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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Delay Lines

Analog Devices Inc./Maxim Integrated MAX3620CETT

Name: MAX3620CETT
Brand: Analog Devices Inc./Maxim Integrated
SKU: MAX3620CETT
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MAX3620CETT

Manufacturer:: Analog Devices Inc./Maxim Integrated

Category:: Delay Lines

Package:: 6-WDFN Exposed Pad

Datasheet:: MAX3620CETT.pdf

Description:: DELAY LINES - CLOCK DISTRIBUTION

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MAX3620CETT from Maxim Integrated is a passive, dual-channel HSTL-compatible delay line optimized for quarter-clock-phase generation in QDR/QDRII memory systems. It delivers a precise 1.25ns nominal delay per channel, supports 50Ω single-ended and 100Ω differential transmission lines, features ±20ps delay matching between channels, and operates across -40°C to +85°C in a 3mm × 3mm TDFN package.

For engineers reviewing the MAX3620CETT datasheet, MAX3620CETT pinout, MAX3620CETT application, or MAX3620CETT equivalent, key selection criteria include verified 1.25ns delay accuracy under 50Ω source-terminated conditions, insertion loss ≤3.1dB at 200MHz, 700MHz cutoff frequency, input/output return loss ≥12dB/15dB (50MHz–1GHz), and compatibility with high-speed clock distribution requiring sub-100ps channel-to-channel skew.

Technical Context

The MAX3620CETT implements a distributed LC transmission-line architecture with symmetrical 50Ω characteristic impedance per channel, enabling stable delay performance independent of load termination when used with HSTL source-terminated drivers. Its all-passive design eliminates active components, DC bias, or power supply requirements.

Each channel operates bidirectionally and supports both single-ended (IN1/OUT1, IN2/OUT2) and differential configurations via shared COMMON pins. Delay stability is maintained across 150–200MHz clock frequencies with <±20ps matching and minimal sensitivity to load capacitance (≤5pF) or resistance (20kΩ).

Key Specifications

Parameter	Value and Actual Design Meaning
Nominal Delay	1.25ns ±0.10ns (guaranteed 1.15ns–1.35ns); enables accurate 90° phase shift for QDR II clock quadrature.
Delay Matching	±20ps (IN1→OUT1 vs. IN2→OUT2); ensures tight timing alignment between dual clock paths.
Characteristic Impedance	50Ω (single-ended), 100Ω (differential); matches standard HSTL-18/15 trace routing and driver output impedance.
Cutoff Frequency	700MHz (3dB point); supports reliable operation up to 200MHz fundamental clock with low group delay distortion.
Insertion Loss	3.1dB (at 200MHz, Z_LOAD >> Z_SOURCE); preserves signal amplitude integrity in source-terminated topologies.
Input/Output Return Loss	≥12dB / ≥15dB (50MHz–1GHz); minimizes reflections on high-speed clock traces.
Operating Temperature	-40°C to +85°C; qualified for industrial-grade memory subsystems without derating.

Pinout & Package

MAX3620CETT is housed in a 6-pin Thin Dual Flat No-lead (TDFN) package measuring 3mm × 3mm × 0.8mm with an exposed thermal pad (EP) that must be connected to COMMON potential. The package uses JEDEC MO229 / WEEA compliant outline T633-2 and supports reflow soldering per IPC/JEDEC J-STD-020.

Pin/Terminal	Circuit Role	Design Meaning
1 (IN1)	Single-ended input channel 1	Accepts HSTL clock signal; bidirectional-may serve as output if driven from opposite side.
2 (COMMON)	Reference ground/common node	Shared return path for both channels; EP must be soldered to same net for thermal and signal integrity.
3 (IN2)	Single-ended input channel 2	Independent second input; electrically isolated from IN1 but matched in delay and impedance.
4 (OUT2)	Single-ended output channel 2	Delivers delayed copy of IN2 signal; identical electrical behavior to OUT1.
5 (COMMON)	Reference ground/common node	Duplicate COMMON pin for layout symmetry and low-inductance grounding.
6 (OUT1)	Single-ended output channel 1	Delivers 1.25ns delayed version of IN1; used for 90° or 270° clock phase synthesis.

