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Analog Devices Inc./Maxim Integrated MAX4947ETG+
- Part No.:
- MAX4947ETG+
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Package:
- 24-WFQFN Exposed Pad
- Datasheet:
-
MAX4947ETG+.pdf
- Description:
- IC SWITCH DPDT X 3 5.5OHM 24TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,753
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Product details
Overview
MAX4947ETG+ from Maxim Integrated is a hex single-pole/double-throw (SPDT) analog switch IC operating from a single +1.8V to +5.5V supply, featuring 4Ω typical on-resistance, 30pF typical off-capacitance, and 300MHz -3dB bandwidth - optimized for high-speed SDIO, USB, and UART signal routing in portable electronics.
For engineers reviewing the MAX4947ETG+ datasheet, MAX4947ETG+ pinout, MAX4947ETG+ application, or MAX4947ETG+ equivalent, key selection criteria include rail-to-rail signal handling, break-before-make timing (2ns), low charge injection (10pC), and compatibility with 24-pin TQFN-EP (4mm × 4mm) PCB layouts.
Technical Context
The MAX4947ETG+ implements six independent SPDT switches controlled by a single digital logic input (CB) and an enable input (EN), supporting bidirectional analog signal routing with guaranteed 4Ω on-resistance across the full ±100mA channel current range and 0–VCC signal swing.
Its architecture delivers 2ns break-before-make interval, 0.2ns channel-to-channel skew, and -70dB off-isolation at 1MHz - enabling clean signal path switching in multi-interface systems without crosstalk-induced data corruption or timing jitter.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | +1.8V to +5.5V - supports direct interface with 1.8V, 2.7V, 3.3V, and 5V logic and analog domains without level shifting. |
| On-Resistance (typ) | 4Ω - minimizes voltage drop and power loss in high-current signal paths (e.g., SDIO DAT lines carrying >50mA). |
| Off-Capacitance (NO/NC) | 15pF - preserves signal integrity above 100MHz by limiting capacitive loading on high-speed data lines. |
| -3dB Bandwidth | 300MHz - enables reliable switching of USB 1.1 (12Mbps), UART up to 25Mbps, and SDIO clock signals (≤25MHz). |
| Turn-On/Off Time | 400–800ns - ensures sub-microsecond switching latency compatible with burst-mode memory and peripheral handshaking. |
| Break-Before-Make | 2ns - prevents momentary short-circuit between NO and NC paths during state transitions, critical for glitch-free bus arbitration. |
| Off-Isolation | -70dB at 1MHz - suppresses coupling between active and inactive channels, essential for multiplexed sensor or audio signal routing. |
Pinout & Package
MAX4947ETG+ uses a 24-pin TQFN-EP package (4mm × 4mm, 0.5mm pitch) with exposed thermal pad connected to GND. Pin numbering follows standard top-view orientation with EP centered beneath the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1–5, 7–12, 15–20, 22–24 | Analog I/O (NO1–NO6, NC1–NC6, COM1–COM6) | Hex SPDT switch terminals - bidirectional, rail-to-rail capable; COM pins serve as common signal ports, NO/NC as selectable output paths. |
| 6, 21 | GND | Ground reference for analog and digital domains; must be low-impedance connection to minimize noise coupling. |
| 22 | VCC | Single positive supply input (1.8V–5.5V); requires local 0.1µF bypass capacitor to GND per layout guidelines. |
| 5, 13, 14 | CB56 / CB34 / CB12 | Digital control inputs - each pair controls two SPDT switches (e.g., CB12 selects COM1/COM2 path direction); CMOS-compatible thresholds (VIH = 1.6V, VIL = 0.5V). |
| - | EN (not present on MAX4947ETG+) | Not implemented - MAX4947ETG+ lacks EN pin; control is exclusively via CBx inputs (distinct from MAX4948ETG+). |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail signal handling | Supports analog signals from GND to VCC without clipping - enables direct interface with unbuffered SDIO, UART, and USB D+/D− lines. |
| Low 10pC charge injection | Minimizes voltage glitch on COM node during switching - critical for precision ADC/DAC multiplexing and touch-screen signal routing. |
| Guaranteed 4Ω on-resistance | Ensures consistent insertion loss ≤0.1dB across all six channels at 3.3V - maintains signal amplitude integrity in high-speed data buses. |
