet (Rev 3, 7/17).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 11 | VCC | Main high-voltage supply input (1.65V–5.5V); requires 0.1µF + 1µF ceramic decoupling for ESD integrity. |
| 2, 6 | EN | Active-high enable; drives low to place all I/Os in high-Z state and disable internal pullups. |
| 3, 4, 10, 12 | I/O VCC1–4 | High-voltage side of bidirectional channels; tolerate up to VCC + 0.3V when tri-stated. |
| 5, 13 | GND | Analog/digital ground reference; exposed pad must be soldered to PCB GND plane for thermal and ESD performance. |
| 7, 8, 9, 14 | I/O VL1–4 | Low-voltage side of bidirectional channels; tolerate up to VL + 0.3V when tri-stated. |
| 15, 16 | VL | Low-voltage supply input (1.2V–VCC); bypassed with ≥0.1µF ceramic capacitor. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional translation without direction pin | Automatic pass-FET control based on I/O voltage differential eliminates external direction control logic and timing constraints. |
| Slew-rate enhancement circuitry | 15mA source / 10mA sink drivers reduce rise/fall times under load, enabling 1Mbps open-drain operation with 400pF bus capacitance. |
| Internal 10kΩ pullup resistors | Eliminates need for four external pullups on VL and VCC sides-reducing BOM count and board space in I²C/SPI designs. |
| Thermal shutdown at +125°C | Auto-tri-states outputs during sustained short-circuit faults, protecting downstream logic and enabling self-recovery at +115°C. |
| Guaranteed 6Mbps push-pull timing | 50ns max propagation delay and 5ns channel skew ensure deterministic timing for synchronous interfaces like SPI clock/data pairs. |
Applications
| Smart Card Interface | SPI Level Translation |
|---|---|
Use Scenario: Bidirectional signal translation between a 3.3V host controller and Class A/B/C smart cards operating at 1.8V or 3.0V. IC Role / Device Role / Timing Role: Quad-level translator handling CLK, I/O, RST, and VPP lines with automatic direction sensing and glitch-free handshaking. Use Value: Prevents latch-up during hot card insertion/removal and maintains ±15kV ESD robustness on exposed card-edge signals. | Use Scenario: Interfacing a 1.8V FPGA SPI master to a 3.3V ADC or sensor with shared MISO/MOSI lines. IC Role / Device Role / Timing Role: Full-duplex bidirectional level shifter supporting 6Mbps clock rates while preserving setup/hold timing margins. Use Value: Enables single-chip translation of all four SPI lines without direction control overhead or timing skew penalties. |
| I²C Bus Expansion | Telecom Baseband Interface |
Use Scenario: Extending an existing 3.3V I²C bus to connect 1.2V PMICs or sensors in battery-powered modules. IC Role / Device Role / Timing Role: Open-drain compatible translator with internal pullups and slew enhancement to maintain 100kHz/400kHz timing with >200pF total bus capacitance. Use Value: Eliminates external pullup resistors and ensures reliable arbitration and clock stretching across voltage domains. | Use Scenario: Level-shifting control signals (RESET, INT, GPIO) between a 2.5V baseband processor and 3.3V RF transceiver in 4G/LTE modules. IC Role / Device Role / Timing Role: Low-latency, ESD-hardened quad translator ensuring signal integrity in noisy RF environments with minimal layout impact. Use Value: ±15kV HBM protection prevents field failures from handling-induced ESD on exposed module connectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional level translation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TXB0104RUTR | 4-channel auto-direction, 1.2V–3.6V I/O range, no ±15kV ESD, 100Mbps max (not guaranteed), 1.8V min VCCA/VCCB | Lacks guaranteed 1Mbps open-drain timing and fails HBM spec for external-signal routing | Prefer MAX3395EETC+T where ESD robustness and guaranteed timing under capacitive load are required. |
| SN74AVC4T245PWR | 4-channel, direction-controlled, 1.2V–3.6V, 3.6V tolerant, no integrated slew enhancement or thermal shutdown | Requires external direction signal and pullups; unsuitable for I²C or hot-swap scenarios | Select MAX3395EETC+T for directionless, ESD-hardened, thermally protected operation in compact portable designs. |
Compared with TXB0104RUTR and SN74AVC4T245PWR, the MAX3395EETC+T uniquely combines guaranteed 1Mbps open-drain timing, ±15kV HBM protection, thermal shutdown, and directionless operation-making it optimal for space-constrained, high-reliability I²C/SPI links in mobile and telecom infrastructure.
