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Analog Devices Inc./Maxim Integrated MAX4751EGE+
- Part No.:
- MAX4751EGE+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 16-VFQFN Exposed Pad
- Datasheet:
-
MAX4751EGE+.pdf
- Description:
- IC SW SPST-NOX4 900MOHM 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:372
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Product details
Overview
MAX4751EGE+ from Maxim Integrated is a low-voltage, quad single-pole/single-throw (SPST) analog switch with 0.9Ω max on-resistance at +3V supply, 30ns turn-on time, and rail-to-rail signal handling capability. It features four normally open (NO) switches, operates from +1.6V to +3.6V single supply, and is used in battery-powered audio routing and low-voltage data-acquisition systems.
For engineers reviewing the MAX4751EGE+ datasheet, MAX4751EGE+ pinout, MAX4751EGE+ application, or MAX4751EGE+ equivalent, key selection criteria include on-resistance matching (0.12Ω max), leakage current (<5nA), CMOS-compatible logic inputs at +3V, and QFN-EP package thermal performance for portable designs.
Technical Context
The MAX4751EGE+ uses CMOS architecture to support bidirectional analog signal routing across its four NO channels, with guaranteed RON flatness of 0.1Ω max over the full 0–V+ signal range at +3V supply. Its break-before-make behavior is absent-only the MAX4753 variant includes this feature.
Switching is controlled by four independent 1.8V-tolerant CMOS inputs (VIH = 1.4V min, VIL = 0.5V max), enabling direct interface with low-voltage microcontrollers. All analog terminals (COM/NO) handle ±100mA continuous current and tolerate signals from GND to V+, with internal diode clamping limiting voltage excursions beyond absolute maximum ratings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| On-resistance (RON) | 0.9Ω max at +3V supply - enables <10mV drop at 10mA signal current, critical for precision low-voltage sensing |
| RON matching | 0.12Ω max at +3V - ensures channel-to-channel gain consistency in multi-path signal routing |
| Turn-on time (tON) | 30ns max - supports >10MHz digital control timing in high-speed multiplexing applications |
| Off-leakage current | ±5nA max at TMAX - preserves signal integrity in high-impedance sensor front-ends |
| Supply range | +1.6V to +3.6V - compatible with Li-ion, coin-cell, and regulated 1.8V/3.3V rails without level shifting |
| Logic compatibility | 1.8V CMOS input threshold at +3V supply - interfaces directly with modern low-voltage MCUs |
| Package | 16-pin QFN-EP (3mm × 3mm) - provides 16.9W/°C thermal derating and low-inductance ground path via exposed pad |
Pinout & Package
MAX4751EGE+ is housed in a 16-pin QFN-EP (3mm × 3mm) package with exposed thermal pad (EP) that must be soldered to PCB ground for optimal thermal and electrical performance. Pin 1 is located at top-left corner adjacent to notch marking; EP connects internally to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 7, 11, 15 | NO1, NO2, NO3, NO4 | Normally open analog switch terminals - connect only when corresponding INx is HIGH; no DC path to COM when OFF |
| 2, 8, 9, 16 | COM1, COM2, COM3, COM4 | Common analog ports - bidirectional signal path between COM and associated NO terminal |
| 4, 5, 12, 13 | IN1, IN2, IN3, IN4 | Digital control inputs - TTL/CMOS-compatible; drive NO-COM path ON when HIGH (≥1.4V) |
| 6 | GND | Analog/digital reference ground - must be low-impedance connection; ties to EP for thermal management |
| 14 | V+ | Positive supply input - accepts +1.6V to +3.6V; requires 0.1µF bypass capacitor to GND near pin |
| 3, 10 | N.C. | No internal connection - left floating or tied to GND per layout best practice; no electrical function |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail analog signal handling | Supports 0V to V+ input range without distortion - eliminates need for external level-shifting in portable audio paths |
| Ultra-low quiescent power | <1µW at +3V - extends battery life in always-on sensor monitoring and sleep-mode signal routing |
| High current capacity | ±100mA continuous per channel - enables direct switching of audio drivers, ADC references, and DAC outputs |