| 25°C temperature-stable RON flatness | ±1.2Ω variation over 0–VCC analog range - eliminates gain error in sensor signal conditioning paths using switched gain networks. |
| High off-isolation (-70dB) | Prevents signal bleed-through between active and idle channels - required for simultaneous operation of multiple peripherals sharing a common bus. |
Applications
| SDIO/Memory Stick Multiplexing | USB 1.1 Signal Switching |
|---|---|
|
Use Scenario: Sharing a single SDIO host controller between dual memory cards (e.g., microSD + Memory Stick) in smartphones or tablets. IC Role / Device Role / Timing Role: Hex SPDT switch routes CMD, CLK, and DAT0–DAT3 lines between host and either card under firmware control. Use Value: Eliminates need for two separate SDIO controllers; 300MHz bandwidth supports 25MHz SD clock without attenuation or jitter. |
Use Scenario: Dynamic reconfiguration of USB D+ and D− lines between internal debug port and external USB connector in embedded test equipment. IC Role / Device Role / Timing Role: Bidirectional SPDT path selector enables hardware-controlled USB device/host mode switching without connector hot-swap limitations. Use Value: 4Ω RON and 15pF capacitance maintain USB 1.1 eye diagram integrity; 2ns BBM prevents bus contention during mode transition. |
| UART Interface Sharing | Cell Phone Baseband Signal Routing |
|
Use Scenario: Routing a single UART interface between GPS module, Bluetooth radio, and modem in compact mobile platforms. IC Role / Device Role / Timing Role: Six SPDT switches isolate TX/RX pairs and control lines (RTS/CTS) to prevent cross-talk and ground loops. Use Value: -90dB crosstalk ensures bit-error-free communication at 3Mbps; low leakage (<10nA) avoids false start-bit detection during idle states. |
Use Scenario: Signal path management between baseband processor, RF transceiver, and audio codec in GSM/WCDMA handsets. IC Role / Device Role / Timing Role: Analog switch routes I²S, PCM, and auxiliary audio lines while isolating unused paths during call setup or data transfer. Use Value: 30pF typical capacitance preserves audio bandwidth up to 20kHz; rail-to-rail operation supports 1.8V I²S logic without level shifters. |
Availability
MAX4947ETG+ is available at Aetrix Electronics and suitable for SDIO multiplexing, USB signal routing, UART interface sharing, and cellular baseband signal management requiring stable component supply across industrial and consumer production cycles.
Supply support for MAX4947ETG+ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Maxim Integrated (now part of Analog Devices) designs precision analog, mixed-signal, and power management ICs for demanding industrial, communications, and consumer applications.
The MAX4947ETG+ belongs to Maxim's high-speed analog switch product line, engineered specifically for low-distortion, low-latency signal routing in portable and battery-powered systems with strict size and power constraints.
FAQ
What is the function of the CB12, CB34, and CB56 pins on the MAX4947ETG+?
The CB12, CB34, and CB56 pins are dedicated digital control inputs that independently select the signal path for two SPDT switches each: CB12 controls COM1/COM2, CB34 controls COM3/COM4, and CB56 controls COM5/COM6. Driving CBx high connects COM_ to NO_, and driving it low connects COM_ to NC_. These pins operate with CMOS-compatible thresholds (VIH ≥ 1.6V, VIL ≤ 0.5V) and are valid only when the device is powered within its 1.8V–5.5V range. The MAX4947ETG+ does not include an EN pin - unlike the MAX4948ETG+, its switches are always enabled when powered.
Does the MAX4947ETG+ support rail-to-rail analog signal switching?
Yes, the MAX4947ETG+ supports true rail-to-rail analog signal switching across its full specified supply range (1.8V to 5.5V), meaning signals from GND to VCC can pass through the switch with minimal distortion or clipping. This capability is confirmed by the Electrical Characteristics table specifying an analog signal range of 0V to VCC and verified in Typical Operating Characteristics plots showing stable on-resistance over the entire 0–VCC voltage span at temperatures from -40°C to +85°C. The MAX4947ETG+ achieves this using a CMOS process with matched P/N transistor stacks, enabling bidirectional operation without external biasing.