Key Features

Feature	Design Value
All-passive LC transmission-line structure	Zero power consumption, no DC bias required, and immunity to supply noise-ideal for low-power clock trees.
HSTL source-termination compatibility	Optimized for use with HSTL drivers driving unterminated loads, eliminating need for parallel termination resistors.
Dual independent 1.25ns delay paths	Enables simultaneous generation of two phase-shifted clocks (e.g., 0°/90° and 180°/270°) from one device.
±20ps inter-channel delay matching	Ensures deterministic skew control critical for QDR II read/write strobe timing and multiphase sampling.
3mm × 3mm TDFN with exposed pad	Minimizes board space and parasitic inductance while enabling efficient heat dissipation in dense memory modules.

Applications

QDR II SRAM Clock Distribution	Multiphase Clock Generation
Use Scenario: Distributing synchronized clock edges to QDR II SRAM devices with strict setup/hold timing windows. IC Role / Device Role / Timing Role: Passive delay element generating precise 90° and 270° clock phases from master 0°/180° inputs. Use Value: Eliminates FPGA-based phase interpolation or PLL-based solutions, reducing jitter accumulation and BOM count.	Use Scenario: Creating four-phase non-overlapping clocks for high-speed ADC/DAC sampling or digital beamforming. IC Role / Device Role / Timing Role: Dual-path fixed-delay block delivering matched 1.25ns offsets for quadrature clock synthesis. Use Value: Achieves sub-100ps channel-to-channel skew without calibration or feedback loops-critical for coherent signal processing.
Memory Interface Timing Calibration	HSTL-Based High-Speed Interconnect
Use Scenario: Compensating for PCB trace length mismatches between memory controller and multiple QDR II chips. IC Role / Device Role / Timing Role: Programmable-free, zero-drift analog delay compensator placed inline on clock nets. Use Value: Provides deterministic, temperature-stable delay correction without software overhead or dynamic adjustment latency.	Use Scenario: Driving long-point-to-point HSTL clock traces in telecom baseband or FPGA mezzanine cards. IC Role / Device Role / Timing Role: Impedance-matched passive buffer/delay stage preserving signal integrity over 50Ω microstrips. Use Value: Maintains >12dB return loss up to 1GHz, suppressing reflections that cause duty-cycle distortion or jitter.

QDR II SRAM Clock Distribution

Multiphase Clock Generation

Use Scenario: Distributing synchronized clock edges to QDR II SRAM devices with strict setup/hold timing windows.

IC Role / Device Role / Timing Role: Passive delay element generating precise 90° and 270° clock phases from master 0°/180° inputs.

Use Value: Eliminates FPGA-based phase interpolation or PLL-based solutions, reducing jitter accumulation and BOM count.

Use Scenario: Creating four-phase non-overlapping clocks for high-speed ADC/DAC sampling or digital beamforming.

IC Role / Device Role / Timing Role: Dual-path fixed-delay block delivering matched 1.25ns offsets for quadrature clock synthesis.

Use Value: Achieves sub-100ps channel-to-channel skew without calibration or feedback loops-critical for coherent signal processing.

Memory Interface Timing Calibration

HSTL-Based High-Speed Interconnect

Use Scenario: Compensating for PCB trace length mismatches between memory controller and multiple QDR II chips.

IC Role / Device Role / Timing Role: Programmable-free, zero-drift analog delay compensator placed inline on clock nets.

Use Value: Provides deterministic, temperature-stable delay correction without software overhead or dynamic adjustment latency.

Use Scenario: Driving long-point-to-point HSTL clock traces in telecom baseband or FPGA mezzanine cards.

IC Role / Device Role / Timing Role: Impedance-matched passive buffer/delay stage preserving signal integrity over 50Ω microstrips.

Use Value: Maintains >12dB return loss up to 1GHz, suppressing reflections that cause duty-cycle distortion or jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar passive delay line applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MAX3620BETT	1.00ns nominal delay (0.90–1.10ns), 2.1dB insertion loss, 620MHz cutoff	Better suited for lower-frequency QDR I or reduced-skew 100MHz systems	Select when 1.00ns delay meets timing budget and lower insertion loss is prioritized over phase resolution.
MAX3620DETT	1.50ns nominal delay (1.40–1.60ns), 2.2dB insertion loss, 300MHz cutoff	Targeted at slower QDRII+ or legacy DDR2 clock trees needing longer phase offsets	Choose when 1.50ns delay is required and system bandwidth is limited to ≤167MHz clock rates.

Compared with MAX3620BETT and MAX3620DETT, the MAX3620CETT provides optimal balance for 200MHz QDRII systems: its 1.25ns delay enables exact quarter-cycle phasing, its 700MHz bandwidth accommodates fast edge rates, and its ±20ps matching ensures robust timing margin across temperature.