| Low charge injection | 21pC max - minimizes voltage glitch on high-impedance nodes during switching, preserving measurement accuracy |
| Low off-capacitance | 31pF (NO/NC), 30pF (COM) - maintains >65dB off-isolation up to 10MHz for RF-adjacent signal routing |
Applications
| Portable Audio Routing | Battery-Powered Data Acquisition |
|---|---|
|
Use Scenario: Switching microphone inputs, headphone outputs, and line-level signals in smartphones and wearables. IC Role / Device Role / Timing Role: Quad SPST analog switch providing isolated signal paths between codecs, amplifiers, and sensors. Use Value: 0.9Ω RON and 30ns tON enable clean audio pass-through with <0.031% THD and minimal latency. |
Use Scenario: Multiplexing multiple sensor outputs (thermocouples, RTDs, strain gauges) into a shared ADC channel. IC Role / Device Role / Timing Role: Low-leakage analog switch isolating high-impedance sensor nodes during channel scanning. Use Value: ±5nA off-leakage and 0.1Ω RON flatness preserve µV-level signal fidelity across temperature ranges. |
| Low-Voltage Power Path Control | PCMCIA/CompactFlash Interface Switching |
|
Use Scenario: Enabling/disabling power to peripheral modules (GPS, BLE, display backlight) in ultra-low-power IoT edge devices. IC Role / Device Role / Timing Role: Normally open switch controlling 1.8V/3.3V supply rails with fast enable/disable sequencing. Use Value: 1.6V–3.6V operation and <1µW quiescent power allow direct integration into energy-harvesting power domains. |
Use Scenario: Isolating host controller I/O lines from PCMCIA card slots during hot-plug events and voltage domain transitions. IC Role / Device Role / Timing Role: Signal-level protection switch decoupling 3.3V host logic from variable-card voltage domains. Use Value: 1.8V CMOS-compatible inputs and rail-to-rail analog tolerance prevent latch-up during mixed-supply handshaking. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad SPST analog switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX4751EUD+ | Same electrical specs, but in 14-pin TSSOP package - lacks exposed thermal pad and has higher thermal resistance (9.1W/°C vs. 16.9W/°C) | Suitable for space-constrained boards where QFN reflow is not available; lower current density limits sustained 100mA operation | Select when legacy TSSOP footprint compatibility or simplified assembly outweighs thermal performance needs |
| TMUX1574RTER | 0.5Ω RON at 3.3V, 25ns tON, but requires ≥1.08V logic high; no guaranteed RON matching spec; 16-QFN same footprint | Better RON/tON for high-fidelity audio, but tighter VIH margin increases risk of incomplete turn-on with marginal MCU outputs | Choose only if system guarantees ≥1.2V logic high and prioritizes lowest possible on-resistance over guaranteed matching |
Compared with MAX4751EUD+ and TMUX1574RTER, the MAX4751EGE+ delivers superior thermal management via its QFN-EP package and guaranteed 0.12Ω RON matching-critical for precision multi-channel instrumentation where channel uniformity affects calibration stability.
Availability
MAX4751EGE+ is available at Aetrix Electronics and suitable for portable audio routing, battery-powered data acquisition, and low-voltage power path control requiring stable component supply across industrial, medical, and consumer design cycles.
Supply support for MAX4751EGE+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power-management ICs for demanding industrial, automotive, and communications applications.
The MAX4751EGE+ belongs to Maxim's low-voltage analog switch product line, engineered specifically for rail-to-rail signal integrity and ultra-low power consumption in portable and energy-sensitive systems.
FAQ
What is the maximum analog signal voltage range supported by the MAX4751EGE+?
The MAX4751EGE+ supports rail-to-rail analog signals from GND to V+, with V+ operating from +1.6V to +3.6V. At +3V supply, it handles 0V to +3V signals without degradation in on-resistance or increased distortion. This allows direct interfacing with sensors, audio codecs, and ADCs without external level-shifting circuitry. The MAX4751EGE+ internal CMOS structure ensures consistent performance across the full voltage range.