What is the maximum continuous current rating per channel of the MAX4947ETG+?
The MAX4947ETG+ has a maximum continuous current rating of ±100mA per NO_, NC_, or COM_ terminal, as specified in the Absolute Maximum Ratings table. This rating applies across the full operating temperature range (-40°C to +85°C) and is supported by thermal design of the 24-pin TQFN-EP package, which provides 1667mW power dissipation at +70°C (derated by 20.8mW/°C above that temperature). Exceeding ±100mA may cause irreversible parametric shift or thermal shutdown; peak pulsed current up to ±300mA is allowed only at 10% duty cycle and 1ms pulse width.
How does the MAX4947ETG+ differ from the MAX4948ETG+ in terms of control interface?
The MAX4947ETG+ uses three independent control inputs (CB12, CB34, CB56) to manage its six SPDT switches in three paired groups, whereas the MAX4948ETG+ uses a single CB input plus a dedicated EN (enable) pin to globally activate or disable all six switches. The MAX4947ETG+ lacks an EN pin entirely - its switches are always active when powered and controlled solely via the three CB inputs. This architectural difference makes the MAX4947ETG+ suitable for applications requiring granular per-pair control (e.g., differential signal routing), while the MAX4948ETG+ favors simpler global on/off sequencing. Pin compatibility between the two is limited to shared analog I/O and power pins; CB and EN assignments are not interchangeable.
What package type is used by the MAX4947ETG+ and what are its key mechanical features?
The MAX4947ETG+ uses a 24-pin TQFN-EP (Thin Quad Flat No-lead with Exposed Pad) package measuring 4mm × 4mm with 0.5mm pin pitch. Its key mechanical features include an exposed thermal pad (EP) centered on the bottom surface, which must be soldered to a PCB copper pour tied to GND for optimal thermal performance and EMI suppression. The package complies with RoHS requirements (indicated by the "+" suffix) and supports standard lead-free reflow profiles up to 260°C. Land pattern requirements are defined in Maxim Application Note 90-0022, and the outline drawing is documented under package code T2444+4 (Outline No. 21-0139).
MAX4947ETG+ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc./Maxim Integrated
- Series:
- -
- Packaging:
- Tube
- Product Status:
- Active
- Switch Circuit:
- DPDT
- Multiplexer/Demultiplexer Circuit:
- 2:2
- Number of Circuits:
- 3
- On-State Resistance (Max):
- 5.5Ohm
- Channel-to-Channel Matching (ΔRon):
- 300mOhm
- Voltage - Supply, Single (V+):
- 1.8V ~ 5.5V
- Voltage - Supply, Dual (V±):
- -
- Switch Time (Ton, Toff) (Max):
- 800ns, 800ns
- -3db Bandwidth:
- 300MHz
- Charge Injection:
- 10pC
- Channel Capacitance (CS(off), CD(off)):
- 15pF
- Current - Leakage (IS(off)) (Max):
- 3nA
- Crosstalk:
- -90dB @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-TQFN (4x4)
MAX4947ETG+ FAQ
1.How can I place an order for MAX4947ETG+ through Aetrix?
Please submit a Request for Quotation (RFQ) for MAX4947ETG+ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MAX4947ETG+ reliable?
The price and inventory of MAX4947ETG+ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MAX4947ETG+ is usually 5 days.
3.What payment methods are accepted for MAX4947ETG+?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MAX4947ETG+ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MAX4947ETG+?
MAX4947ETG+ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MAX4947ETG+ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MAX4947ETG+?
For technical support, including MAX4947ETG+ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MAX4947ETG+ requirements.
6.How does Aetrix verify that MAX4947ETG+ is sourced from the original manufacturer or authorized distributors?
All MAX4947ETG+ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MAX4947ETG+ meets industry standards.
7.What is the process for return or replacement of MAX4947ETG+?
All MAX4947ETG+ units undergo pre-shipment inspection (PSI). If there is an issue with MAX4947ETG+, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MAX4947ETG+ part is unused and in its original packaging.
Return procedure for MAX4947ETG+:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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