Availability
MAX3395EETC+T is available at Aetrix Electronics and suitable for telecom baseband interfaces, smart-card readers, SPI peripheral interconnects, and I²C bus expansion requiring stable component supply across industrial temperature ranges.
Supply support for MAX3395EETC+T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-reliability interface ICs for demanding industrial, automotive, and communications applications.
The MAX3395EETC+T belongs to Maxim's ESD-hardened level translation product line, engineered specifically for robust multivoltage signal bridging in portable, telecom, and smart-card systems where reliability under electrical stress is critical.
FAQ
What is the guaranteed maximum data rate for MAX3395EETC+T in open-drain mode?
The MAX3395EETC+T guarantees 1Mbps operation in open-drain mode with internal pullups and slew-rate enhancement. This is validated across the full -40°C to +85°C temperature range and holds for bus capacitances up to 400pF when using external 4.7kΩ pullup resistors, as confirmed in Figures 2 and 12 of the official datasheet.
Does MAX3395EETC+T require external pullup resistors for I²C operation?
No, MAX3395EETC+T includes internal 10kΩ pullup resistors on both VL and VCC sides of each I/O pair, eliminating the need for external pullups in standard I²C implementations. External pullups may be added only to increase data rate beyond 1Mbps in low-capacitance, push-pull configurations-but are not required for basic 100kHz/400kHz I²C compliance.
How does the EN pin function on MAX3395EETC+T?
The EN pin on MAX3395EETC+T is an active-high enable input. When driven high (to VL or VCC), the device operates normally with bidirectional translation and active internal pullups. When driven low, MAX3395EETC+T enters tri-state mode: all I/Os go high-impedance, pass-FETs disable, internal pullups disconnect, and VCC supply current drops to 3μA typical-facilitating multidrop bus sharing.
What package type and dimensions does MAX3395EETC+T use?
MAX3395EETC+T uses a 12-pin TQFN-EP package measuring 4mm × 4mm with 0.5mm pitch and an exposed thermal pad. Per Maxim's Package Information (T1244-4), the exposed pad must be soldered to a PCB ground plane to ensure thermal dissipation and ±15kV ESD performance, and the overall height is 0.8mm max.
Is MAX3395EETC+T compatible with 1.2V logic on the VL side?
Yes, MAX3395EETC+T fully supports VL supply voltages as low as +1.2V while maintaining guaranteed 6Mbps push-pull and 1Mbps open-drain operation. Its input thresholds scale with VL (VIHL = 0.7×VL, VILL = 0.3×VL), and internal 10kΩ pullups remain functional down to 1.2V-enabling direct interfacing with 1.2V FPGA I/O banks and ultra-low-power PMICs.
MAX3395EETC+T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Package/Case:
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Translator Type:
- Voltage Level
- Channel Type:
- Bidirectional
- Number of Circuits:
- 1
- Channels per Circuit:
- 4
- Voltage - VCCA:
- 1.2 V ~ 5.5 V
- Voltage - VCCB:
- 1.65 V ~ 5.5 V
- Input Signal:
- -
- Output Signal:
- -
- Output Type:
- Open Drain, Push-Pull, Tri-State
- Data Rate:
- 6Mbps
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Features:
- Auto-Direction Sensing, Power Supply Decoupling, Thermal-Shutdown Protection
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-WQFN Exposed Pad
MAX3395EETC+T FAQ
1.How can I place an order for MAX3395EETC+T through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX3395EETC+T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX3395EETC+T reliable?
The price and inventory of MAX3395EETC+T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3395EETC+T is usually 5 days.
3.What payment methods are accepted for MAX3395EETC+T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3395EETC+T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX3395EETC+T?
MAX3395EETC+T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX3395EETC+T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX3395EETC+T?
For technical support, including MAX3395EETC+T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3395EETC+T requirements.
6.How does Aetrix verify that MAX3395EETC+T is sourced from the original manufacturer or authorized distributors?
All MAX3395EETC+T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3395EETC+T meets industry standards.
7.What is the process for return or replacement of MAX3395EETC+T?
All MAX3395EETC+T units undergo pre-shipment inspection (PSI). If there is an issue with MAX3395EETC+T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX3395EETC+T part is unused and in its original packaging.
Return procedure for MAX3395EETC+T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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