Availability

MAX3620CETT is available at Aetrix Electronics and suitable for QDR II memory subsystems, multiphase clock generators, and HSTL-based high-speed interconnects requiring stable component supply, guaranteed lead-time visibility, and full traceability.

Supply support for MAX3620CETT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and high-speed timing ICs for industrial, communications, and computing applications.

The MAX3620 series was developed specifically for deterministic, low-jitter clock phase generation in QDR/QDRII synchronous memory interfaces-replacing active solutions with passive, power-free delay elements.

FAQ

What is the exact delay value specified for MAX3620CETT, and how is it tested?

The MAX3620CETT is specified for a nominal delay of 1.25ns, with a guaranteed range of 1.15ns to 1.35ns under defined test conditions: 50Ω source and load impedance, ≤1pF capacitance, and 300ps input transition time. This value is measured differentially across each channel (IN1→OUT1 and IN2→OUT2) using calibrated high-bandwidth oscilloscopes and vector network analyzers per Maxim's production test flow. The MAX3620CETT delay remains stable across -40°C to +85°C with <±5ps variation.

Can MAX3620CETT be used in differential mode, and what are the connection requirements?

Yes, the MAX3620CETT supports differential operation: connect IN1 and IN2 as complementary inputs, tie both COMMON pins to system ground, and treat OUT1 and OUT2 as complementary outputs. The device's symmetrical 100Ω differential impedance ensures proper common-mode rejection and phase matching. No external termination is needed at the receiver since the MAX3620CETT is designed for source-terminated HSTL topologies. Differential use preserves the ±20ps delay matching inherent to the MAX3620CETT.

Does MAX3620CETT require a power supply or DC bias?

No, the MAX3620CETT is a fully passive device constructed from integrated LC transmission-line sections and requires no power supply, DC bias, or enable signals. It operates purely through electromagnetic wave propagation along its internal structure. This eliminates supply noise coupling, simplifies PCB layout, and guarantees zero static power consumption-key advantages of the MAX3620CETT over active delay ICs or PLL-based alternatives.

How does MAX3620CETT handle load capacitance variations in real-world layouts?

The MAX3620CETT delay shifts predictably with load capacitance: typical variation is <±0.05ns per 1pF change when R_LOAD = 20kΩ, as characterized in Figure MAX3620 toc04. For designs with ≤5pF total load capacitance (including trace and receiver input), delay deviation stays within ±0.10ns of nominal-well within the MAX3620CETT's 0.20ns tolerance window. Layout best practices (short traces, controlled impedance) ensure MAX3620CETT maintains its specified 1.25ns accuracy.

Is the exposed pad (EP) on MAX3620CETT electrically connected, and how must it be handled?

Yes, the exposed pad (EP) on the MAX3620CETT is internally connected to the COMMON net and must be soldered to the same potential-typically system ground-as pins 2 and 5. Leaving EP floating degrades thermal performance, increases junction temperature, and may cause return-loss degradation above 500MHz. Maxim specifies a minimum 4×4 array of thermal vias under the EP connected to an inner ground plane to ensure reliable MAX3620CETT operation in continuous high-frequency use.

MAX3620CETT Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc./Maxim Integrated

Series:: -

Package/Case:: 6-WDFN Exposed Pad

Packaging:: Bulk

Product Status:: Active

Number of Taps/Steps:: -

Function:: Multiple

Delay to 1st Tap:: -

Tap Increment:: -

Available Total Delays:: 1.25ns

Number of Independent Delays:: 2

Voltage - Supply:: -1.5V ~ 1.5V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-TDFN (3x3)

MAX3620CETT FAQ

1.How can I place an order for MAX3620CETT through Aetrix?

Please submit a Request for Quotation (RFQ) for MAX3620CETT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MAX3620CETT reliable?

The price and inventory of MAX3620CETT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX3620CETT is usually 5 days.

3.What payment methods are accepted for MAX3620CETT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX3620CETT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MAX3620CETT?

MAX3620CETT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MAX3620CETT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MAX3620CETT?

For technical support, including MAX3620CETT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX3620CETT requirements.

6.How does Aetrix verify that MAX3620CETT is sourced from the original manufacturer or authorized distributors?

All MAX3620CETT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX3620CETT meets industry standards.

7.What is the process for return or replacement of MAX3620CETT?

All MAX3620CETT units undergo pre-shipment inspection (PSI). If there is an issue with MAX3620CETT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MAX3620CETT part is unused and in its original packaging.

Return procedure for MAX3620CETT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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