Does the MAX4751EGE+ support break-before-make switching?
No, the MAX4751EGE+ does not support break-before-make (BBM) switching. BBM is exclusive to the MAX4753 variant in the family, which integrates two NO and two NC switches with guaranteed 2ns BBM timing. The MAX4751EGE+ implements four normally open (NO) switches only, with simultaneous ON/OFF transitions per channel. Designers requiring BBM must select MAX4753EGE+ instead of MAX4751EGE+.
What is the recommended PCB layout practice for the exposed pad (EP) on the MAX4751EGE+ QFN package?
The exposed pad (EP) on the MAX4751EGE+ must be soldered to a solid PCB ground plane using ≥4 thermal vias (0.3mm diameter) spaced evenly beneath the pad. This ensures both thermal dissipation (1349mW max at +70°C) and low-impedance grounding for analog signal integrity. Leaving EP unconnected or floating degrades RON stability, increases crosstalk, and risks thermal shutdown under sustained 100mA load. The MAX4751EGE+ datasheet specifies EP as GND-connected in all functional diagrams.
Can the MAX4751EGE+ operate reliably with a +1.8V supply, and how do key parameters change?
Yes, the MAX4751EGE+ operates across +1.6V to +3.6V, including +1.8V. At +1.8V, RON increases to 2.5Ω max (vs. 0.9Ω at +3V), tON/tOFF extend to 35ns/30ns max, and RON matching degrades to 0.25Ω max. However, VIH/VIL thresholds scale to +1.0V/+0.4V, maintaining robust logic interface. These shifts are fully characterized in the +1.8V Electrical Characteristics table - the MAX4751EGE+ remains functional and specified across the entire range.
How does the MAX4751EGE+ handle overvoltage conditions on analog pins?
The MAX4751EGE+ includes internal ESD diodes that clamp analog pins (COM/NO/NC) to GND and V+, limiting voltage excursions to –0.3V and V+ + 0.3V. Sustained overvoltage beyond these limits risks permanent damage. For systems where analog signals may exceed rails (e.g., hot-plug interfaces), Maxim recommends adding two external series diodes (D1, D2) on V+ as shown in Figure 5 - this protects the MAX4751EGE+ while preserving its 0.9Ω RON and low-leakage performance.
MAX4751EGE+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Switch Circuit:
- SPST - NO
- Multiplexer/Demultiplexer Circuit:
- 1:1
- Number of Circuits:
- 4
- On-State Resistance (Max):
- 900mOhm
- Channel-to-Channel Matching (ΔRon):
- 30mOhm
- Voltage - Supply, Single (V+):
- 1.6V ~ 3.6V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 85ns, 45ns
- -3db Bandwidth:
- 250MHz
- Charge Injection:
- 9pC
- Channel Capacitance (CS(off), CD(off)):
- 20pF, 20pF
- Current - Leakage (IS(off)) (Max):
- 100pA
- Crosstalk:
- -84dB @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (3x3)
MAX4751EGE+ FAQ
1.How can I place an order for MAX4751EGE+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX4751EGE+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX4751EGE+ reliable?
The price and inventory of MAX4751EGE+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX4751EGE+ is usually 5 days.
3.What payment methods are accepted for MAX4751EGE+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX4751EGE+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX4751EGE+?
MAX4751EGE+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX4751EGE+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX4751EGE+?
For technical support, including MAX4751EGE+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX4751EGE+ requirements.
6.How does Aetrix verify that MAX4751EGE+ is sourced from the original manufacturer or authorized distributors?
All MAX4751EGE+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX4751EGE+ meets industry standards.
7.What is the process for return or replacement of MAX4751EGE+?
All MAX4751EGE+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX4751EGE+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX4751EGE+ part is unused and in its original packaging.
Return procedure for MAX4751EGE+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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