Analog Devices Inc./Maxim Integrated MAX4674EGP

Overview

MAX4674EGP from Maxim Integrated is a low-voltage, quad 2:1 analog multiplexer/demultiplexer IC operating from a single +1.8V to +5.5V supply. It delivers 4Ω max on-resistance at +5V, 0.4Ω max R_ON matching between channels, and 18ns max turn-on time. It is used in high-fidelity audio routing and low-voltage data-acquisition systems where rail-to-rail signal handling and low crosstalk are critical.

For engineers reviewing the MAX4674EGP datasheet, MAX4674EGP pinout, MAX4674EGP application, or MAX4674EGP equivalent, key selection criteria include guaranteed R_ON flatness (±0.8Ω), -114dB crosstalk at 1MHz, break-before-make timing (1ns), TTL/CMOS logic compatibility, and QFN-EP package thermal performance for dense PCB layouts.

Technical Context

The MAX4674EGP implements four independent bidirectional 2:1 analog switches controlled by a single address input (A0) and an active-low enable (EN). Each switch features matched CMOS transmission gates with internal ESD protection diodes tied to V+ and GND, enabling robust overvoltage tolerance up to ±0.3V beyond rails.

Its digital interface supports mixed-voltage operation: A0 and EN accept 5V logic signals even when V+ = +3.3V, while logic thresholds scale with supply voltage (VIH = 2.4V at +5V, 2.0V at +3V). Break-before-make switching prevents momentary shorting during channel transitions, critical for relay-replacement applications.

Key Specifications

Pinout & Package

MAX4674EGP uses a 20-pin QFN-EP (4mm × 4mm, 0.9mm height) with exposed pad for enhanced thermal dissipation. The package is RoHS-compliant and optimized for automated assembly.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar analog multiplexer applications.

Compared with ADG1414BRUZ and TS5A23157DCUR, MAX4674EGP offers superior thermal management via its 20-pin QFN-EP package, tighter R_ON matching (0.4Ω vs. ≥1.2Ω), and integrated enable control-making it optimal for high-channel-count, thermally constrained, or safety-critical multiplexing.

Availability

MAX4674EGP is available at Aetrix Electronics and suitable for audio signal routing, low-voltage data-acquisition systems, and communications circuit switching requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MAX4674EGP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for industrial, automotive, and communications markets.

The MAX4674EGP belongs to Maxim's high-performance analog switch family, engineered for low-R_ON, fast switching, and rail-to-rail operation in space-constrained, low-power systems.

FAQ

What is the maximum supply voltage rating for MAX4674EGP?

The absolute maximum supply voltage (V+) for MAX4674EGP is +6V. However, the recommended operating range is +1.8V to +5.5V. Exceeding +6V risks permanent damage due to internal ESD diode breakdown. Operation at +5.5V is fully characterized and guarantees 4Ω max R_ON, while +6V stress is strictly limited to absolute maximum ratings and not supported for functional operation. Always observe proper power sequencing: apply V+ before logic or analog signals.

Does MAX4674EGP support bidirectional signal flow?

Yes, MAX4674EGP supports fully bidirectional analog signal flow on all COM, NO, and NC terminals. Each of its four 2:1 switches operates identically in either direction, with identical R_ON, leakage, and capacitance specifications regardless of signal polarity or direction. This enables flexible use in both multiplexer (COM → NO/NC) and demultiplexer (NO/NC → COM) configurations without performance degradation.

How does the exposed pad (EP) on MAX4674EGP affect thermal performance?

The exposed pad on MAX4674EGP must be soldered to a PCB ground plane to achieve rated thermal performance. With EP connected to GND, the device achieves 20mW/°C derating above +70°C (1600mW total at +70°C). Omitting EP connection degrades thermal resistance by >40%, risking junction temperature exceedance under 100mA continuous load. Thermal vias under the pad are strongly recommended for high-reliability applications.

Can MAX4674EGP operate with 3.3V logic while powered from a 1.8V supply?

No. MAX4674EGP requires V+ to be ≥1.8V, but its digital inputs (A0, EN) have logic thresholds that scale with V+. At V+ = +1.8V, VIH is ~0.8V and VIL is ~0.4V - insufficient for reliable 3.3V logic recognition. For 3.3V logic compatibility, V+ must be ≥2.7V (guaranteeing VIH ≥2.0V). The device supports mixed-voltage operation only when V+ ≥2.7V and logic signals are ≤V+ +0.3V (max +5.5V).

What is the guaranteed break-before-make interval for MAX4674EGP?

The guaranteed break-before-make (BBM) interval for MAX4674EGP is 1ns maximum across the full temperature range (-40°C to +85°C). This specification ensures no overlap between the turn-off of one channel and turn-on of another during address changes, preventing momentary shorts in relay-replacement or signal-routing applications. BBM is measured under standard test conditions (V+ = +5V, RL = 100Ω, CL = 35pF) and is independent of A0 transition rate.